• 전자공학회논문지
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• 제53권2호
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• pp.109-116
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• 2016

셔터방식의 쵸퍼를 이용한 정지 및 이동인체 감지 모듈을 개발하였다. 감지 모듈은 프레넬 렌즈(Fresnel lens), 초전형적외선(pyroelectric infrared : PIR) 센서, 센서 인터페이스 회로, MCU(micro control unit) 그리고 경보 LED(light emitting diode)로 구성된다. 정지 인체 감지 원리는 PIR 센서에서 나오는 신호를 카메라 셔터를 이용하여 인체의 열을 쵸핑하여 감지하는 방식이다. MCU에서 인터럽트 함수를 제어하는 알고리즘을 통해 정지 및 이동 인체 신호를 감지하게 하였다. 개발한 감지 모듈은 기구부와 PCB(print circuit board)를 일체화함으로써 종래의 상용화되고 있는 이동인체 감지 모듈을 대체 가능하다. 실내 상온에서의 실험 결과, 감지거리는 약 7.0m, 감지각도는 $110^{\circ}$로 측정되었다. 이런 조건에서 감지률은 100%이였고 모듈의 소비 전력는 100mW이였다.

• 한국컴퓨터정보학회:학술대회논문집
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• 한국컴퓨터정보학회 2015년도 제51차 동계학술대회논문집 23권1호
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• pp.289-290
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• 2015

본 연구에서는 인쇄회로기판(PCB)용 재료로 널리 사용되는 고분자에 대해서 와이블 분포 방정식의 시뮬레이션을 수행하여 절연 신뢰도 특성 데이터를 분석하였다. 와이블 분포에 대한 분석 시뮬레이션을 통하여 일반적으로 허용 절연 파괴 확률을 0.1[%] 이하라고 설정하였을 때, 첨가제 배합비를 5종으로 구분한 각 시편에 대해서 인가 전계의 허용치를 각각 계산할 수 있었다.

• 자원리싸이클링
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• 제25권2호
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• pp.42-48
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• 2016

국내 전자 디스플레이 산업의 고도화된 기술과 평판 디스플레이 제품의 글로벌 점유율은 세계 최고 수준이지만 사용 후 버려지는 폐 디스플레이 제품에 대한 재활용 기술 및 재활용 현황은 아직 글로벌 리더 수준에는 못 미치고 있다. 평판 디스플레이 제품의 짧은 순환주기를 고려할 때, 폐 디스플레이 제품의 재자원화는 전 세계적으로 경제와 환경측면에서 이슈가 되고 있다. 본 연구는 향후 폐 LCD (Liquid Crystal Display) 제품 재활용 플랜트에서 활용할 수 있는 재자원화 데이터베이스를 구축하기 위한 기초연구로 40인치와 42인치 크기의 폐 LCD 제품의 분리해체 방법과 해체 모듈과 부품에서 회수 가능한 유용자원의 종류와 구성비를 분석하였다. 폐 LCD 해체 분석결과를 보면 무게비로 플라스틱은 약 22%, PCB (Print Circuit Board)는 약 9%, 패널부는 약 34%, 이 외 금속류를 포함한 기타는 약 35%의 구성비를 가지고 있었다. 본 연구에서 얻어진 폐 LCD 데이터베이스는 폐 제품의 재활용률 향상은 물론 효율적 재자원화를 통한 경제적 해체 공정 시스템을 구축하는데 기여할 것으로 판단된다.

• 산업공학
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• 제7권1호
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• pp.67-74
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• 1994

In this study, we propose an integrated CAD(Computer Aided Design) library database in a heterogeneous commercial ECAD(Electronic CAD) environment. To effectively solve engineering problems focused on BOM data extraction we use a software system called schematic capture and company-wide standard electronic part information loaded on different commercial ECADs. We unify many commercial ECADs into one schematic capture and a variety of PCB(Printed Circuit Board) design tools. For this purpose we develope a model for linking CAD symbol library with company-wide standard part information. We also develope a schematic design data conversion scheme and show how to extract PBA level BOM data using our customized schematic capture. This system is being operated in an X-Window based engineering work station and commercial RDBMS base.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• 한국전기전자재료학회논문지
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• 제23권4호
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• 전자공학회논문지SC
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• 제38권4호
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• pp.37-44
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• 2001

