• 전기전자학회논문지
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• 제22권3호
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• pp.882-885
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• 2018

시스템의 동작 속도가 빨라짐에 따라 인쇄 회로 기판(PCB: printed circuit board)에서 신호 무결성 문제가 매우 중요해지고 있다. 지금까지는 관습적으로 PCB 면적을 줄이고 가격을 낮추도록 설계하는데 치중해왔다. 그러나 초고속으로 동작하는 PCB에서는 유전체 특성, 배선 폭, 배선 간격, 임피던스 정합 등을 고려하여 정밀하고 세심하게 설계하지 않으면 제대로 동작하기 어렵다. 본 논문에서는 초고속 PCB에서 생기는 여러 가지 문제점과 이를 완화할 수 있는 다양한 설계 기법에 대해 살펴본다.

• Bulletin of the Korean Chemical Society
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• 제33권6호
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• pp.1967-1971
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• 2012

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg.

• 한국정밀공학회지
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• 제24권5호
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2002년도 춘계학술대회논문집
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1992년도 춘계공동학술대회 발표논문 및 초록집; 울산대학교, 울산; 01월 02일 May 1992
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• pp.159-168
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• 1992

생산라인의 line balancing이 흐름생산에 있어서 일관된 생산을 하기 위한 필수조건이다. 여러 다양한 제품을 생산하는 printed circuit board(PCB) 공장에서의 line balancing을 얻기 위해서는 mixed model line balancing절차를 설명하고자 한다.

• 전기전자학회논문지
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• 제22권3호
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• pp.874-877
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• 2018

인쇄 회로 기판(PCB: printed circuit board)에는 다수의 표면 실장 부품(SMD: surface mount device)이 장착되어 상호 연결되며, 이들을 연결하는 배선의 전송 특성이 나빠지면 시스템의 성능이 감소하게 된다. PCB와 SMD를 연결하는 패드는 PCB 전송 특성에 큰 영향을 미치기 때문에 패드의 위치도 최적화되어야 한다. 본 논문에서는 패드 정렬이 PCB 전송 특성에 미치는 영향을 시뮬레이션 하였다. 주파수가 비교적 낮은 경우에는 패드 정렬이 PCB 전송 특성에 큰 영향을 미치지 않지만 주파수가 높아지거나 패드 크기가 커질수록 패드 정렬에 따른 영향이 커진다. 따라서 목표 주파수와 패드 크기에 따라 세심하게 패드 정렬을 선택할 필요가 있다. 특히 12~18 GHz의 Ku-밴드 주파수 대역에서는 기존의 중앙 정렬 패드보다 제안하는 측면 정렬 패드가 전체적으로 유리하다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(5)
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• pp.9-12
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• 2000

This paper describes the modeling and experimental results of coreless printed circuit board (PCB) based transformer that can be used for power conversion at high frequency operation. The principle of using coreless PCB based transformer in 2MHz, 10W class ZVS Flyback DC-DC converter has been successfully demonstrated. The maximum power conversion efficiency is 79%. Even for high operating frequency, an efficiency greater than 70% can be obtained with under 1% regulation error.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2016년도 춘계학술대회
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• pp.674-675
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• 2016

본 논문에서는 전기 및 전자 쓰레기의 대책으로 Printed Circuit Board (PCB) 부착형 Radio-Frequency Identification (RFID) 태그 칩을 이용한 사물인터넷 디바이스 생산 공정에 대한 모델을 제안한다. 전기 및 전자제품은 PCB 부품실장 공정과 검사가 필요하다. 또한 현재 제조사들이 사용하는 바코드 시스템은 Surface Mount Technology (SMT)공정이 완료되기 전까지 PCB 이력 관리가 불가능하다. 논문에서 제안한 PCB 부착형 RFID 태그 칩을 이용한 사물인터넷 디바이스 생산 공정 모델은 바코드 방식과 같은 출력-부착 단계가 필요하지 않다. 태그 칩은 각 단계의 공정 데이터가 기록될 수 있고, 데이터베이스 시스템 (DBMS) 접속 횟수를 현격히 줄일 수 있다.

• 전기학회논문지
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• 제61권3호
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• pp.472-478
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• 2012

The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.