• Coupled systems mechanics
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• v.5 no.1
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• pp.21-39
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• 2016

Wastewater process models are the essential tools for understanding relevant aspects of wastewater treatment system. Wastewater process modeling provides more options for upgrades and better understanding of new plant design, as well as improvements of operational controls. The software packages (BioWin, GPS-X, Aqua designer, etc) solve a series of simulated equations simultaneously in order to propose several solutions for a specific facility. Research and implementation of wastewater process modeling in combination with computational fluid dynamics enable testing for improvements of flow characteristics for WWTP and at the same time exam biological, physical, and chemical characteristics of the flow. Application of WWTP models requires broad knowledge of the process and expertise in modeling. Therefore, an efficient and good modeling practice requires both experience and set of proper guidelines as a background.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.33-36
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for deep sub-micron technology. The rise throughput and the stability in the device fabrication can be obtained by applying of CMP process to STI structure in 0.18$\mu\textrm{m}$ m semiconductor device. The reverse moat process has been added to employ in of each thin films in STI-CMP was not equal, hence the devices must to be effected, that is, the damage was occurred in the device area for the case of excessive CMP process and the nitride film was remained on the device area for the case of insufficient CMP process, and than, these defects affect the device characteristics. Also, we studied the High Selectivity Slurry(HSS) to perform global planarization without reverse moat step.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.75-80
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• 1998

Process information is known to have the continuous distribution in many manufacturing processes. Generalized p-chart has been developed for controlling processes by classifying the information characteristics into several groups. But it is improper to describe continuous processes with the classified process informal ion, which is based on the classical set concept. Fuzzy control chart, has been developed for the control of linguistic data, but it is also based on the dichotomous notion of classical set theory. In this paper, fuzzy sampling method is studied in order to process the uncertain data properly. The method is incorporated with the fuzzy control chart. Statistical characteristics of the fuzzy representative value are utilized to device the fuzzy-statistical control chart. The fuzzy-statistical control chart is compared with the generalized p-chart and both the sensitivity to the process information distribution change pared robustiness against the noise on the process information of the fuzzy-statistical control chart are shown to be superior.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.49-53
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• 2013

Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.70-73
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• 2007

The forming characteristics of cup-rod combined extrusion process were investigated with process parameter change. Simultaneous forward rod extrusion and backward cup extrusion was conducted with magnesium alloy, AZ31B. Process parameters such as forward extrusion ratio, backward extrusion ratio, and working temperature were controlled in a specific region and the effects of the parameter change were examined. Surface crack was developed in a certain state of the process parameters combination. The crack-free forming limit of the alloy in the combined process was disclosed by the parameter study. The microstructures of the initial and extruded workpieces were observed.

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.964-969
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• 2014

In Super Junction MOSFET, Charge Balance is the most important issue of the trench filling Super Junction fabrication process. In order to achieve the best electrical characteristics, the N type and P type drift regions must be fully depleted when the drain bias approaches the breakdown voltage, called Charge Balance Condition. In this paper, two methods from the fabrication process were used at the Charge Balance condition: Trench angle decreasing process and Bottom implantation process. A lower on-resistance could be achieved using a lower trench angle. And a higher breakdown voltage could be achieved using the bottom implantation process. The electrical characteristics of manufactured discrete device chips are compared with those of the devices which are designed of TCAD simulation.

• Korean Institute of Interior Design Journal
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• no.18
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• pp.16-22
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• 1999

The purpose of this study is to analyze the drafting process by using AutoCAD for the basic course as well as to suggest the educational basic data of CAD in interior desigv. This research is to show not only practical use of CAD as a drafting tool function, but offering optimizing ways of AutoCAD command usage. The method used for this study is based on an analyzing of 6 types of total 98 types AutoCAD tutorial manual in CAD section of Kyobo book center. After the analysis of the AutoCAD command usage in creating floor plan, characteristics of drafting process is nearly the same as traditional drafting process. It means that traditional drafting process grafted on to computer aided drafting process. And the practical usage of AutoCAD command type is Draw, Modify, Format and View command in creating floor plav. That is emphasis on a specific functiov. Therefore, it should be developed basic course program which adapted various function of AutoCAD.

• Journal of Industrial Technology
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• v.33 no.A
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• pp.67-72
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• 2013

CNT(carbon nanotube) humidity sensors with plasma treated electrodes exhibit a much faster response time and a higher sensitivity to humidity, compared to untreated CNT and porous Cr electrodes. These results may be partially due to their percolated pore structure being more accessible for water molecules and for expending the diffusion of moisture to the polyimide sensing film, and partially due to the oxygenated surface of CNT films. This paper shows a plasma process effect and selectivity characteristics of CNT film humidity sensor.

• 전기의세계
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• v.19 no.6
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• pp.1-7
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• 1970

In this paper, to determine process dynamic characteristics, the correlation method for measuring the impulse response of process using a pseudo-random binary signal as the test signal instead of white noise was studied. The error caused by using the signal of Mesquence signal generator which was built up by the authors was analysed. Experments were performed on the 1st and 2nd order lag systems and the results were in good coincidence with theoretical values. It is expected that applying these results, it may be possible to develop a continuous measuring method adaptable to modern control systems.