• Journal of Technology Innovation
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• v.6 no.1
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• pp.128-162
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• 1998

A continuous development of new products is the lifeblood for firms that hope to maintain competency in competitive environments. Ongoing success in these environments is dependent on whether the management can choose or can't chose the proper mix of new product development strategy, new product development process, and organizational structure. Rather than considering the interrelationship among these success factors, however, most previous studies of new products development have examined these issues individually. Moreover, because past research has been unidimensional in nature, there is a lack of knowledge about how new product development strategy, process, and structure could be linked up each other. Consequently, we have no complete perspective of the linkage among new product development strategy, process, structure, and performance. The purpose of this study is to examine the new product development strategy, process, and structure of firms, and explore the effect of each on performance as well as linkage among strategy, process, strategy and structure.

• Journal of Korean Society for Quality Management
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• v.37 no.3
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• pp.39-53
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• 2009

This paper suggests a new process structuring method, which we call process modularization, for decomposing and grouping activities in a process. Above all, we propose the concept of a module that is a group of activities positioned on the same flow before and after control constructs. Since activities in a module are relatively strongly interrelated with one another, it is important to take into consideration of these together. A design structure matrix (DSM) is used to structure the process because it has a lot of advantages in process modeling and analysis. We developed two algorithms: the restricted topological sorting (RTS) algorithm for ordering activities and the module finding (MF) algorithm for detecting modules in a process, which utilize the DSM. The suggested approach enables a firm's manager to design and analyze the process effectively. We also developed a supporting tool to accelerate the progress of process modularization. The supporting tool aids the process manager in finding the module and understanding the process structure easily. An illustrative example is addressed to show operations of the suggested approach.

• Journal of the Korean Home Economics Association
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• v.19 no.4
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• pp.73-84
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• 1981

The purpose of this study was to examine the conjugal role structure in the purchasing decision process : problem precognition, information seeking and evaluating, final decision, and actually making the purchase, through a survey of the degree of conjugal involvement. The specific objectives were 1) to examine the conjugal role structure and differences at each phase of the decision process in purchasing of residence and twelve durable household consumer goods, 2) to determine the differences between conjugal role structure in each phase of the purchasing decision process and conjugal demographic factors(number of years married, conjugal education level, conjugal occupation, and income). Questionnaires were given to randomly selected husbands and wives in /seoul I October, 1980. data from the 275 responses were analyzed by percentage, mean, and F-test(analysis of variance). The results are as follows : 1) The conjugal role structure for the purchasing decision process of residence and twelve durable household consumer goods was analyzed by percent. It was found that role structure was specialized by the type of item. for instance, furniture and home appliances were purchased by wives; amusement goods and cars were purchased by husbands' and residence was purchased by joint. However, conjugal role structure in the purchasing decision process differed by phased of process : (1) Wives involvement in the phase of problem recognition was greater than their involvement in information seeking and evaluating, but husbands' involvement a in the phase of information seeking and evaluating was slightly greater than their involvement in problem recognition. (2) Husbands' involvement in the phase of making the final decision was far greater than their involvement I information seeking and evaluating. (3) Wives' involvement in the actually making of the purchase was far greater than their involvement in making the final decision. 2) Only one among conjugal demographic factors was significantly related to conjugal role structure. That, is, conjugal role structure in the purchasing decision process showed that the wives' involvement I making the final decision and in actually making the purchase increased with number of years married.

• Structural Engineering and Mechanics
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• v.59 no.5
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• pp.821-840
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• 2016

A simple design process is proposed for supplemental viscous dampers based on structural safety redundancy. In this process, the safety redundancy of the primary structure without a damper is assessed by the capacity and response spectra. The required damping ratio that should be provided by the supplemental dampers is estimated by taking the structural safety redundancy as a design target. The arrangement of dampers is determined according to the drift distribution obtained by performing pushover analysis. A benchmark model is used to illustrate and verify the validity of this design process. The results show that the structural safety redundancy of the structure provided by the viscous dampers increases to approximately twice that of the structure without a damper and is close to the design target. Compared with the existing design methods, the proposed process can estimate the elastic-plastic response of a structure more easily by using static calculation, and determine the required damping ratio more directly without iterative calculation or graphical process. It can be concluded that the proposed process is simple and effective.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.123-124
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• 2005

