• Journal of KIISE:Computing Practices and Letters
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• v.14 no.7
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• pp.703-707
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• 2008

This paper designs and implements a software prober to support a more effective power analysis for Linux-based embedded systems by using power consumption data measured in hardware. The proposed software prober, which is included in a target system as a module, collects power data and provides a service to discover major power consumers in user functions of applications or kernel functions through time synchronization between the power data measured in hardware and software. In addition, we verified usefulness of the implemented software prober by running user applications on target systems.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.10
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• pp.2572-2576
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• 2009

The wafer prober is used in mass production process of semiconductor chips. The chuck in wafer prober must have a uniform temperature distribution when the chuck is heated or cooled. The temperature distribution of prober chuck is measured by using a thermocouple when the chuck is cooled. The temperature distribution is also calculated by using a CFD program, FLUENT. The measured temperature and calculated temperature show similar distributions. A modified coolant circuit distribution for the improving temperature uniformity is suggested based on the numerical analysis results.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.427-428
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• 2008

In order to probe such mineral resources, AUVs (Autonomous Underwater Vehicles) have been used instead of ROVs (Remotely-Operated Vehicles) that are not suitable to probe submarine resources distributed over a wide area. However, the power consumption of AUVs needs to be reduced as they are operated by batteries. In controlling the power of underwater vehicles, the efficiency of batteries and their capacity have been heightened. This study aimed at developing a power control system suitable to the prober for submarine mineral resources. As a result, power was reduced as compared to the non-control system and the prober could explore the seabed longer than usual.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.21-26
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• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

• Proceedings of the Korean Society of Potoscience Conference
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• spring
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• pp.47-48
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• 1999

• Journal of Ocean Engineering and Technology
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• v.19 no.2 s.63
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• pp.74-81
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• 2005

A 3-D localization method of an autonomous underwater vehicle (AUV) has been developed, which can solve the limitations oj the conventional localization, such as LBL or SBL that reduces the flexibility and availability of the AUV. The system is composed of a mother ship (small unmanned marine prober) on the surface of the water and an unmanned underwater vehicle in the water. The mother ship is equipped with a digital compass and a GPS for position information, and an extended Kalman filter is used for position estimation. For the localization of the AUV, we used only non-inertial sensors, such as a digital compass, a pressure sensor, a clinometer, and ultrasonic sensors. From the orientation and velocity information, a priori position of the AUV is estimated by applying the dead reckoning method. Based on the extended Kalman filter algorithm, a posteriori position of the AUV is, then, updated by using the distance between the AUV and a mother ship on the surface of the water, together with the depth information from the pressure sensor.

• 한국벤처창업학회:학술대회논문집
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• 2023.11a
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• pp.91-96
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• 2023

글로벌로 핵심기술 경쟁 및 최상의 기술을 적용한 제품 제조를 실현해야 하는 ICT 분야의 수출 제조 중소기업은 내부, 외부적인 환경적 요인뿐 아니라 다양한 위기상황을 겪게 된다. 이러한 위기상황을 극복하고자 기업 자체적인 전략을 다방면으로 모색하고 실행하여 성공한 수출 제조 중소 벤처기업인 '(주)쎄믹스'가 있다. 2000년에 설립한 (주)쎄믹스는 반도체 검사장비 중 하나인 Wafer Prober 제조 전문기업으로, 'Simple Perfection'이라는 슬로건 아래 23년간 'OPUS' 및 'OPERA'를 생산, 판매에 전념하고 있는 글로벌 강소기업이며, 지속적인 핵심기술 연구개발을 통해 품질혁신에 성공하였고 글로벌 반도체 검사장비 시장에서 기술적 신뢰와 브랜드 명성을 인정받고 있는 벤처기업이다. 현재 (주)쎄믹스의 입지를 구축하기까지 수출 제조기업으로서 겪은 환율관리 실패인 키코손실에서 기인한 회사 위기를, 자체적으로 기술혁신, 조직혁신, 핵심인재 육성 등 전략적 기업혁신에 성공하여 회사의 존폐위기였던 상황을 극복하였다. 우선 키코손실을 떨쳐내고 새로이 시작하기 위한 S사와의 합병, 분할 후 조직 내부에 기업가정신을 고취하였고 핵심기술을 발굴하여 세계일류상품 인증, 월드클래스 300 선정 및 완수, 6개국에 7개의 자회사 설립 통한 조직혁신, 과감한 인재등용, 인재육성 위한 사내 컨퍼런스 제도 도입, TRIZ 등을 통한 과감한 교육혁신, 인재를 위한 특별한 복지정책 구현 등을 실천하였다. 본 연구는 '(주)쎄믹스'의 위기극복 사례를 통해 일본의 두 곳 대기업만이 누리고 있던 Wafer Prober 장비 시장에서 독자적인 글로벌 판로개척을 통한 자생적 성장시스템 구축과 창의적이고 자기 주도적인 혁신체제를 구축하는 계기를 제공하여 다양한 위기상황에 직면하였거나 위기를 미연에 방지하여야 할 중소기업인과 임직원들에게 성공 사례를 제공하고자 하였다.

• Proceedings of the Korean Information Science Society Conference
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• 2007.06a
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• pp.275-276
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• 2007

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.4
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• pp.592-597
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• 2015

3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising.

• Journal of Environmental Science International
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• v.5 no.1
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• pp.83-91
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• 1996

A recycling soap was prepared from non-cooking oils. The effects of physlcal and chemical properties of the recycling soap on biodegradation are expected to be different due to the thermal histories of the non-cooking oils. Therefore, the biodegradation rate of the recycling soap was studied by using Klebssella Pneumoniae(K. pneumoniae), and the growth rate of K. pnewoniae in soap solution was observed. The biodegradation rate of the recycling soap appeared to be slower as the thermal histories of the non-cooking oils became larger. This might be resulted from hydrolysis, in which the ester bonds in the oils are broken to produce hydroxyl group. It was also observed that the growth rate of the microorganism decreased with the increase in the thermal histories of the oils. As a result, it is desired that recycling soap should be produced from the non-cooking oils with the prober ranges of thermal histories to reduce water contamination. The non-cooking oils with larger thermal histories are considered to be recycling through the cracking process before used. Key Words : non-cooking oils, recycling soap, thermal history, biodegradation, microorganism growth.