대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)

대한전자공학회 (The Institute of Electronics and Information Engineers)
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Build-up PCB 특허출원동향

Patent Survey on Build-up PCB

  • Yeo Woon Dong (Korea Institute of Science and Technology Information) ;
  • Kim Kang Hoe (Korea Institute of Science and Technology Information) ;
  • Kim Jae Woo (Korea Institute of Science and Technology Information) ;
  • Bae Sang Jin (Korea Institute of Science and Technology Information)
  • 발행 : 2004.06.01
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초록

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

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