본 논문은 코어 없는 PCB(Print circuit board) 변압기와 인덕터를 이용한 ZVS (Zero voltage switching) Forward DC-DC 컨버터의 실험 결과 및 실용 가능성을 보고한 것이다. 최대출력 12W, 최대 스위칭주파수 2.2MHz, 정격 입력전압 24V를 갖는 실험용 컨버터가 검증되었다. 코어 손실이 없기 때문에 코어 없는 PCB 변압기와 인덕터가 고주파 동작에 적합하다는 것을 밝혔다 실험 컨버터는. 최저 70% 에서 80%의 전력변환 효율을 나타내었고， 12V 출력전압은 0.7% 이내에서 안정되었다.

• 한국운동역학회지
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• 제31권3호
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• pp.183-188
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• 2021

Objective: The purpose of this study was to develop a stretchable joint motion sensor that is based on silver nano-particle. Through this sensor, it can be utilized as an equipment for rehabilitation and analyze joint movement. Method: In this study, precursor solution was created, after that, nozel printer (Musashi, Image master 350PC) was used to print on a circuit board. Sourcemeter (Keithley, Keithley-2450) was used in order to evaluate changes of electric resistance as the sensor stretches. In addition, the sensor was attached on center of a knee joint to 2 male adults, and performed knee flexion-extension in order to evaluate accurate analysis; 3 infrared cameras (100 Hz, Motion Master 100, Visol Inc., Korea) were also used to analyze three dimensional movement. Descriptive statistics were suggested for comparing each accuracy of measurement variables of joint motions with the sensor and 3D motions. Results: The change of electric resistance of the sensor indicated multiple of 30 times from initial value in 50% of elongation and the value of electric resistance were distinctively classified by following 10%, 20%, 30%, 40% of elongation respectively. Through using the sensor and 3D camera to analyze movement variable, it showed a resistance of 99% in a knee joint extension, whereas, it indicated about 80% in flexion phase. Conclusion: In this research, the stretchable joint motion sensor was created based on silver nanoparticle that has high conductivity. If the sensor stretches, the distance between nanoparticles recede which lead gradual disconnection of an electric circuit and to have increment of electric resistance. Through evaluating angle of knee joints with observation of sensor's electric resistance, it showed similar a result and propensity from 3D motion analysis. However, unstable electric resistance of the stretchable sensor was observed when it stretches to maximum length, or went through numerous joint movements. Therefore, the sensor need complement that requires stability when it comes to measuring motions in any condition.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.165-170
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• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.45-50
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• 2017

본 연구에서는 Sn-0.7Cu-xZn 무연솔더와 OSP 표면처리 된 솔더접합부의 전단강도를 Zn 함유량에 따라 평가하였다. 다섯 종류의 Sn-0.7Cu-xZn (x=0, 0.5, 1.0, 1.5, 2.0 wt.%) 솔더페이스트를 제작한 뒤, OSP(organic solderability preservative) 표면처리 한 PCB(printed circuit board) 기판의 전극에 리플로우 공정으로 180 um 직경의 솔더볼을 형성하였다. 전단강도는 두 가지 조건의 전단속도(0.01, 0.1 m/s)로 고속전단시험(high speed shear test)을 통해 측정하였고, 고속전단시험 시에 측정된 F-x(Force-distance) curve를 통해 파괴에너지(fracture energy)를 계산하였다, SEM(주사전자현미경, scanning electron microscopy)과 EDS(energy dispersive spectroscopy) 분석을 통하여 단면과 파단면을 관찰하였고, 금속간 화합물(intermetallic compound, IMC) 층을 분석하였다. Zn 함유량이 증가함에 따라 금속간 화합물 층의 두께는 감소하였고, Zn 함유량이 0.5 wt.%일 때 가장 높은 전단 강도(shear strength)를 나타내었다. 전체적으로 높은 전단속도 조건의 전단강도 값이 낮은 전단속도 조건의 전단강도보다 높았다.