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http://dx.doi.org/10.5139/JKSAS.2021.49.8.661

Experimental Validation of High Damping Printed Circuit Board With a Multi-layered Superelastic Shape Memory Alloy Stiffener  

Shin, Seok-Jin (Drive Concept Development Team, Namyang R&D Center, Hyundai Motor Group)
Park, Sung-Woo (LIG Nex1 Co. Ltd.)
Kang, Soo-Jin (LIG Nex1 Co. Ltd.)
Oh, Hyun-Ung (Department of Smart Vehicle System Engineering, Chosun University)
Publication Information
Journal of the Korean Society for Aeronautical & Space Sciences / v.49, no.8, 2021 , pp. 661-669 More about this Journal
Abstract
A mechanical stiffener has been mainly applied on a PCB to secure fatigue life of a solder joint of an electronic components in spaceborne electronics by minimizing bending displacement of the PCB. However, it causes an increase of mass and volume of the electronics. The high damping PCB implemented by multi-layered viscoelastic tapes of a previous research was effective for assuring the fatigue life of the solder joint, but it also has a limitation to decrease accommodation efficiency for the components on the PCB. In this study, we proposed high damping PCB with a multi-layered superelastic shape memory alloy stiffener for spatialminimized, light-weighted, high-integrated structure design of the electronics. To investigate the basic characteristics of the proposed PCB, a static load test, a free vibration test were performed. Then, the high damping characteristic and the design effectiveness of the PCB were validated through a random vibration test.
Keywords
Superelastic Shape Memory Alloy; Viscoelastic Tape; Printed Circuit Board; Fatigue Life;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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