• Title/Summary/Keyword: Power Transistors

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Design of CMOS Fractional-N Frequency Synthesizer for Bluetooth system (Bluetooth용 CMOS Fractional-N 주파수 합성기의 설계)

  • Lee, Sang-Jin;Lee, Ju-Sang;Yu, Sang-Dae
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.890-893
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    • 2003
  • In this paper, we have designed the fractional-N frequency synthesizer for bluetooth system using 0.35-um CMOS technology and 3.3-V single power supply. The designed synthesizer consist of phase-frequency detector (PFD), charge pump, loop filter, voltage controlled oscillator (VCO), frequency divider, and sigma-delta modulator. A dead zone free PFD is used and a modified charge pump having active cascode transistors is used. A Multi-modulus prescaler having CML D flip-flop is used and VCO having a tuning range from 746 MHz to 2.632 GHz at 3.3 V power supply is used. Total power dissipation is 32 mW and phase noise is -118 dBc/Hz at 1 MHz offset.

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Improved Circuit Model for Simulating IGBT Switching Transients in VSCs

  • Haleem, Naushath Mohamed;Rajapakse, Athula D.;Gole, Aniruddha M.
    • Journal of Power Electronics
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    • v.18 no.6
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    • pp.1901-1911
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    • 2018
  • This study presents a circuit model for simulating the switching transients of insulated-gate bipolar transistors (IGBTs) with inductive load switching. The modeling approach used in this study considers the behavior of IGBTs and freewheeling diodes during the transient process and ignores the complex semiconductor physics-based relationships and parameters. The proposed circuit model can accurately simulate the switching behavior due to the detailed consideration of device-circuit interactions and the nonlinear nature of model parameters, such as internal capacitances. The developed model is incorporated in an IGBT loss calculation module of an electromagnetic transient simulation program to enable the estimation of switching losses in voltage source converters embedded in large power systems.

Study on Electric Characteristics of IGBT Having P Region Under Trench Gate (Trench Gate 하단 P-영역을 갖는 IGBT의 전기적 특성에 관한 연구)

  • Ann, Byoung Sub;Yuek, Jinkeoung;Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.5
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    • pp.361-365
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    • 2019
  • Although there is no strict definition of a power semiconductor device, a general description is a semiconductor that has capability to control more than 1 W of electricity. Integrated gate bipolar transistors (IGBTs), which are power semiconductors, are widely used in voltage ranges above 300 V and are especially popular in high-efficiency, high-speed power systems. In this paper, the size of the gate was adjusted to test the variation in the yield voltage characteristics by measuring the electric field concentration under the trench gate. After the experiment Synopsys' TCAD was used to analyze the efficiency of threshold voltage, on-state voltage drop, and breakdown voltage by measuring the P- region and its size under the gate.

Input Voltage Range Extension Method for Half-Bridge LLC Converters by Using Magamp Auxiliary Post-Regulator

  • Jin, Xiaoguang;Lin, Huipin;Xu, Jun;Lu, Zhengyu
    • Journal of Power Electronics
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    • v.19 no.1
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    • pp.34-43
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    • 2019
  • An improved half-bridge LLC converter with a magamp auxiliary post-regulator is proposed in this paper. The function of the magamp is bypassed when the converter works within the low input-voltage range. Meanwhile, it operates as an auxiliary post-regulator when the input voltage is high. By changing the blocking time of the magamp, the dc gain of the converter can be extended. Hence, the input voltage range of the converter is extended. The realization of proposed topology does not require a complicated circuit. The controller of the magamp can be easily implemented using only passive components, transistors and an OP amp. The generalized operational principle is analyzed and the design criterion for the magamp is presented. Finally, a 25V output, 400W experimental prototype was built and tested for a 160-300V input-voltage range to verify the feasibility of the proposed method.

Implementation of a High Performance XOR-XNOR Circuit

  • Kim, Jeong-Beom
    • The Journal of the Korea institute of electronic communication sciences
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    • v.17 no.2
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    • pp.351-356
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    • 2022
  • The parity function can be implemented with XOR (exclusive-OR) and XNOR (exclusive NOR) circuit. In this paper we propose a high performance XOR-XNOR circuit. The proposed circuitreduced the internal load capacitance on critical path and implemented with 8 transistors. The circuit produces a perfect output signals for all input combinations. Compared with the previous circuits, the proposed circuit presents the improved characteristics in average propagation delay time, power dissipation, power-delay product (PDP), and energy-delay-product (EDP). The proposed circuits are implemented with standard CMOS 0.18um technology. Computer simulations using SPICE show that the proposed circuit realizes the expected logic functions and achieves a reasonable performance.

