• Electrical & Electronic Materials
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• v.9 no.8
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• pp.799-805
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• 1996

In short channel MOSFET, it is very important to establish optimal process conditions because of variation of device characteristics due to the process parameters. In this paper, we used process simulator and device characteristics caused by process parameter variation. From this simulation, it has been ' derived to the dependence relations between process parameters and device characteristics. The experimental result of fabricated short channel device according to the optimal process parameters demonstrate good device characteristics.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1611-1616
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• 2004

The objective of this study is to simulate the etching characteristics under different process parameters for the optimization of etching process. The etching characteristics such as the etching factor were investigated under different operating conditions and compared with the spray characteristics. The spray characteristics were measured by using Phase Doppler Anemometer. The correlation between the etching characteristics and the spray characteristics was analyzed to simulate the etching characteristics under the actual parameters of the etching process. The parameters were distance of nozzle tip and pipe pitch. To improve the uniformity and value of etching factor in the etching process, the process parameters should be designed optimally. The distribution of spray was simulated by the Monte-Carlo Method and the process parameters were optimized by the design of experiments(DOE).

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.4 s.247
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• pp.381-388
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• 2006

The objective of this study is to predict the etching characteristics using spray characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, uniformity were investigated on the actual operating conditions. The correlation between the etching characteristics and the spray ones obtained by measurement were analyzed to simulate the etching characteristics according to actual conditions of lead-frame etching process. These conditions of lead-frame process were spray pressure, distance from nozzle tip to substrate, pipe pitch, and nozzle pitch. To improve the etching characteristics in the lead-frame process, effects of the various operating conditions should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo method. The etching process model was coded by Java language. It was found that simulation results generally agreed well with the measured results of etching characteristics in lead-frame etching process. The optimal operating parameters were successfully found under variable conditions.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.72-79
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• 2006

The objective of this work is to simulate the etching characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, etching uniformity were investigated under different the actual operating conditions. The correlation between the etching characteristics and the spray ones were analyzed to simulate the etching characteristics in the etching process. To improve the etching characteristics in the etching process, effects of the various operating conditions such as pressure, distance from nozzle tip, pipe pitch, and feed speed should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo simulation. The etching process model was coded by Java language. It was found that the spray characteristics were correlated with the etching ones and simulation results generally agreed well with the measured results of etching characteristics in the etching process of Lead-Frame. The optimal operating parameters were successfully found under variable conditions.

• Korean Journal of Human Ecology
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• v.24 no.3
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• pp.451-461
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• 2015

It was the purpose of this study that propose architectural design process through analysis of concepts considering regional characteristics. The procedure of this study was as follows : First, classifying design process through investigating paper-survey and case studies. And We would investigate representation process of design concepts applied to design competitions entries. Finally, we would investigate design process applied to buildings in various districts. In the results, we could find that domestic architects were applying to site plan, floor plan, elevation plan, section plan and mass plan-led design process to express design concepts. And according to survey on buildings in various districts, we could verify that architects were applying various design process to express design concepts according to site characteristics. These results could help architects to design appropriately, according to site characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.236-239
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• 1995

In short channel MOSFET, it is very important to establish optimal process conditions because of variation of devise characteristics due to the process parameters. In this paper, we used process simulator and device simulator in order to optimize process parameter which changes of the device characteristics caused by process parameter variation. From this simulation, it has been derived to the dependence relations between process parameter and device characteristics. The experimental results of fabricated short channel device according to the optimal process parameters demonstrate good device characteristics.

• Proceedings of the Safety Management and Science Conference
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• 2004.11a
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• pp.69-79
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• 2004

Process capability indices are widely used in industries and quality assurance system. When designing the parameter on the multiple quality characteristics, there has been a study for optimization of problems, but there has been few former study on the possible conflicting phenomena in considertion of the correlations among the characteristics. To solve the issue on the optimal design for multiple quality characteristics, the study propose the expected loss function with cross-product terms among the characteristics and derived range of the coefficients of terms. Therefore, the analysis have to be required a multivariate statistical technique. This paper introduces to multivariate capability indices and then selects a multivariate process capability index incorporated both the process variation and the process deviation from target among these indices under the multivariate normal distribution. We propose a new multivariate capability index $MC_{pm}^{++}$ using quality loss function instead of the process variation and this index is compared with the proposed indices when quality characteristics are independent and dependent of each other.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.195-196
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• 2005

In recent years, as the needs of MOS's a high quality is desired to get the superior electrical characteristics and reliability on MOSFET. As an alternative gate dielectric have drawn considerable alternation due to their superior performance and reliability properties over MOSFET, 2'nd silicidation formation process has been proposed as a dielectric growth/annealing process. In this study the author observed process characteristics on MOS structure. In view points of the process characteristics of MOS capacitor, the oxygen & polysilicon was analyzed by SIMS analysis on l'st & 2'nd Ti process, the oxygen and Si2 contents[Count/sec] of 1.5e3 & 3.75e4 on l'st process and l.1e3 & 2.94e4 on 2'nd process, the Ti contents' of 8.2e18 & 6.5e18 on 1'st and 2'nd process. The sheet resistance[$\Omega/sq.$] was 4.5 & 4.0, the film stress[dyne/cm 2] of 1.09e10 & 1.075e10 on l'st and 2'nd process. I could achieved the superior MOS characteristics by 2'nd silicidation process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.16-24
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• 2021

A laser-engineered net shaping (LENS) process is a representative directed energy deposition process. Deposition characteristics of the LENS process are greatly dependent on the process parameters. The present paper preliminarily investigates deposition characteristics of Inconel 718 superalloy on S45C structural steel using a LENS process. The influence of process parameters, including the laser power and powder feed rate, on the characteristics of the bead formation and the dilution in the vicinity of the deposited region is examined through repeated experiments. A processing map and feasible deposition conditions are estimated from viewpoints of the aspect ratio, defect formation, and the dilution rate of the deposited bead. Finally, an appropriate deposition condition considering side angle, deposition ratio, and buy-to-fly (BTF) is predicted.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.379-382
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• 2006

In this study, an attempt was made to form magnesium oxide layer via aqueous solution route of salt precipitation process. A layer with flake morphology was formed from the process and various dopants were added during the forming process. The films formed were characterized using SEM, XRD, and cathodoluminescence measurement. In addition, the discharge characteristics were evaluated using panel tests. The results indicate that MgO film can be formed via the aqueous solution process successfully, of which characteristics are comparable to those of MgO film formed by e-beam evaporation process.