• Journal of the Institute of Electronics and Information Engineers
• /
• v.53 no.2
• /
• pp.109-116
• /
• 2016

Sensing module of standing and moving human body using shutter method was developed. The module consists of Fresnel lens, pyroelectric infrared (PIR) sensor, interface circuit of the PIR, micro control unit(MCU), and alarm light emitting diode(LED). The principle for standing human body is chopping the thermal of human body using camera shutter. The human sensing signal in MCU by algorithm of interrupt function is detected. By unifying an apparatus and print circuit board(PCB), the developed module can be replaced as commercial moving human body detector. Experiment results show that sensing distance is about 7.0m and sensing angles is about $110^{\circ}$ at room temperature. In these condition, sending ratio was 100% and the power dissipation of the module was 100mW.

• Proceedings of the Korean Society of Computer Information Conference
• /
• 2015.01a
• /
• pp.289-290
• /
• 2015

본 연구에서는 인쇄회로기판(PCB)용 재료로 널리 사용되는 고분자에 대해서 와이블 분포 방정식의 시뮬레이션을 수행하여 절연 신뢰도 특성 데이터를 분석하였다. 와이블 분포에 대한 분석 시뮬레이션을 통하여 일반적으로 허용 절연 파괴 확률을 0.1[%] 이하라고 설정하였을 때, 첨가제 배합비를 5종으로 구분한 각 시편에 대해서 인가 전계의 허용치를 각각 계산할 수 있었다.

• Resources Recycling
• /
• v.25 no.2
• /
• pp.42-48
• /
• 2016

Although the generation of waste flat panel displays in Korea is expected to exceed one million sets in 2016, a comprehensive recycling technology has not yet been developed for effective recovery of valuable materials from the wastes, rendering to outshine the national prestige as a global leader in display industries. The overall aim of this study was to analyze the statistical data of various valuable materials and their ratio after dismantling 40-inch and 42-inch sized waste LCDs. The analysis results showed that plastic portion of the wastes was about 22% and the portion of PCB (Print Circuit Board) part was about 9% by weight whereas panel part was about 34% and leftovers including metals totalled about 35% by weight. Based on the analytical results, a higher value recycling process could be proposed with advanced material separation techniques.

• IE interfaces
• /
• v.7 no.1
• /
• pp.67-74
• /
• 1994

In this study, we propose an integrated CAD(Computer Aided Design) library database in a heterogeneous commercial ECAD(Electronic CAD) environment. To effectively solve engineering problems focused on BOM data extraction we use a software system called schematic capture and company-wide standard electronic part information loaded on different commercial ECADs. We unify many commercial ECADs into one schematic capture and a variety of PCB(Printed Circuit Board) design tools. For this purpose we develope a model for linking CAD symbol library with company-wide standard part information. We also develope a schematic design data conversion scheme and show how to extract PBA level BOM data using our customized schematic capture. This system is being operated in an X-Window based engineering work station and commercial RDBMS base.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.165-172
• /
• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.4
• /
• pp.298-302
• /
• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.38 no.4
• /
• pp.37-44
• /
• 2001

The experimental results and application potentials of a ZVS Forward DC-DC converter based coreless PCB transformer and coreless inductor are presented. The experimental converter, that has a maximum power of 12W, maximum switching frequency of 2.2MHz and nominal input voltage of 24V, has been successfully implemented. The coreless PCB transformer and inductor are found to have many favorable characteristics to high frequency operations due to the absence of a core loss. A power conversion efficiency of the experimental converter was measured at 70${\sim}$80%, and the output was regulated at 12V within 0.7% tolerance.

• Korean Journal of Applied Biomechanics
• /
• v.31 no.3
• /
• pp.183-188
• /
• 2021

Objective: The purpose of this study was to develop a stretchable joint motion sensor that is based on silver nano-particle. Through this sensor, it can be utilized as an equipment for rehabilitation and analyze joint movement. Method: In this study, precursor solution was created, after that, nozel printer (Musashi, Image master 350PC) was used to print on a circuit board. Sourcemeter (Keithley, Keithley-2450) was used in order to evaluate changes of electric resistance as the sensor stretches. In addition, the sensor was attached on center of a knee joint to 2 male adults, and performed knee flexion-extension in order to evaluate accurate analysis; 3 infrared cameras (100 Hz, Motion Master 100, Visol Inc., Korea) were also used to analyze three dimensional movement. Descriptive statistics were suggested for comparing each accuracy of measurement variables of joint motions with the sensor and 3D motions. Results: The change of electric resistance of the sensor indicated multiple of 30 times from initial value in 50% of elongation and the value of electric resistance were distinctively classified by following 10%, 20%, 30%, 40% of elongation respectively. Through using the sensor and 3D camera to analyze movement variable, it showed a resistance of 99% in a knee joint extension, whereas, it indicated about 80% in flexion phase. Conclusion: In this research, the stretchable joint motion sensor was created based on silver nanoparticle that has high conductivity. If the sensor stretches, the distance between nanoparticles recede which lead gradual disconnection of an electric circuit and to have increment of electric resistance. Through evaluating angle of knee joints with observation of sensor's electric resistance, it showed similar a result and propensity from 3D motion analysis. However, unstable electric resistance of the stretchable sensor was observed when it stretches to maximum length, or went through numerous joint movements. Therefore, the sensor need complement that requires stability when it comes to measuring motions in any condition.

• Proceedings of the IEEK Conference
• /
• 2001.10a
• /
• pp.165-170
• /
• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.45-50
• /
• 2017

We investigated effect of Zn content on shear strengh of Sn-0.7Cu-xZn and OSP surface finished solder joints. Five pastes of Sn-0.7Cu-xZn (x=0, 0.5, 1.0, 1.5, 2.0 wt.%) solders were fabricated by mixing of solder powder and flux using planatary mixer. $180{\mu}m$ diameter solder balls were formed on OSP surface finished Cu electrodes by screen print method, and the reflow process was performed. The shear strength was evaluated with two high shear speeds; 0.01 and 0.1 m/s. The thickness of the intermetallic compound(IMC) layer was decreased with increasing Zn content in Sn-0.7Cu-xZn solder. The highest shear strength was 3.47 N at the Zn content of 0.5 wt.%. As a whole, the shear strength at condition of 0.1 m/s was higher than that of 0.01 m/s because of impact stress. Fracture energies were calculated by F-x (Force-displacement) curve during high speed shear test and the tendency of fracture energy and that of shear strength were good agreement each other. Fracture took place within solder matrix at lower Zn content, and fracture occured near the interface of OSP surface finished Cu electrode and solder at higher Zn content.