• 한국재료학회지
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• 제29권5호
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• pp.322-327
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• 2019

Hole carrier selective MoOx film is obtained by atomic layer deposition(ALD) using molybdenum hexacarbonyl[$Mo(CO)_6$] as precursor and ozone($O_3$) oxidant. The growth rate is about 0.036 nm/cycle at 200 g/Nm of ozone concentration and the thickness of interfacial oxide is about 2 nm. The measured band gap and work function of the MoOx film grown by ALD are 3.25 eV and 8 eV, respectively. X-ray photoelectron spectroscopy(XPS) result shows that the $Mo^{6+}$ state is dominant in the MoOx thin film. In the case of ALD-MoOx grown on Si wafer, the ozone concentration does not affect the passivation performance in the as-deposited state. But, the implied open-circuit voltage increases from $576^{\circ}C$ to $620^{\circ}C$ at 250 g/Nm after post-deposition annealing at $350^{\circ}C$ in a forming gas ambient. Instead of using a p-type amorphous silicon layer, high work function MoOx films as hole selective contact are applied for heterojunction silicon solar cells and the best efficiency yet recorded (21 %) is obtained.

• 열처리공학회지
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• 제35권4호
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• pp.185-192
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• 2022

Variations in the microstructure and mechanical properties of API X70 steel processed by piping, electrical resistance welding (ERW), and post seam annealing (PSA) are investigated in this study. In the welding zone, some elongated pearlites are formed and grains coarsening occurs due to extra heat caused by the ERW and PSA processes. After the piping, the base metal shows continuous yielding behavior and a decrease in yield and impact strengths because mobile dislocation and back stress are introduced during the piping process. On the other hand, the ERW and PSA processes additionally decreased the impact strength of welding zone at room and low temperatures because some elongated pearlites easily act as crack initiation site and coarse ferrite grains facilitate crack propagation. As a result, the fracture surface of the welding zone specimen tested at low temperature revealed mostly cleavage fracture unlike the base metal specimen.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2002년도 학술대회 논문집
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• pp.339-339
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• 2002

In the RABiTS approach to coated conductor development, successful (both economic and technological) depends on the refinement and optimization of each of three important components: the metal tape substrate, the buffer layer(s), and the HTS layer. Here we will report on the ORNL approach and progress in each of these areas. - Most applications will require metal tapes with low magnetic hysteresis, mechanical strength, and excellent crystalline texture. Some of these requirements are competing. We report on progress in obtaining a good combination of these characteristics on metal alloys of Ni-Cr and Ni-W. - The deposition of appropriate buffer layers is a crucial step. Recently, base research has shown that the presence of a stable sulfur superstructure present on the metal surface is needed for the nucleation and epitaxial growth of vapor-deposited seed buffer layers such as YSZ, CeO$_2$ and SrTiO$_3$. We report on the details and control of this superstructure for nickel tapes, as well as recent results for Cu and Ni-13%Cr. - Processes for deposition of the HTS coating must economically provide large values of the figure-of-merit for conductors, current x length. At ORNL, we have devoted efforts to a precursor/post-annealing approach to YBCO coatings, for which the deposition and reaction steps are separate. We describe motivation for and progress toward developing this approach. - Finally, we address some issues for the implementation of coated conductors in real applications, including the need for texture control and electrical stabilization of the HTS coating.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.154-155
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• 2012

