• Title/Summary/Keyword: Process기술

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A Simulation Study for Analyzing a LED Assembly Process (LED 공정분석을 위한 시뮬레이션 연구)

  • Yoon, Cheol-Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.4
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    • pp.924-929
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    • 2007
  • This paper introduces a simulation model regarding the process analysis of a LED assembly process. The objective of the simulation model is to evaluate the performance of various design aspects of process alternatives. To develop the simulation model, a time study is performed for each process. Next, by using ARENA, a simulation model is conducted based on the process analysis and the line balancing methodology. We found out several problems for the assembly process, and then suggest several alternatives to improve the system.

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Development of an Assembly-free Process for Micro-stereolithography Technology (마이크로 광 조형기술에서의 통합성형공정의 개발)

  • 이인환
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.9
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    • pp.182-187
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    • 2004
  • As it is difficult to construct a micro-fluidic system composed of micro-mixers, micro-channels and/or micro-chambers in a single process, an assembly process is typically used. The assembling and bonding of micro-parts, however, introduces other problems. In this work, a virtual assembly process was developed that can be used to design various micro-systems before actual fabrication commences. In the process, the information required for the micro-stereolithography process is generated automatically. Consequently, complex micro-fluidic systems can be fabricated in a single process, thereby avoiding the need fur additional assembly or bonding processes. Using the developed process, several examples were fabricated.

BPAF2.0: Extended Business Process Analytics Format for Mining Process-driven Social Networks (BPAF2.0: 프로세스기반 소셜 네트워크 마이닝을 위한 비즈니스 프로세스 분석로그 포맷의 확장 표준)

  • Jeon, Myung-Hoon;Ahn, Hyun;Kim, Kwang-Hoon
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.36 no.12B
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    • pp.1509-1521
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    • 2011
  • WfMC, which is one of the international standardization organizations leading the business process and workflow technologies, has been officially released the BPAF1.0 that is a standard format to record process instances' event logs according as the business process intelligence mining technologies have recently issued in the business process and workflow literature. The business process mining technologies consist of two groups of algorithms and their analysis techniques; one is to rediscover flow-oriented process-intelligence, such as control-flow, data-flow, role-flow, and actor-flow intelligence, from process instances' event logs, and the other has something to do with rediscovering relation-oriented process-intelligence like process-driven social networks and process-driven affiliation networks from the event logs. The current standardized format of BPAF1.0 aims at only supporting the control-flow oriented process-intelligence mining techniques, and so it is unable to properly support the relation-oriented process-intelligence mining techniques. Therefore, this paper tries to extend the BPAF1.0 so as to reasonably support the relation-oriented process-intelligence mining techniques, and the extended BPAF is termed BPAF2.0. Particularly, we have a plan to standardize the extended BPAF2.0 as not only the national standard specifications through the e-Business project group of TTA, but also the international standard specifications of WfMC.

Interfacial and Mechanical Properties of Sn-57Bi-1Ag Solder Joint with Various Conditions of a Laser Bonding Process (다양한 레이저 접합 공정 조건에 따른 Sn-57Bi-1Ag 솔더 접합부의 계면 및 기계적 특성)

  • Ahn, Byeongjin;Cheon, Gyeong-Yeong;Kim, Jahyeon;Kim, Jungsoo;Kim, Min-Su;Yoo, Sehoon;Park, Young-Bae;Ko, Yong-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.65-70
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    • 2021
  • In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu6Sn5 intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

Develop of Instructional Process Plan and Performance Assessment Instrument for 'Energy and Transportation Technology' Unit at the Subject 'Technology-Home Economics' in Middle School (중학교 기술·가정과 '에너지와 수송 기술' 단원의 수업과정안 및 수행평가 도구 개발)

  • Yi, Sang-bong;Lee, Do-Hyun
    • 대한공업교육학회지
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    • v.40 no.2
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    • pp.196-215
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    • 2015
  • The purpose of this study was to develop the instructional process plan and performance assessment instrument to do problem-solving activity for 'Energy and Transportation Technology' unit at the subject 'Technology-Home Economics' in middle school. This study was conducted by the following these stage. First, it was documents research and analysis of the 'Energy and Transportation Technology' unit. Second, topics for transportation technology hands-on and problem-solving activity were selected, and the organized for designed instructional process plan and performance assessment instrument related transportation technology in the development step. Third, developed instructional process plan and performance assessment instrument were conducted in order to amend and improved by expert and have gone through the field test for further improvement. The theme of transportation technology for hand-on and problem-solving activity was 'Created a hovercraft', and were consist of instructional process plan for 8 class period and performance assessment instrument in 4 type of observation, assessment finished, portfolios and student self-assessment.

