• 제목/요약/키워드: Power light emitting diodes(LED)

검색결과 87건 처리시간 0.027초

팔각 핑거 타입 전극패턴을 이용한 대면적 수평형 GaN LED의 전기적/광학적 특성 분석 (Analysis of Electrical/optical Characteristics Using The Octagonal Finger Type Electrode Pattern for Large-scale Lateral GaN LED)

  • 양지원;김동호;김태근
    • 대한전자공학회논문지SD
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    • 제48권3호
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    • pp.12-17
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    • 2011
  • 본 논문에서는 기존의 대면적 수평형 GaN (Gallium Nitride) LED (Light-emitting diode) 전극패턴이 갖는 전류의 집중현상 및 소자 내 발열문제를 최소화하고 전기적 광학적 특성의 향상을 위하여 팔각 핑거 타입의 전극패턴을 제안하였고, 범용적으로 사용되는 기본 전극패턴 및 그를 대칭적으로 개량한 전극패턴과의 특성을 비교 분석하였다. 상용 3차원 시뮬레이터 SpecLED/RATRO를 통한 시뮬레이션 결과, 본 연구에서 제안한 팔각 핑거 타입의 전극패턴을 갖는 LED 소자가 동일한 350 mA의 전류주입 하에서의 동작전압이 약 0.34 V 정도 감소되는 전기적 특성의 향상을 확인하였고, 광출력 또한 타 구조에 비하여 약 7.72 mW 정도 향상되는 광학적 특성을 확인하였다.

A Study on Realization of Visible Light Communication System for Power Line Communication Using 8-bit Microcontroller

  • Yun, Ji-Hun;Hong, Geun-Bin;Kim, Yong-Kab
    • Transactions on Electrical and Electronic Materials
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    • 제11권5호
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    • pp.238-241
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    • 2010
  • The purpose of this study is to solve the problems of radio frequency bandwidth frequency depletion, confusion possibilities, and security that are in current wireless communications systems, and to confirm the possibility of applying those solutions for the next generation network. To solve the problems of the current wireless communications system, a visible light communications system for power line communication (PLC) via 8-bit microcontroller is created and the capacity is analyzed. The exclusive PLC chip APLC-485MA, an 8-bit ATmega16 microcontroller, high brightness 5pi light emitting diodes (LEDs), and the LLS08-A1 visible light-receiving sensor were used for the transmitter and receiver. The performance was analyzed using a designed program and an oscilloscope. The voltage change was measured as a function of distance from 10-50 cm. Blue LEDs showed the best performance among the measured LED types, with 0.47 V of voltage loss, but for a distance over 50 cm, precise data was not easy to obtain due to the weak light. To overcome these types of problems, specific values such as the changing conditions and efficiency value relevant to the light emitting parts and the visible light-receiving sensor should be calculated, and continuous study and improvements should also be realized for better communication conditions.

Gaussian Decomposition Method in Designing a Freeform Lens for an LED Fishing/Working Lamp

  • Nguyen, Anh Q.D.;Nguyen, Vinh H.;Lee, Hsiao-Yi
    • Current Optics and Photonics
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    • 제1권3호
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    • pp.233-238
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    • 2017
  • In this paper we propose a freeform secondary lens for an LED fishing/working lamp (LFWL). This innovative LED lamp is used to replace the traditional HID fishing lamp, to satisfy the lighting demands of fishing and the on-board activities on fishing boats. To realize the freeform lens's geometry, Gaussian decomposition is involved in our optics-design process for approaching the targeted light intensity distribution curve (LIDC) of the LFWL lens. The simulated results show that the illumination on the deck, on the sea's surface, and underwater shows only small differences between LED fishing/working lamps and HID fishing lamps. Meanwhile, a lighting efficiency of 91% with just one third of the power consumption can be achieved, when the proposed LED fishing/working lamps are used instead of HID fishing lamps.

Comparative study on the effect of cooling & heating loads by lighting energy of various light sources in an office building

  • Hong, Won Pyo
    • 조명전기설비학회논문지
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    • 제30권3호
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    • pp.94-105
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    • 2016
  • The objective of the work was to evaluate the impact of lighting energy to cooling and heating consumption in medium scale office building, when currently installed fluorescent lights were replaced with various LED lighting fixtures. This evaluation comes from an integrated approach combining the proper indoor lighting environment and the thermal aspects of cooling & heating consumption in office building. These simulations were performed by coupling an appropriate luminaire analysis for energy consumption and a dynamic thermal simulation software (TRNSYS). To analyze comparative study of effects on the heating, cooling loads, and energy consumption of an LED lamp application, 2 types of LED lamp with low light power watt(LPW) 24W and high LPW 7.5W and a fluorescent lights(FL) with 37W are used respectively. Integrated building energy consumption decreased up to 3.2% when fluorescent lamps were replaced with LEDs. Thus, the high LPW of LED(7.5W) replaced with the same number of FL shows an effective energy saving and cost- effective luminary.

Barrier-Transition Cooling in LED

  • Kim, Jedo
    • 동력기계공학회지
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    • 제17권5호
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    • pp.44-51
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    • 2013
  • This paper proposes and analyzes recycling of optical phonons emitted by nonradiative decay, which is a major thermal management concern for high-power light emitting diodes (LED), by introducing an integrated, heterogeneous barrier cooling layer. The cooling is proportional to the number of phonons absorbed per electron overcoming the potential barrier, while the multi-phonon absorption rate is inversely proportional to this number. We address the theoretical treatment of photon-electron-phonon interaction/transport kinetics for optimal number of phonons (i.e., barrier height). We consider a GaN/InGaN LED with a metal/AlGaAs/GaAs/metal potential barrier and discuss the energy conversion rates. We find that significant amount of heat can be recycled by the barrier transition cooling layer.

혼합 발광다이오드와 형광등에서 자란 적치마 상추의 생육 및 광 이용 효율 비교 (Comparison of Combined Light-emitting Diodes and Fluorescent Lamps for Growth and Light Use Efficiency of Red Leaf Lettuce)

  • 손기호;송민정;오명민
    • 생물환경조절학회지
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    • 제25권3호
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    • pp.139-145
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    • 2016
  • 본 연구의 목적은 폐쇄형 식물생산시스템에서 세가지 혼합 LED와 형광등에서 자란 적치마 상추의 생육과 광이용효율을 비교하는 것이다. 18일간 육묘한 적치마상추묘를 적색(R, 655nm), 청색(B, 456nm), 녹색(G, 515nm), 백색(W, 456nm + 558nm)의 혼합 LED(R:B=8:2, R:W:B=8:1:1, R:G:B=8:1:1)와 형광등이 설치된 폐쇄형 식물생산시스템에 정식하였다. 형광등에서 자란 상추는 모든 LED 처리에 비해 유의적으로 높은 엽형지수를 보였다. 지상부와 지하부 생육에서 LED 처리간 유의적 차이를 보이지 않았으나, 모든 LED 처리가 형광등에 비해 약 34% 지상부 생체중의 증가를 유도시켰다. 한편, 정식 후 4주차에 형광등의 총 소비 전력은 145kW인 반면, LED 처리구들에서 형광등의 약 1/3배인 54kW를 나타냈다. LED 처리구들의 건물중에 대비한 광 이용 효율은 약 34mg/W였으며, 이는 형광등 보다 약 3.5배 높은 값이었다. 결론적으로, 본 연구는 식물 생산 시스템에서 적절한 조합의 LED 조사는 형광등에 비해 상추 생장을 증진시킬 수 있으며 추가적으로 에너지 절감을 통해 광이용효율도 극대화 할 수 있음을 보여주었다.

마그네슘이 도핑된 GaN 공간층과 양자장벽층을 이용한 무분극 GaN 발광다이오드의 전기적/광학적 특성 향상 (Improvement of Electrical/optical Characteristics Using Mg-doped GaN Spacers and Quantum Barriers for Nonpolar GaN light-emitting Diodes)

  • 김동호;손성훈;김태근
    • 대한전자공학회논문지SD
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    • 제48권7호
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    • pp.10-16
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    • 2011
  • 본 논문에서는 고효율 고출력 무분극 GaN LED의 구현을 위하여 Mg이 도핑된 GaN spacer층 및 GaN quantum barrier(QB)층을 삽입한 구조를 제안하였다. 제안한 구조에 대한 물리적 해석을 위하여 일반적인 무분극 LED 에피구조와 본 연구에서 제안한 p-GaN spacer층 및 p-GaN QB층이 삽입된 무분극 LED 에피구조에 대해 상용화된 $SimuLED^{TM}$ 시뮬레이터를 이용하여 전기적/광학적 특성을 비교 분석하였다. 실험 결과, 본 연구에서 제안한 무분극 LED는 20 mA의 전류주입 하에서 동작전압($V_f$)이 일반적인 무분극 LED에 비해 약 3.7% 감소된 3.67 V의 전기적 특성을 갖는 것을 확인하였고, 광출력은 약 7% 향상된 2.13 mW의 광학적 특성을 갖는 구조임을 확인하였다. 또한, 내부양자효율(Internal quantum efficiency, IQE)과 광방출세기(emission peak intensity) 역시 각각 9.1% 및 170% 향상된 우수한 특성을 갖는 에피구조임을 확인하였다.

Demonstration of Nonpolar a-plane Light Emitting Diodes on r-plane Sapphire Substrate by MOCVD

  • Son, Ji-Su;Baik, Kwang-Hyeon;Song, Hoo-Young;Kim, Ji-Hoon;Kim, Tae-Geun;Hwang, Sung-Min
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.147-147
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    • 2011
  • High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

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다파장 IR과 NIR 모듈의 평균 수명 예측에 관한 연구 (Study on the MTTF of Multi Wave Lengths IR and NIR LEDs Module)

  • 김동표;김경섭
    • 한국전기전자재료학회논문지
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    • 제34권1호
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    • pp.44-49
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    • 2021
  • Recently, infrared (IR) and near-infrared (NIR) light-emitting diodes (LEDs) were widely used for home medical applications owing to its low output power and wide exposed area for curing. For deep penetration of the light under the skin, multiple LEDs with wavelengths of 700~10,000 nm were located on a flexible printed circuit board. When multiple wavelengths of LEDs were soldered on a circuit board, the lifetime of LED module highly depends on LEDs with a short lifetime. The mean time to failure (MTTF) was able to calculate with the experimental results under high temperature and the Arrhenius model. The results of this study could help companies to approve the warranty of LED modules and its product.

실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험 (Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package)

  • 김영필;고석철
    • 조명전기설비학회논문지
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    • 제29권4호
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    • pp.1-10
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    • 2015
  • The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.