• Journal of Surface Science and Engineering
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• v.29 no.6
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• pp.766-772
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• 1996

Undoped $SnO_x$ thin films were deposited on Si(100) substrate by using reactive ioassisted deposition technique (R-IAD). In order to investigate the effect of initial oxygen content and heat treatment on the oxidation state and crystalline structure of tin oxide films, $SnO_x$ thin films were post-annealed at 400~$600^{\circ}C$ for 1 hr. in a vacuum ~$5 \times 10^{-3}$ -3/ Torr or were directly deposited on the substrate of $400^{\circ}C$ and the relative arrival ration ($Gamma$) of oxygen ion to Sn metal varied from 0.025 to 0.1, i.e., average impinging energy ($E_a$) form 25 to 100 eV/atom. As $E_a$ increased, the composition ratio of $N_ON{sn}$ changed from 1.25 to 1.93 in post-annealing, treatment and 1.21 to 1.87 in in-situ substrate heating. In case of post-annealing, the oxidation from SnO to $SnO_2$ was closely related to initial oxygen contents and post-annealing temperature, and the perfect oxidation of $SnO_2$ in the film was obtained at higher than $E_a$=75 eV/atom and $600^{\circ}C$. The temperature for perfect oxidation of $SnO_2$ was reduced as low as $400^{\circ}C$ through in-situ substrate heating. The variation of the chemical state of $SnO_x$ thin films with changing $E_a$'s and heating method were also observed by Auger electron spectroscopy.

• Journal of the Korean Ceramic Society
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• v.38 no.10
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• pp.871-875
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• 2001

Cobalt silicidation at sidewall spacer edge of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) with post annealing treatment for capacitor forming process has been investigated as a function of dopant species. Cobalt silicidation of nMOSFET with n-type Lightly Doped Drain (LDD) and pMOSFET with p-type LDD produces a well-developed cobalt silicide with its lateral growth underneath the sidewall spacer. In case of pMOSFET with n-type LDD, however, a void is formed at the sidewall spacer edge with no lateral growth of cobalt silicide. The void formation seems to be due to a retarded silicidation process at the LDD region during the first Rapid Thermal Annealing (RTA) for the reaction of Co with Si, resulting in cobalt mono silicide at the LDD region. The subsequent second RTA converts the cobalt monosilicide into cobalt disilicide with the consumption of Si atoms from the Si substrate, producing the void at the sidewall spacer edge in the Si region. The void formed at the sidewall spacer edge serves as a resistance in the current-voltage characteristics of the pMOSFET device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.120-121
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• 2007

Nano-floating gate memory (NFGM) devices were fabricated by using the low temperature poly-Si thin films crystallized by ELA and the $In_2O_3$ nano-particles embedded in polyimide layers as charge storage. Memory effect due to the charging effects of $In_2O_3$ nano-particles in polyimide layer was observed from the TFT NFGM. The post-annealing in 3% diluted hydrogen $(H_2/N_2)$ ambient improved the retention characteristics of $In_2O_3$ nano-particles embedded poly-Si TFT NFGM by reducing the interfacial states as well as grain boundary trapping states.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.167-171
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• 2003

We report the material and electrical properties of $CoSi_2$ and $NiSi_2$contacts to n-type 4H-SiC depending on the post-annealing and the metal covering conditions. The Ni and Co silicides are deposited by RF sputtering with Ni/Si/Ni and Co/Si/Co films separately deposited on 4H-SiC substrates. The deposited films are annealed at $800\;^{\circ}C$ in $Ar:H_2$ (9:1) gas ambient. Results of the specific surface resistivity measurements show that the resistivity of the Co-based metal contact was the one order lower than that of the Ni-based contact. The specific contact resistance was measured by a transmission line technique, and the specific contact resistivity of $1.5{\times}10^{-6}\;{\Omega}\;cm^2$ is obtained for Co/Si/Co metal structures after a two-step annealing; at $550\;^{\circ}C$ for 10 min and $800\;^{\circ}C$ for 3min. The physical properties of the contacts were examined by using XRD and AES, and the results indicate that the Co-based metal contacts have better structural stability of silicide phases formed after the high temperature annealing.