We investigated the effect of a Ta/TaN Cu diffusion barrier existence on the reliability and the electrical performance of Cu dual-damascene interconnects. A high EM performance in Cu dual-damascene structure was observed the BCV(barrier contact via) interconnect structure to remain Ta/TaN barrier layer. Via resistance was decreased DCV interconnect structure by bottomless process. This structure considers that DCV interconnect structure has lower activation energy and higher current density than BCV interconnect structure. The EM failures by BCV via structure were formed at via hole, but DCV via structure was formed EM fail at the D2 line. In order to improve the EM characteristic of DCV interconnect structure by bottomless process, after Ta/TaN diffusion barrier layer in via bottom is removed by Ar+ resputtering process, it is desirable that Ta thickness is thickly made by Ta flash process.

• Research in Mathematical Education
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• v.19 no.1
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• pp.61-79
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• 2015

This study discussed about how pseudo-thinking process actually occurs in the mind of the students, used Piaget's frame work of the assimilation and accommodation process. The data collection is conducted using Think-Out-Loud (TOL) method. The study reveals that pseudo thinking process of covariational reasoning occurs originally from incomplete assimilation, incomplete accommodation process or both. Based on this, three models of incomplete thinking structure constructions are established: (1) Deviated thinking structure, (2) Incomplete thinking structure on assimilation process, and (3) Incomplete thinking structure on accommodation process.

• Journal of Korean Academy of Nursing
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• v.28 no.1
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• pp.17-25
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• 1998

This study was done to evaluate the quality of clinical nursing care using the variables of structure, process, and outcome and to analyze the relationship between the variables. This study also explored which variables are validating indicators to evaluate the quality of nursing care. The results analyzed by multiple regression showed that, generally structural variables did not contribute to the variance in outcome scores, but process variables of nursing care contributed significantly to the outcome variable of patient satisfaction. A combination of structure and process variables explained outcome variables more than structural variables alone. Also, patient satisfaction and hospital preference were significantly related to each other. Therefore, if nursing quality evaluation relies solely upon on structural variables such as number of available nurses and workload, it would be inaccurate because process variables of nursing care are strongly related to outcome variables and the two categories of structure and process variables helped to strengthen the relationships. Thus, it is important to focus on variables of structure, process, ant outcome together in evaluating nursing care quality.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.136-139
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• 2004

The requirement of planarity, such as with-in-wafer nonuniformity, post thickness range, have become increasingly stringent as critical dimensions of devices are decreased and a better control of a planarity become important. The key factors influencing the planarity capability of the CMP process have been well understood through numerous related experiments. These usually include parameters such as process pressures, relative velocities, slurry temperature, polishing pad materials and polishing head structure. Many study have been done about polishing pad and its groove structure because it's considered as one of the key factors which can decide wafer uniformity directly. But, not many study have been done about polisher head structure, especially about polisher head plate design. The purpose of this paper is to know how the plate structure can affect wafer uniformity and how to deteriorate wafer yield. Furthermore, we studied several new designed plate to improve wafer uniformity and also improve wafer yield.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.35 no.2
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• pp.29-36
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• 2019

Modular construction has benefits such as short construction duration and high productivity owing to the production in factory and owing to simultaneous on-site work. However, rework occurs in modular construction and the rework affects the efficiency of modular construction. The almost of causes of rework are exist in design process. To reduce the cause of rework, the information flow of the design process should be managed and the plan to reduce rework should be included. However, the modular construction has complex process because of impeded unit production so it is hard to manage the information flow in design process. Moreover, when the plan to reduce rework is included, the design process will be more complicated. Therefore, the objective of this research is to suggest the design process including the rework reduction plan and to alleviate the complexity of design process by using Dependency Structure Matrix(DSM). By using DSM, the iteration and feedback in design process is reduced and it can be expected that rework in modular project can be reduced by using suggested design process.