The crystallinity of silicon films deposited at low temperatures with Remote Plasma Enhanced Chemical Vapor Deposition(RPECVD) (원거리 플라즈마 화학증착을 이용한 규소 박막의 결정성)

  • 김동환;이일정;이시우
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.1-6
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    • 1995
  • Polycrystalline Si films have been used in many applications such as thin film transistors(TFT), image sensors and LSI applications. In this research deposition of Si films at low temperatures with remote plasma enhanced CVD from Si2H6-SiF4-H2 on SiO2 was studied and their crystallinity was investigated. It was condluded that growth of crystalline Si films was favorable with (1) low Si2H6 flow rates, (2) moderate plasma power, (3) moderate SiF4 flow rates, (4) moderate substrate temperature, and (5) suitable method of surface cleaning.

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MOS Temperature Compensated Crystal Oscillator

  • Izumiya, Shoji;Adachi, Takehiko
    • Proceedings of the IEEK Conference
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    • 2002.07b
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    • pp.1200-1203
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    • 2002
  • A temperature compensated Crystal Oscillator is widely used for the stable frequency source of mobile communication equipments. Recently, it has become necessary to reduce power consumption of TCXOs. In this paper, we have proposed a TCXO using weak inversion MOS transistors and have evaluated its fundamental characteristics.

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Dielectric Thin Film Using Atmospheric Pressure Plasma Polymerization

  • Choi, Sung-Lan;Kim, Hong-Doo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1444-1446
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    • 2009
  • The atmospheric pressure plasma polymerization of acrylate monomers was carried out to have dielectrics with easy preparation and high performance. The effects of discharge power, monomer concentration and deposition time on film properties were investigated using various characterization tools. With proper conditions, smooth dielectric layer of 100nm thickness was obtained. Dielectric property as organic dielectric layer has been studied for future applications in organic thin film transistors(OTFT).

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Design and Fabrication of S-band Ultra High Power Transistorized Amplifier (마이크로파대 고출력 트란지스터 증폭기의 설계와 시작)

  • 심재철;김종련
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.14 no.5
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    • pp.7-14
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    • 1977
  • Conventionally, a TIVT has been used for high power amplification in the microwave frequency range. However, an ultra-high-power amplifier in the 2GHz range has successfully been designed and fabricated employing high power transistors developed recently and available commercially. In the design of the amplifier, a balanced-pair configuration is adopted in order to obtain very high microwave power, and a good impedance matching is achieved by making use of microstripline techniques. For the RF power divider as well as combiner, an approach of stripline directional coupler isadopted because of its easiness in fabrication. The coupler so designed and fabricated indicates a satisfactory performance as a quadrature hybrie coupler. Measurements on the amplifier developed for an immediate commercial application also exhibit excellent overall performance characteristics RF power output, 14 watts, gain 14dB, frequency bandwidth, 160MHz, effciency 40%.

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DC and RF Characteristics of $0.15{\mu}m$ Power Metamorphic HEMTs

  • Shim, Jae-Yeob;Yoon, Hyung-Sup;Kang, Dong-Min;Hong, Ju-Yeon;Lee, Kyung-Ho
    • ETRI Journal
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    • v.27 no.6
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    • pp.685-690
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    • 2005
  • DC and RF characteristics of $0.15{\mu}m$ GaAs power metamorphic high electron mobility transistors (MHEMT) have been investigated. The $0.15{\mu}m{\times}100{\mu}m$ MHEMT device shows a drain saturation current of 480 mA/mm, an extrinsic transconductance of 830 mS/mm, and a threshold voltage of -0.65 V. Uniformities of the threshold voltage and the maximum extrinsic transconductance across a 4-inch wafer were 8.3% and 5.1%, respectively. The obtained cut-off frequency and maximum frequency of oscillation are 141 GHz and 243 GHz, respectively. The $8{\times}50{\mu}m$ MHEMT device shows 33.2% power-added efficiency, an 18.1 dB power gain, and a 28.2 mW output power. A very low minimum noise figure of 0.79 dB and an associated gain of 10.56 dB at 26 GHz are obtained for the power MHEMT with an indium content of 53% in the InGaAs channel. This excellent noise characteristic is attributed to the drastic reduction of gate resistance by the T-shaped gate with a wide head and improved device performance. This power MHEMT technology can be used toward 77 GHz band applications.

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