• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• Nuclear Engineering and Technology
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• 제54권9호
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• pp.3293-3298
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• 2022

Removing radioactive contaminated metal materials is a vital task during the decommissioning of nuclear power plants to reduce the cost of the post-dismantling process. The laser decontamination technique has been recognized as a key tool for a successful dismantling process as it enables a remote operation in radioactive facilities. It also minimizes exposure of workers to hazardous materials and reduces secondary waste, increasing the environmental friendless of the post-dismantling processing. In this work, we present a thorough and efficient laser decontamination approach using a single-mode continuous-wave (CW) laser. We subjected stainless steels to a surface-removal process that repetitively exposes the laser to a confined region of ~75 ㎛ at a high scanning rate of 10 m/s. We evaluate the decontamination performance by measuring the removal depth with a 3D scanning microscope and further investigate optimal removal conditions given practical parameters such as the laser power and scan properties. We successfully removed the metal surface to a depth of more than 40 ㎛ with laser power of 300 W and ten scans, showing the potential to achieve an extremely high DF more than 1000 by simply increasing the number of scans and the laser power for the decontamination of primary circuits.

• 대한치과보철학회지
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• 제40권1호
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• pp.68-78
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• 2002

The post core system has been used for reconstructon of severely damaged crown by caries or trauma. But problems such as crown exfoliation, post core fracture and root fracture have been reported. Ideal mechanical properies of the post require high fracture strength, high elastic limit and high resistance against fatigue and corrosion Modulus of elasticity of the post should be similar with that of dentine. Low hardness is also required for the convenience of post removal in failure. Furthermore, the post itself must be translucent for the esthetical purpose. Several types of the post have been developed to satisfy the criteria above mentioned. The purpose of this study was to find out the mechanical properties of quartz fiber post by comparing with those of gold post and zirconia post. The results of this study were as follows : 1. Maximal fracture strength and stiffness of quartz fiber post were similar with those of gold post and zirconia post. 2. Young's modulus and hardness of quartz fiber post were lower than those of gold post and zirconia post. Mechanical property of quartz fiber post against post fracture was similar with that of gold post and zirconia post. Mechanical property of quartz fiber post against root fracture was higher than that of gold post and zirconia post. Quartz fiber post could be removed easily due to low hardness.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2004년도 춘계 학술대회 (제121회) 초록집
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• pp.298-300
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• 2004

• 반도체디스플레이기술학회지
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• 제16권1호
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• pp.22-28
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• 2017

The result of stripping process for the removal of the post etch/ash Photoresist (PR) residue on an aluminum patterned wafer by using supercritical $CO_2$ ($sc-CO_2$) mixture, was investigated by scanning of electron microscope (SEM) inspection of wafer, measuring the cloud points and visual observation of the state of $sc-CO_2$ mixtures. It was found that $sc-CO_2$ mixtures were made by mixing additives and $sc-CO_2$ should form homogeneous and transparent phase (HTP) in order to effectively and uniformly remove the post etch/ash PR residue on the aluminum patterned wafer using them. The additives were formulated by mixing and co-solvents like an amine compound and fluorosurfactants used as HTP agents, and the PR residue on the wafer were able to be rapidly and effectively removed using the $sc-CO_2$ mixture of HTP. The five kinds of additives were formulated by the recipe of mixing co-solvents and surfactants, which were able to remove PR residue on the wafer by mixing with $sc-CO_2$ at the stripping temperature range from 40 to $80^{\circ}C$. The five kinds of $sc-CO_2$ mixtures which were named as PR removers were made, which were able to form HTP within the above described stripping temperature. The cloud points of $sc-CO_2$ mixtures were measured to find correlation between them and HTP.

• 한국환경보건학회지
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• 제27권3호
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• pp.99-106
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• 2001

A laboratory experiment was performed to investigate phosphorus and nitrogen removal from synthetic wastewater by intermittently activated sludge process packed with aluminium plate. Three continuous experimental systems, I. e. an intermittently activated sludge process(Run A), an intermittently activated sludge process with an aluminium plate packed into the reactor(Run B), and a reactor post stage(Run C) were compared. In the batch experiments, the phosphorus removal time in the reactor packed with copper and aluminium plate simultaneously was faster than that of the reactor packed with only an aluminium plates. However, the reactor packed with only an aluminium plate could be used for phosphorus removal. Move phosphorus was removed with an increase of surface area of aluminium plate and electrolysis(NaCl) concentration. The efficiency of COD and nitrogen removal was not affected in Run B. However, the phosphrus removal efficiency decreased because of reaction products and activated sludge which gradually covered gradually the surface of the aluminium plate. The efficiency of phosphorus removal in Run C was 86.3% at the HRT of 3.2 hours. Especially, the efficiency of phosphorus removal in Run C was higher than that in Run B.