The promise of nano-crystalites (nc) as a technological material, for applications including display backplane, and solar cells, may ultimately depend on tailoring their behavior through doping and crystallinity. Impurities can strongly modify electronic and optical properties of bulk and nc semiconductors. Highly doped dopant also effect structural properties (both grain size, crystal fraction) of nc-Si thin film. As discussed in several literatures, P atoms or radicals have the tendency to reside on the surface of nc. The P-radical segregation on the nano-grain surfaces that called self-purification may reduce the possibility of new nucleation because of the five-coordination of P. In addition, the P doping levels of ${\sim}2{\times}10^{21}\;at/cm^3$ is the solubility limitation of P in Si; the solubility of nc thin film should be smaller. Therefore, the non-activated P tends to segregate on the grain boundaries and the surface of nc. These mechanisms could prevent new nucleation on the existing grain surface. Therefore, most researches shown that highly doped nc-thin film by using conventional PECVD deposition system tended to have low crystallinity, where the formation energy of nucleation should be higher than the nc surface in the intrinsic materials. If the deposition technology that can make highly doped and simultaneously highly crystallized nc at low temperature, it can lead processes of next generation flexible devices. Recently, we are developing a novel CVD technology with a neutral particle beam (NPB) source, named as neutral beam assisted CVD (NBaCVD), which controls the energy of incident neutral particles in the range of 1~300eV in order to enhance the atomic activation and crystalline of thin films at low temperatures. During the formation of the nc-/pm-Si thin films by the NBaCVD with various process conditions, NPB energy directly controlled by the reflector bias and effectively increased crystal fraction (~80%) by uniformly distributed nc grains with 3~10 nm size. In the case of phosphorous doped Si thin films, the doping efficiency also increased as increasing the reflector bias (i.e. increasing NPB energy). At 330V of reflector bias, activation energy of the doped nc-Si thin film reduced as low as 0.001 eV. This means dopants are fully occupied as substitutional site, even though the Si thin film has nano-sized grain structure. And activated dopant concentration is recorded as high as up to 1020 #/$cm^3$ at very low process temperature (＜ $80^{\circ}C$) process without any post annealing. Theoretical solubility for the higher dopant concentration in Si thin film for order of 1020 #/$cm^3$ can be done only high temperature process or post annealing over $650^{\circ}C$. In general, as decreasing the grain size, the dopant binding energy increases as ratio of 1 of diameter of grain and the dopant hardly be activated. The highly doped nc-Si thin film by low-temperature NBaCVD process had smaller average grain size under 10 nm (measured by GIWAXS, GISAXS and TEM analysis), but achieved very higher activation of phosphorous dopant; NB energy sufficiently transports its energy to doping and crystallization even though without supplying additional thermal energy. TEM image shows that incubation layer does not formed between nc-Si film and SiO2 under later and highly crystallized nc-Si film is constructed with uniformly distributed nano-grains in polymorphous tissues. The nucleation should be start at the first layer on the SiO2 later, but it hardly growth to be cone-shaped micro-size grains. The nc-grain evenly embedded pm-Si thin film can be formatted by competition of the nucleation and the crystal growing, which depend on the NPB energies. In the evaluation of the light soaking degradation of photoconductivity, while conventional intrinsic and n-type doped a-Si thin films appeared typical degradation of photoconductivity, all of the nc-Si thin films processed by the NBaCVD show only a few % of degradation of it. From FTIR and RAMAN spectra, the energetic hydrogen NB atoms passivate nano-grain boundaries during the NBaCVD process because of the high diffusivity and chemical potential of hydrogen atoms.

• Nuclear Engineering and Technology
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• 제22권4호
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• pp.337-350
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• 1990

약 28$0^{\circ}C$에서 4.84$\times$$10^{18}$ n/$\textrm{cm}^2$의 중성자 조사를 받은 원자로 압력용기강 A533B Cl.1 기 지 금속(base metal)을 열처리한 후, 미세경도 측정과 양전자 소멸법을 사용해서 조사경화회복기구에 관한 더 정확한 연구를 하였다. 등시소둔 실험에 의해 2가지 회복과정이 존재한다는 것을 알 수 있었다. 첫번째 회복과정은 280-35$0^{\circ}C$ 사이에서 일어나며 양전자 소멸법에 의한 몇가지 파라메타 즉, 양전자 수명, 양전자 소멸밀도(I)와 Ip, Iw, R파라메타 값들에 의하면 이 회복과정에서 공공응집(agglomeration of vacancies)과 단위공공의 소멸(annihilation of monovacancies)이 일어나는 것으로 해석되었다. 또한 두번째 회복과정은 405$^{\circ}C$ 이상의 고온에서 발생하며, 양전자소멸 파라메타들은 공공형 결함 주위에 부착되었던 탄소원자의 용해, 석출물의 용해 그리고 단위공공의 소멸이 이 회복과정에서 일어나는 것으로 해석되었다. 그러고 두 회복과정의 중간 온도 영역인 305-405$^{\circ}C$에서는 탄소가 부착된 공공결집체 (vacancy clusters)의 형성과 석출물의 형성에 의한 소둔중경화(radiation anneal hardening)가 일어나는 것으로 해석되었다. Meechan-Brinkman 방법을 이용하여 활성화 에너지와 반응차수 및 그외 회복특성을 구하였다. 첫번째 회복과정의 활성화 에너지는 1.76eV로, 두번째 회복과정의 값은 2.00eV로 결정되었다. 이 값들은 다른 연구결과에 비해 낮은 편인데 이 차이는 이 연구에서 사용된 압력용기강의 낮은 탄소양에 의한 것으로 생각된다. 또한 첫번째 회복과정의 반응차수는 1.78로 두번째 회복과정의 반응차수는 1.67로 결정되었다. 회복과정에서의 반응차수가 정수가 아닌 것은 한 회복과정에 1차나 2차의 반응차수를 가진 몇 가지 기구들이 복합되어 있기 때문인 것으로 생각된다. 이것은 양전자 소멸의 몇 가지 파라메타에 의한 결과를 뒷받침한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.202-208
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• 2001