The Innovation Characteristics of Open Source Software: A Review (오픈소스 소프트웨어의 기술혁신 특성: 리뷰)

  • 송위진
    • Journal of Korea Technology Innovation Society
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    • v.5 no.2
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    • pp.212-227
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    • 2002
  • This study reviews the institutional frameworks of Open Source software and develops the stylized facts of Open Source software innovation. Open Source software have to solve two difficult problems for encouraging innovation. First, the source code of Open Source software program should be open and freely distributed and it is very difficult for developers to appropriate the results of their investments. Second, as Open Source software development process is characterized by the participation of communities of developers, it is not easy to coordinate and manipulate the development process. These difficulties of developing Open Source Software have been solved by the particular incentive schemes and coordinating mechanisms. This study reviews the study on the motivation of Open Source software development and the mechanisms which coordinate innovation process of Open Source software with peer review and meritocracy, and how these characteristics promote innovation in Open Source software communities.

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A Study on Technology Evaluation Process Model for the Enterprise Selection (업체선정을 위한 기술평가 프로세스 모델에 관한 연구)

  • Son Yong-Soo;Ko Hoon;Shin Yong-Tae
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.31 no.8B
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    • pp.769-776
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    • 2006
  • It is important for evaluation execution about technology development. And it is necessary to settle together with technology development activity to evaluation execution. Purpose of this paper is to decide request for proposal and suitable to proposed enterprise contents about technology part in performance. Therefore let estimate the data about it. So suitable enterprise is selected through applying evaluation data to TEPM(Technology Evaluation Process Model).

A study on forming characteristics of magnesium alloy (AZ31) on various temperatures (마스네슘 합금 판재 (AZ31)의 온도별 성형 특성 분석)

  • LEE, Han-Gyu;La, Won-Bin;Hong, So-Dam;LEE, Chang-Whan
    • Design & Manufacturing
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    • v.12 no.3
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    • pp.42-47
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    • 2018
  • Recently, in the surge of global environmental issues, there has been a great attention to lightweight materials in purpose of saving energy. Magnesium alloys not only have low specific gravity, and superb specific stiffness, but are also excellent in blocking vibrations and electromagnetic waves. So demand for this material is getting bigger rapidly throughout the industry. In this study, we examined the improvement of formability of magnesium alloy AZ31 material in warm working. Drawing, bending and shearing process were carried out by varying the forming temperature and the forming speed, and the influence of the variables on each process was studied. In the experiments, the high forming temperature and low forming speed results in high formability in the drawing process and the bending process. In the shearing process, as the forming temperature increases, the length of the fracture decreases.

Improvement in Power of Shingled Strings by Re-work Process (Re-work 공정을 통한 슁글드 스트링의 출력 개선)

  • Song, Jinho;Jee, Hongsub;Moon, Daehan;Kim, Do-Heyong;Yang, O-Bong;Jeong, Chaehwan
    • Current Photovoltaic Research
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    • v.7 no.2
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    • pp.51-54
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    • 2019
  • The high density module (HDM) has advantages for its larger active area and smaller current density. This new way of making a photovoltaic (PV) module method has benefit for increasing module power with the same installed area. Because HDM consisted with serially connected PV strings, loss of strings during the fabrication process can increase the overall production cost.1-2 This study investigates the rework conditions of the shingled strings with electrically conductive adhesives (ECA). By heating the electrically connected area of a fabricated string, cured area become soft and a string can be detached for the rework process. After rework process, a refabricated string showed 5~10% increased output power compared to before rework process and reached to the 90~95% output power compare to the undamaged strings.

Fabrication Studies for PZT Preform Using PIM (PIM을 이용한 PZT 프리폼의 제조에 대한 연구)

  • Shin, Ho-Yong;Kim, Jong-Ho;Jang, Jong-Soo;Im, Jong-In
    • The Journal of the Acoustical Society of Korea
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    • v.28 no.8
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    • pp.796-805
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    • 2009
  • In this paper, a fabrication process for PZT preform of 1-3 type piezo-composite were studied using powder injection molding (PIM). The viscosity and the Pressure-Volume-Temperature (PVT) characteristics of the fabricated PZT feedstock were analyzed. The filling patterns, pressure, temperature distributions, and forming defects of the preform were analyzed with 3D TIMON commercial packages during PIM process. Also the fabrication conditions and the delivery system of the preform were optimized during the entire PIM process. Based on the simulated results, the preform having uniform distributions of the PZT rod was fabricated with the PIM process.