• 한국환경보건학회지
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• 제35권3호
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• pp.214-219
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• 2009

This study examined the removal efficiency of the nitrogen and phosphorus in order to compensate for the combined process of ATAD(Autothermal Thermophilic Aaerobic Digestion) and EGSB(Expended Granular Sludge Bed), which are treatment methods for livestock wastewater, by introducing SBR(Sequencing Batch Reactor) as post-treatment process. The analysis on the treatment efficiency of each operation mode showed that, in the case of T-N, the treatment efficiency were 67.1% and 74.2% for Run-1 and Run-2, respectively, and in the case of T-P, the values were 71.2 and 74.1, respectively, which are indicating that the treatment efficacy is higher in the condition of Run-1, in which the time period of Anoxic and Aerobic segments were increased. In addition, the result of analyzing removal characteristics of nitrogen and phosphorus by Influx load showed that removal efficiency of nitrogen was better in the case of high influx load than in the case of low influx load. Regardless of Influx load, phosphorus showed constant influx concentration, so that removal efficiency of phosphorus was influenced littler by Influx load than that of nitrogen. This study also fed methanol as an external carbon source and performed experiment to induce denitrification under anoxic condition by using nitrate among nitrogen compounds of SBR reactor, and the results showed that intermittent feeding was more effective in Nitrogen Removal than composite feeding.

• 상하수도학회지
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• 제11권4호
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• pp.110-117
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• 1997

Performances of combined adsorption and coagulation were evaluated as one of the options for pre-treatment or post-treatment of MSW landfills leachate and industrial landfill leachate. The COD and color removals of leachate from an old MSW landfill were 35% and 33% at an alum dose of 300mg/L with preceding PAC(powdered activated carbon) dose of 200mg/L, respectively. The COD and color removals of leachate from an young MSW landfill were 58% and 25% at an alum dose of 700mg/L and PAC dose of 500mg/L, respectively. The COD and color of biologically treated leachate from an industrial waste landfill were removed up to 32% and 68%, respectively, with pH control at addition of 500mgAlum/L and 1,000mgPAC/L. Adsorption and coagulation process with pH control showed better COD and color removals than the process without pH control for biologically treated leachate from an industrial waste landfill. The color removal was influenced greatly by pH control, while COD removal was not significant. No difference in removal efficiency was observed between adsorption-coagulation and coagulation-adsorption process. The COD removal was accomplished mainly by adsorption, while coagulation was a key mechanism of color removal. However, the mechanism of COD removal was obscure, when BOD/COD ratio was high. Maximum net increases in COD and color removals by the adsorption-coagulation process were respectively 45% and 46% compared with the unit process of adsorption or coagulation, although those removals depended on leachate characteristics. Thus, adsorption-coagulation process was considered to be effective for pre- and post-treatment of landfill leachate, and has distinct features of simple, flexible, stable and reliable operation against fluctuation leachate quality and flowrate.

• Computers and Concrete
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• 제12권3호
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• pp.351-375
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• 2013

Post-punching resistance of a flat slab can help redistribute the gravity loads and resist progressive collapse of a structure following initial damage. One important difficulty with accounting for the post-punching strength of a slab is the discontinuity that develops following punching shear. A numerical simulation technique is proposed here to model and evaluate post-punching resistance of flat slabs. It is demonstrated that the simulation results of punching shear and post-punching response of the model of a slab on a single column are in good agreement with corresponding experimental data. It is also shown that progressive collapse due to a column removal (explosion) can lead to punching failure over an adjacent column. Such failure can propagate throughout the structure leading to the progressive collapse of the structure. Through post-punching modeling of the slab and accounting for the associated discontinuity, it is also demonstrated that the presence of an adequate amount of integrity reinforcement can provide an alternative load path and help resist progressive collapse.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.24-27
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• 2001

The end point of oxide chemical mechanical polishing (CMP) have determined by polishing time calculated from removal rate and target thickness of oxide. This study is about control of oxide removal amounts on the shallow trench isolation (STI) patterned wafers using removal rate and thickness of blanket (non-patterned) wafers. At first, it was investigated the removal properties of PETEOS blanket wafers, and then it was compared with the removal properties and the planarization (step height) as a function of polishing time of the specific STI patterned wafers. We found that there is a relationship between the oxide removal amounts of blanket and patterned wafers. We analyzed this relationship, and the post CMP thickness of patterned wafers could be controlled by removal rate and removal target thickness of blanket wafers. As the result of correlation analysis, we confirmed that there was the strong correlation between patterned and blanket wafer (correlation factor: 0.7109). So, we could confirm the repeatability as applying for STI CMP process from the obtained linear formula. As the result of repeatability test, the differences of calculated polishing time and actual polishing time was about 3.48 seconds. If this time is converted into the thickness, then it is from 104 $\AA$ to 167 $\AA$. It is possible to be ignored because process margin is about 1800 $\AA$.