In Recent results suggested that doping $Ta_2O_5$ with a small amount of $TiO_2$ using standard ceramic processing techniques can increase the dielectric constant of $Ta_2O_5$ significantly. In this paper, this concept is studied using RTCVD (Rapid Thermal Chemical Vapor Deposition). Ti-doped $Ta_2O_5$ films are deposited using $TaC_{12}H_{30}O_5N$, $C_8H_{24}N_4Ti$, and $O_2$ on both Si and $NH_3$-nitrided Si substrates. An $NH_3$-based interface layer at the Si surface is used to prevent interfacial oxidation during the CVD process and post deposition annealing is performed in $H_2/O_2$ ambient to improve film quality and reduce leakage current. A sputtered TiN layer is used as a diffusion barrier between the Al gate electrode and the $TaTi_xO_y$ dielectric. XPS analyses confirm the formation of a ($Ta_2O_5)_{1-x}(TiO_2)_x$ composite oxide. A high quality $TaTi_xO_y$ gate stack with EOT (Equivalent Oxide Thickness) of $7{\AA}$ and leakage current $Jg=O.5A/textrm{cm}^2$ @ Vg=-1.0V has been achieved. We have also succeeded in forming a $TaTi_x/O_y$ composite oxide by rapid thermal oxidation of the as-deposited CVD TaTi films. The electrical properties and Jg-EOT characteristics of these composite oxides are remarkably similar to that of RTCVD $Ta_2O_5, suggesting that the dielectric constant of $Ta_2O_5$ is not affected by the addition of $TiO_2$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.341-341
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• 2016

The discovery of light emission in nanostructured silicon has opened up new avenues of research in nano-silicon based devices. One such pathway is the application of silicon quantum dots in advanced photovoltaic and light emitting devices. Recently, there is increasing interest on the silicon quantum dots (c-Si QDs) films embedded in amorphous hydrogenated silicon-nitride dielectric matrix (a-SiNx: H), which are familiar as c-Si/a-SiNx:H QDs thin films. However, due to the limitation of the requirement of a very high deposition temperature along with post annealing and a low growth rate, extensive research are being undertaken to elevate these issues, for the point of view of applications, using plasma assisted deposition methods by using different plasma concepts. This work addresses about rapid growth and single step development of c-Si/a-SiNx:H QDs thin films deposited by RF (13.56 MHz) and ultra-high frequency (UHF ~ 320 MHz) low-pressure plasma processing of a mixture of silane (SiH4) and ammonia (NH3) gases diluted in hydrogen (H2) at a low growth temperature ($230^{\circ}C$). In the films the c-Si QDs of varying size, with an overall crystallinity of 60-80 %, are embedded in an a-SiNx: H matrix. The important result includes the formation of the tunable QD size of ~ 5-20 nm, having a thermodynamically favorable <220> crystallographic orientation, along with distinct signatures of the growth of ${\alpha}$-Si3N4 and ${\beta}$-Si3N4 components. Also, the roles of different plasma characteristics on the film properties are investigated using various plasma diagnostics and film analysis tools.

