• 마이크로전자및패키징학회지
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• 제30권4호
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• pp.98-104
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• 2023

대기 중 구리-구리 플립칩(flip-chip) 접합을 위해 제안된 효율적 공정의 실현 가능성을 평가하고자 구리(Cu) 필라(pillar) 상 다공성 구리층의 형성 및 액상 환원제 투입 후 열압착 접합을 실시하였다. 구리 필라 상 다공성 구리층은 아연(Zn) 도금-합금화 열처리-선택적 아연 에칭(etching)의 3단계 공정으로 제조되었는데, 형성된 다공성 구리층의 두께는 평균 약 2.3 ㎛였다. 본 플립칩 접합은 형성 다공성 구리층에 환원성 용제를 침투시킨 후, 반건조 과정을 거쳐 열압착 소결접합으로 진행하였다. 용제로 인한 구리 산화막의 환원 거동과 함께 추가 산화가 최대한 억제되면서 열압착 동안 다공성 구리층은 약 1.1 ㎛의 두께로 치밀해지며 결국 구리-구리 플립칩 접합이 완수되었다. 그 결과 10 MPa의 가압력 하에서 대기 중 300 ℃에서 5분간 접합 시 약 11.2 MPa의 접합부 전단강도를 확보할 수 있었는데, 이는 약 50% 이하의 필라들만이 접합된 결과로서, 공정 최적화를 통해 모든 필라들의 접합을 유도할 경우 20 MPa 이상의 강도값을 쉽게 얻을 수 있을 것으로 분석되었다.

• Journal of Welding and Joining
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• 제10권4호
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• pp.213-221
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• 1992

Al$_{2}$O$_{3}$ ceramic coating layer by gas flame spraying was very porous, therefore it could not have wear and corrosion resistance at all. To get a dense and strong coating layer, a method to infiltrate an alloy into the pores of $Al_{2}$O$_{3}$ ceramic coating was investigated. Cu-Ti alloys, which had good wettability and reactivity with $Al_{2}$O$_{3}$ ceramic, were examined for infiltration. Infiltration of the alloys was performed in vacuum at 1100.deg.C. The melt of Cu-50 at % Ti alloy was well penetrated through the porous $Al_{2}$O$_{3}$ coating and tightly sealed the pores, unbounded area and microcracks in the coating. The alloy melt in the pores reacted with $Al_{2}$O$_{3}$ ceramic to produce a suboxide phase, Cu$_{2}$Ti$_{4}$O. This composite layer which was composed of $Al_{2}$O$_{3}$ and Cu$_{2}$Ti$_{4}$O phase had good microstructure and wear and corrosion resistance. Additionally, microstructures at interfaces between coating layers were greatly improved owing to the effect of vacuum heat treating.

• 한국분말재료학회지
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• 제21권3호
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• pp.191-195
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• 2014

This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

• 한국자동차공학회논문집
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• 제16권5호
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• pp.60-67
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• 2008

The catalytic filter of Cu-ZSM5/alumina beads was considered to reduce NOx in the urea SCR system. Catalytic support of porous alumina beads with mean pore size $130{\mu}m$ and porosity $75{\sim}83%$ were prepared using foaming and gel-casting method. The Cu-ZSM5 catalysts were coated on the supporting alumina beads using $Cu(NO_3)_2$ by ion exchange method. After a washcoating process was applied to coat 10w% Cu-ZSM5 on porous alumina bead, coating layer was estimated $20{\mu}m$ in thickness. The characterization and the feasibility as a catalytic supports were investigated. And the NOx conversion test in Cu-ZSM5/Alumina Beads filter system was conducted by using Urea as reductants under laboratory test. The NOx conversion was increased as size and porosity of beads and observed more than 95% excellent NOx conversion above $300^{\circ}C$.

• 한국재료학회지
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• 제22권1호
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• pp.1-7
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• 2012

Thin film electrode consisting purely of porous anodic tin oxide with well-defined nano-channeled structure was fabricated for the first time and its electrochemical properties were investigated for application to an anode in a rechargeable lithium battery. To prepare the thin film electrode, first, a bi-layer of porous anodic tin oxides with well-defined nano-channels and discrete nano-channels with lots of lateral micro-cracks was prepared by pulsed and continuous anodization processes, respectively. