• 한국재료학회지
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• 제22권11호
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• pp.636-641
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• 2012

In this study, we have investigated highly efficient nanoscale surface corrugated light emitting diodes (LEDs) for the enhancement of light extraction efficiency (LEE) of nitride semiconductor LEDs. Nanoscale indium tin oxide (ITO) surface corrugations are fabricated by using the conformal nanoimprint technique; it was possible to observe an enhancement of LEE for the ITO surface corrugated LEDs. By incorporating this novel method, we determined that the total output power of the surface corrugated LEDs were enhanced by 45.6% for patterned sapphire substrate LEDs and by 41.9% for flat c-plane substrate LEDs. The enhancement of LEE through nanoscale surface corrugations was studied using 3-dimensional Finite Different Time Domain (FDTD) calculation. From the FDTD calculations, we were able to separate the light extraction from the top and bottom sides of device. This process revealed that light extraction from the top and bottom sides of a device strongly depends on the substrate and the surface corrugation. We found that enhanced LEE could be understood through the mechanism of enhanced light transmission due to refractive index matching and the increase of light scattering from the corrugated surface. LEE calculations for the encapsulated LEDs devices also revealed that low LEE enhancement is expected after encapsulation due to the reduction of the refractive index contrast.

• Journal of the Optical Society of Korea
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• 제19권4호
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• pp.409-414
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• 2015

Light-emitting diodes (LED) have many advantages for dental astral lighting because of their high color rendering index (CRI), low power consumption, light weight and longer life. A dental astral lamp is specially designed and simulated for securing the extra space for installing a multimedia display that will be helpful for treating young patients. The optical system using the reverse dual reflection method consisted of four illumination modules disposed at the four corners of the dental astral lamp, and each module comprises a high power LED, an elliptical mirror, and a multifacet reflector assembly using eight cylindrical mirrors. It is shown that the required illuminance, illumination pattern, and the illumination uniformity are well satisfied.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 춘계학술대회
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• pp.686-689
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• 2012

본 논문에서는 ISE-TCAD를 이용하여 GaN 기반의 LED특성을 분석하였다. LED는 GaN 버퍼층을 기반으로 GaN 장벽과 InGaN 양자우물로 구성된 활성 영역, AlGaN EBL(Electron Blocking Layer)과 AlGaN HBL(Hole Blocking Layer)로 이루어져 있다. Auger 재결합률, 양자 우물의 폭과 수, EBL의 Al 몰분율의 변화에 따른 LED의 출력 전력 특성을 분석하고 효율 개선을 위한 몇 가지 기준을 제시하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제34권6호
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• pp.852-857
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• 2010

본 논문에서는 조명으로 사용되는 LED를 이용하여 실내 가시광 통신을 할 수 있는 시스템을 제안하고 있다. LED는 디지털 변조가 가능하므로 조명과 더불어 광무선 통신시스템으로 적용할 수 있다는 개념과 연구결과에 기인하여 기초연구를 수행하였다. LED는 고 휘도, 신뢰성, 저 전력 소비, 긴 수명의 장점을 가지므로 고 품질의 통신서비스를 제공하는 통신용 광원으로서도 적합하다. 본 연구에서는 오디오 전송을 위한 단방향 광무선 통신시스템과 텍스트 메시지를 전송하기 위한 양방향 통신시스템을 구현하여 통신 성능을 실험하였다. 이 실험결과는 실내 무선 환경을 지향하는 조명등의 내부회로로 설치될 수 있는 저가형 광통신 트랜시버의 구현이 가능함을 보여준다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 추계학술대회
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• pp.233-236
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• 2012

본 논문에서는 차단층 설계 변수에 따른 GaN 기반 LED의 출력 특성을 분석하였다. 사용된 LED의 기본 구조는 GaN 버퍼층을 기반으로 GaN 장벽과 InGaN 양자 우물로 이루어진 활성 영역이 AlGaN EBL(Electron Blocking Layer)과 AlGaN HBL(Hole Blocking Layer) 사이에 구성되어 있다. ISE-TCAD를 이용하여 GaN 기반 LED에서 EBL의 Al 몰분율과 두께, HBL의 Al 몰분율과 도핑 농도에 따른 출력 전력과 내부 양자 효율 특성을 분석하였다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 추계학술대회
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• pp.251-254
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• 2012

본 논문에서는 양자 우물 구조 변화에 따른 GaN 기반 LED의 출력 특성을 분석하였다. 사용된 LED의 기본 구조는 GaN 버퍼층을 기반으로 GaN 장벽과 InGaN 양자 우물로 이루어진 활성 영역이 AlGaN EBL(Electron Blocking Layer)과 AlGaN HBL(Hole Blocking Layer) 사이에 구성되어 있다. ISE-TCAD를 이용하여 LED 활성영역의 양자 우물의 두께와 개수, 장벽의 도핑 변화에 따른 출력 전력, 내부 양자 효율 특성을 분석하였다.

• 전력전자학회논문지
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• 제26권1호
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• pp.66-73
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• 2021

This study presents a novel four-channel light-emitting diode (LED) current balancing topology using a current-fed hybrid quasi-Z-source converter. With the proposed structure, currents flowing through four LED strings are automatically balanced owing to the charge (amp-sec) balance condition on capacitors. Thus, automatic current balancing of the proposed driver is simple and precise. In addition, the proposed LED driver uses only one active switch and three diodes. The operating principle and characteristics of the proposed four-channel LED driver are analyzed in detail. To verify the operation of the proposed LED driver, a prototype is built and tested with different numbers of LEDs.

• International Journal of Internet, Broadcasting and Communication
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• 제7권2호
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• 한국통신학회논문지
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• 제39C권3호
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2008년도 춘계학술대회 논문집
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• pp.216-219
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• 2008

The Power LED is more much than 1W and appliable to lights that is different from signal LED. In this paper we investigated types of tests in reliability assessment standards on Power LED. we make comparison of that military standards, JEITA(Japan Electronics and Information Technology Industries Association) and JEDEC(Joint Electron Device Engineering Council) with RS(reliability standard). Reliability tests should be considered that informations can be obtained from requirements of a real system Therefore, The paper aided companies to criteria for reliability tests by themselves.