• The Journal of Advanced Prosthodontics
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• v.5 no.4
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• pp.471-478
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• 2013

PURPOSE. The aim of the study was to evaluate the effect of annealing on the nanostructure and hardness of Co-Cr metal ceramic samples that were fabricated with a direct metal laser sintering (DMLS) technique. MATERIALS AND METHODS. Five groups of Co-Cr dental alloy samples were manufactured in a rectangular form measuring $4{\times}2{\times}2$ mm. Samples fabricated by a conventional casting technique (Group I) and prefabricated milling blanks (Group II) were examined as conventional technique groups. The DMLS samples were randomly divided into three groups as not annealed (Group III), annealed in argon atmosphere (Group IV), or annealed in oxygen atmosphere (Group V). The nanostructure was examined with the small-angle X-ray scattering method. The Rockwell hardness test was used to measure the hardness changes in each group, and the means and standard deviations were statistically analyzed by one-way ANOVA for comparison of continuous variables and Tukey's HSD test was used for post hoc analysis. P values of <.05 were accepted as statistically significant. RESULTS. The general nanostructures of the samples were composed of small spherical entities stacked atop one another in dendritic form. All groups also displayed different hardness values depending on the manufacturing technique. The annealing procedure and environment directly affected both the nanostructure and hardness of the Co-Cr alloy. Group III exhibited a non-homogeneous structure and increased hardness ($48.16{\pm}3.02$ HRC) because the annealing process was incomplete and the inner stress was not relieved. Annealing in argon atmosphere of Group IV not only relieved the inner stresses but also decreased the hardness ($27.40{\pm}3.98$ HRC). The results of fitting function presented that Group IV was the most homogeneous product as the minimum bilayer thickness was measured (7.11 ${\AA}$). CONCLUSION. After the manufacturing with DMLS technique, annealing in argon atmosphere is an essential process for Co-Cr metal ceramic substructures. The dentists should be familiar with the materials that are used in clinic for prosthodontics treatments.

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1051-1057
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• 2000

TiO$_2$와 CeO$_2$박막을 Si 위에 증착한 후 MOCVD법에 의해 PbTiO$_3$박막을 증착하여 MFIS 구조를 형성하였다. 절연층의 후열처리가 절연층 및 MFIS 구조의 전기적 특성에 미치는 영향을 관찰하기 위해 산소분위기와 $600^{\circ}C$~90$0^{\circ}C$의 온도범위에서 후 열처리를 행하였고, C-V 특성 및 누설전류 특성을 분석하였다. CeO$_2$와 TiO$_2$박막의 유전상수는 증착 직후 6.9와 15였으며, 90$0^{\circ}C$ 열처리를 행한 후 약 4.9와 8.8로 감소하였다. 누설전류밀도 역시 증착 직후 각각 7$\times$$10^{-5}$ A/$ extrm{cm}^2$와 2.5$\times$$10^{-5}$ A/$\textrm{cm}^2$에서 90$0^{\circ}C$ 열처리를 거친 후에 약 4$\times$$10^{-8}$ A/$\textrm{cm}^2$와 4$\times$$10^{-9}$ A/$\textrm{cm}^2$로 감소하였다. Ellipsometry 시뮬레이션을 통해 계산된 계면층의 두께는 90$0^{\circ}C$에서 약 115$\AA$(CeO$_2$) 및 140$\AA$(TiO$_2$)까지 증가하였다. 계면층은 MFIS 구조에서 강유전층에 인가되는 전계를 감소시켜 항전계를 증가시켰고, charge injection을 방지하여 Al/PbTiO$_3$/CeO$_2$(90$0^{\circ}C$, $O_2$)/Si 구조의 경우 $\pm$2 V~$\pm$10 V의 측정범위에서 memory window가 계속 증가하는 것을 보여주었다.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.310-316
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• 2010

