• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.7
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• pp.1065-1073
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• 1999

This paper analyzed the ground bounce caused by the power plane resonance in the multilayered printed circuit board(PCB) using the Haar-wavelet-based Multiresolution Time-Domain (MRTD). In conventional Finite-Difference Time-Domain(FDTD), the highly fine vertical cell is needed to represent the distance between $V_{cc}$ plane and ground plane since the two planes are very close. Therefore the time step $\Deltat$ must be very small to satisfy the stability condition. As a result, a large number of iterations are needed to obtain the response in wanted time. For this problem, this paper showed that the computation time can be reduced by application of the MRTD method. The results obtained by the MRTD agree very well with those by FDTD method and analytic solutions. In conclusion, this paper proved the efficiency and accuracy of MRTD method for analyzing the EMI/EMC problems in PCB.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.8
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• pp.661-669
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• 2021

A mechanical stiffener has been mainly applied on a PCB to secure fatigue life of a solder joint of an electronic components in spaceborne electronics by minimizing bending displacement of the PCB. However, it causes an increase of mass and volume of the electronics. The high damping PCB implemented by multi-layered viscoelastic tapes of a previous research was effective for assuring the fatigue life of the solder joint, but it also has a limitation to decrease accommodation efficiency for the components on the PCB. In this study, we proposed high damping PCB with a multi-layered superelastic shape memory alloy stiffener for spatialminimized, light-weighted, high-integrated structure design of the electronics. To investigate the basic characteristics of the proposed PCB, a static load test, a free vibration test were performed. Then, the high damping characteristic and the design effectiveness of the PCB were validated through a random vibration test.

• Journal of Biomedical Engineering Research
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• v.32 no.1
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• pp.32-36
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• 2011

The insufflators in endoscopic surgery supply carbon dioxide to make the air-filled cavity in the abdomen. It contains many kinds of pneumatic and electronic parts and they are connected with the air tubes and electrical wires. The printed circuit boards (PCB) perform wiring, holding and cooling tasks in electronic systems. In this study, the PCB is used as the air channel for insufflators to decrease the cost, volume, and the malfunction according to aging of the device. Three layers of PCB made of FR4 are combined with prepreg as adhesive which has the internal airway channel according to the design. By mounting the pressure sensors and valves, the PCB based fluidic system is implemented. After calibration of flow sensor, the flow rate of the gas also can be measured. The climate test, temperature test, and biocompatibility test showed this idea can be used in insufflators for laparoscopic surgery.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.1-4
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• 2008

Fuel cells have the potential of providing several times higher energy storage densities than those possible using current state-of-the-art lithium-ion batteries, but current energy density of fuel cell system is not better than that of lithium-ion batteries. To achieve the high energy density, volume and weight of fuel cell system need to be reduced by miniaturizing system components such as stack, fuel tank, and balance-of-plant. In this paper, the thin flexible PCB (Printed circuit board) is used as a current collector to reduce the stack volume. Two end plates are made from light weight aluminum alloy plate. The plate surface is wholly oxidized through the anodizing treatment for electrical insulation. The opening rate of cathode plate hole is optimized through unit cell performance measurement of various opening rates. The performances are measured at room temperature and ambient pressure condition without any repulsive air supply. The active area of MEA is 10.08 $cm^2$ and active area per a unit cell is 1.68 $cm^2$. The peak power density is about 210 mW/$cm^2$ and the air-breathing planar stack of 2 Wis achieved as a small volume of 18 cc.

• Proceedings of the IEEK Conference
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• 2004.06a
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• pp.269-272
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• 2004

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Journal of Aerospace System Engineering
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• v.11 no.1
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• pp.1-7
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• 2017

While a satellite is carried into orbit by a launch vehicle, it is exposed to the severe launch environment with random vibrations and shock. Accordingly, these vibration sources affect electronic equipment, particularly the printed circuit board (PCB) in the satellite. When the launch load impacts the PCB, it causes negative behavior. This causes perpendicular bending around the boundary of fixation points that finally leads to the failure of solder joints, lead wires, and PCB cracks. To overcome these issues, the electronic equipment design must meet reliability requirements. In this paper, Steinberg's method is used to derive allowable and maximum deflection to verify design from a life perspective concerning the control board of the Antenna Pointing Driver (APD) mounted on KOMPSAT-3.

• Journal of the Korean Society for Railway
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• v.19 no.4
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• pp.468-479
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• 2016

In order to supply power to online monitoring systems that are attached to high voltage catenary or overhead wires, a wireless power transfer system is required that is able to transmit power over the insulation gap. Such wireless power transfer systems have transmitter and receiver coils that have diameters of over 10cm. This paper focused on an investigation of the sources of loss in the coils when the coils are fabricated using printed circuit board technology. Using finite element simulation results, it has been shown that the dielectric loss in the substrate was the dominant source of the total loss. It has been demonstrated that the selection of a proper dielectric material was the most critical factor in reducing the loss. For further reduction of the loss, the distributed tuning capacitor method and the slotting of the inter-turn spaces have been proposed. For the evaluation of the proposed methods, four coils have been fabricated and their equivalent series resistances and quality factors were measured. Measured quality factors were greater than 300, which means that these devices will be helpful in achieving high coil-to-coil efficiency.

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.3
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• pp.241-247
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• 2006

We propose a character recognition system to extract the component reference names from printed circuit boards (PCBs) automatically. The names are written in horizontal, vertical, reverse-horizontal and reverse-vertical directions. Also various symbols and figures are included in PCBs. To recognize the character and orientation effectively, we divide the recognizer into two stages: character classification stage and orientation classification stage. The character classification stage consists of two sub-recognizers and a verifier. The rotaion-invarint features of input pattern are then used to identify the character independent of orientation. Each recognizer is implemented as a neural network, and the weight values of verifier are obtained by genetic algorithm. In the orientation classification stage, the input pattern is compared with reference patterns to identify the orientation. Experimental results are presented to verify the usefulness of the proposed system.