• Composites Research
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• 제30권2호
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• pp.84-93
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• 2017

본 논문에서는 탄화규소 섬유강화 탄화규소 복합재료에 내환경 코팅을 수행한 후, 열 기계적 특성평가에 대한 연구를 수행하였다. 초기분말은 성형공정도중 흐름성을 좋게 하기 위해 분무건조법으로 구형의 분말을 제조하였다. 내환경 코팅재는 복합재료가 산화되거나 고온 수증기와 반응하는 것을 방지하기 위해 행하여 지는데, 본 연구에서는 액상침투법(LSI)으로 제조한 복합재에 실리콘으로 본드코팅을 하고 그 위에 대기플라즈마용사법으로 뮬라이트(mullite)와 무게비로 12% 이터븀 실리케이트(ytterbium silicate)가 혼합된 복합재를 코팅하였다. 대기플라즈마 코팅공정 시 성형변수로서 분무거리를 100, 120 그리고 140 mm로 변화시켰다. 그 후 $1100^{\circ}C$의 온도에서 100시간동안 유지하는 실험과 $1200^{\circ}C$의 온도에서 열충격을 가하는 싸이클을 3000회 반복하였다. 열내구성 시험동안 계면 박리는 일어나지 않았지만, 현저한 균열들이 코팅층 내에서 발견되었다. 균열밀도와 균열의 길이는 코팅도중의 분무거리에 의존하여 변화하였다. 열 내구성 시험 후, 압흔 시험을 통해 기계적 열화거동을 분석하였는데, 시험의 방식이나 조건들이 하중-변위 곡선의 거동에 영향을 주었다.

• 한국진공학회지
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• 제16권3호
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• pp.197-204
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• 2007

p-형 실리콘 기판 위에 수 ${\AA}$ 두께의 어븀 금속을 증착하고, 후열처리 과정을 통하여 어븀-실리사이드/p-형 실리콘 접합을 형성하였다. 초고진공 자외선 광전자 분광 실험을 통하여 증착한 어븀의 두께에 따라 어븀-실리사이드의 일함수가 4.1 eV까지 급하게 감소하는 것을 관찰하였으며, X-ray 회절 실험에 의하여 형성된 어븀 실리사이드가 주로 $Er_5Si_3$상으로 구성되어 있음을 밝혔다. 또한, 어븀-실리사이드/p-형 실리콘 접합에 알루미늄 전극을 부착하여 쇼트키 다이오드를 제작하고, 전류전압 곡선을 측정하여 쇼트키 장벽의 높이를 산출하였다. 산출된 쇼트키 장벽의 높이는 $0.44{\sim}0.78eV$이었으며 어븀 두께 변화에 따른 상관 관계를 찾기 어려웠다. 그리고 이상적인 쇼트키 접합을 가정하고 이미 측정한 일함수로부터 산출한 쇼트키 장벽의 높이는 전류-전압 곡선으로부터 산출한 값에 크게 벗어났으며, 이는 어븀-실리사이드가 주로 $Er_5Si_3$ 상으로 구성되어 있고, $Er_5Si_3/p-$형 실리콘 계면에 존재하는 고밀도의 계면 상태에 기인한 것으로 사료된다.

• 한국전자파학회논문지
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• 제25권12호
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• pp.1219-1227
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• 2014

펄스 레이저 증착(Pulsed laser Deposition: PLD) 및 RF 스퍼터링 증착(Sputtering Deposition)의 단계적 적용을 통해, 표면탄성파 대역 통과 필터(Surface Acoustic Wave Bandpass Filter: SAW-BPF)용 ZnO 박막을 성장시켰다. PLD 방법으로 성장된 ZnO 박막위에 RF sputtering 방법을 사용하여 ZnO 박막을 재증착시켰으며, 성장된 ZnO 박막의 물성을 분석하기 위하여 XRD, SEM 및 AFM 분석장비를 사용하였다. 두 가지 증착 방법이 단계적으로 적용되어 성장된 ZnO 박막의 경우, 결정성과 배향성이 우수하게 유지되면서 표면거칠기가 향상되었다. 분석 결과, ${\omega}$-scan의 반치폭과 표면거칠기의 RMS 값은 각각 $0.79^{\circ}$와 1.108 nm였다. 그리고 성장된 양질의 ZnO 박막을 사용하여 SAW-BPF를 제작하여 측정한 결과는 응답 특성의 중심주파수가 260.8 MHz, 대역폭은 2.98 MHz, 그리고 삽입손실은 36.5 dB이었다.