Recently a fuel oil of the diesel engine of the marine ship is being changed with heavy oil of low quality as the oil price is higher more and more. Therefore the wear and corrosion in all parts of the engine such as cylinder liner, piston crown, spindle and seat ring of exhaust valves are predominantly increased. In particular the degree of wear and corrosion of piston crown is more seriously compared to the other parts of the engine due to operating in severe environment such as the high temperature of exhaust gas and repeating impact. Thus the repair weldment of the piston crown is a unique method to prolong the its life in a economical point of view. In this case, filler metals having a high corrosion and wear resistance such as stellite 6, Inconel 625 and Inconel 718 are mainly being used for repair welding. However it has been often happened that piston crown on the ship,s job site is being actually inevitably welded with mild filler metals. Therefore in this study, filler metals such as E4301, E4313 and E4316 were welded at SS401 steel as the base metal, and corrosion property of their weld metals in the case of post weld heat treatment or not was investigated with some electrochemical methods such as measurement of corrosion potential, cathodic and anodic polarization curves, cyclic voltammogram and polarization resistance etc. in 0.1% $H_2SO_4$ solution. Corrosion resistance of the weld metal of E4301 was better than the other weld metals in the case of no heat treatment, however, its resistance was considerably decreased with post weld heat treatment(annealing:$625^{\circ}C$, 2 hr) compared to other weld metals. The weld metals of E4313 and E4316 showed a relatively good corrosion resistance by post weld heat treatment.

• Transactions of Materials Processing
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• v.32 no.2
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• pp.67-73
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• 2023

To overcome a climate change, manufacturing complex-shaped electric mobility parts becomes one of the important issues for enhancing a performance of motor with reducing their weight. Therefore, development of laser-based additive manufacturing shed on light due to their flexible manufacturing capacity that can be suitable to solve the poor formability of Fe-Si alloys for electric mobility parts. Although there are several studies existed to optimize the performance of additively manufactured Fe-Si alloys, the post-annealing effect was not well investigated yet though this is important to control the texture and mechanical properties of additively manufactured parts. In the present work, annealing effect on the mechanical property and microstructure of additively manufactured Fe-4.5Si alloy was investigated. Because of the ordered phase initiation after annealing, the hardness of additively manufactured Fe-4.5Si alloy increased up to 1173 K while a hardness drop occurs at the 1273 K condition due to the micro-crack initiation. The response surface methodology result represents the 1173 K-5 h sample is an optimal condition to maximize the mechanical property of additively manufactured alloy without micro-cracks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.832-835
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• 2001

We report the structural and electrical properties of hafnium oxide (HfO$_2$) films with tungsten silicide (WSi$_2$) metal gate. In this study, HfO$_2$thin films were fabricated by oxidation of sputtered Hf metal films on Si, and WSi$_2$was deposited directly on HfO$_2$by LPCVD. The hysteresis windows in C-V curves of the WSi$_2$HfO$_2$/Si MOS capacitors were negligible (<20 mV), and had no dependence on frequency from 10 kHz to 1 MHz and bias ramp rate from 10 mV to 1 V. In addition, leakage current was very low in the range of 10$^{-9}$ ~10$^{-10}$ A to ~ 1 V, which was due to the formation of interfacial hafnium silicate layer between HfO$_2$and Si. After PMA (post metallization annealing) of the WSi$_2$/HfO$_2$/Si MOS capacitors at 500 $^{\circ}C$ EOT (equivalent oxide thickness) was reduced from 26 to 22 $\AA$ and the leakage current was reduced by approximately one order as compared to that measured before annealing. These results indicate that the effect of fluorine diffusion is negligible and annealing minimizes the etching damage.

• The Korean Journal of Ceramics
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• v.1 no.1
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• pp.21-28
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• 1995

Electrical conductivity of $TiO_2$ thin films, deposited on $Al_2O_3$ substrates by metal organic chemical vapor deposition (MOCVD), was measured by four-point probe method in a temperature range from $800^{\circ}C$ to $1025^{\circ}C$ and an oxygen partial pressure range from $2.7{\times}10^{-5}$ atm to 1 atm. In the low oxygen partial pressure region n-type conduction was dominant, but in the high oxygen partial pressure region p-type conduction behavior appeared due to substitution of Ti ions by Al ions, which were diffused from the substrate during post deposition annealing process. Electrical conductivity of the film decreases in the n-type region and increases in the p-type region as the oxygen partial pressure increases. The transition points, which show the minimum conductivity, shifted to the higher oxygen partial pressure region as the measuring temperature increased, but it shifted to lower oxygen partial pressure region with an increase in the post annealing temperature. The results were also discussed with the possible defect models.