• JSTS:Journal of Semiconductor Technology and Science
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• 제13권2호
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.

• 대한산업공학회지
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• 제20권4호
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• pp.23-35
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• 1994

Efficient operation of a component placement machine with a multi-head in a PCB assembly process is considered. The problem consists of two subproblems, which are the optimal allocation of the component tape reels in the rack and the optimal mounting sequence of the components on a printed circuit board. We analyze the problem and propose a heuristic algorithm to solve it. The heuristic can be used for the one head case too. Computational experiences on some real world problems show the effectiveness of the heuristic in terms of speed and solution quality.

• Journal of Electrical Engineering and Technology
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• 제11권1호
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• pp.175-183
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• 2016

This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of −40dB in Near-End Crosstalk (NEXT) and −60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.

• International Journal of Precision Engineering and Manufacturing
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• 제4권1호
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2010년도 춘계학술대회 논문집
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• pp.572-573
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• 2010

Vibration analysis of Fine-pitch Ball Grid Array (FBGA) packages mounted on a Printed Circuit Board (PCB) subjected to harmonic excitation is performed by using finite element method (FEM). A finite element model of a memory module is composed of three main parts, packages, simplified solder balls and bare PCB. At first, natural frequencies and mode shapes of the developed model were confirmed experimentally. Secondly, the harmonic excitation experiment for the module was carried out at the first natural frequency of the memory module, and it was verified with the simulation by using mode superposition method at a constant acceleration.

• Journal of Welding and Joining
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• 제18권4호
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2003년도 추계종합학술대회
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• pp.407-410
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• 2003

현재 통신시스템에서 많이 사용되고 있는 Xilinx FPGA를 이용하여, 여러 가지 로직을 구현하고 데이터 전달특성을 분석하기 위하여 신호의 노이즈와 데이터 손실을 방지하기 위하여 10층의 PCB(Printed Circuit Board)를 만들었다. FPGA에 클럭과 64bit의 데이터를 동기 시켜 전송선로의 길이의 변화와 입력된 클럭의 주파수 변화에 따른 최대 안정된 데이터 전달속도와 전송선로의 길이를 알아보았다. 제작된 PCB보드에서 FPGA의 출력 핀에서 출력포트 사이의 전송선로 길이는 13cm이며 확장된 테스트용 전송선로 보드의 길이는 30cm, 60cm, 120cm이다. 그러므로 전송선로의 길이를 13cm, 43cm, 73cm, 133cm간격으로 측정하였으며, 데이터 전송특성에 대한 클럭 주파수는 10MHz, 50MHz, 100MHz, 125MHz, 150MHz로 나누어 측정하였다. 데이터 전달 특성에서 125Mbps까지는 불가능 하지만 전송선로의 길이가 30cm일 경우 최대 100Mbps까지 안정하게 데이터를 전달할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.171-173
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• 2002

This paper describes the open frame type high power density switching converter. It is based on active clamp forward converter with synchronous rectifier, and packaged by using the open frame and multi-layer printed circuit board (PCB) techniques to achieve the high power density. Furthermore, windings of transformer and inductor are also realized by multi-layer PCB so that it achieves the higher power density. Through the experiment on the proto-type converter of 50[W], it is confirmed that power density of $50[W/in^3]$ and maximum efficiency of over 91 [%] are obtained.

• 한국표면공학회지
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• 제46권4호
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.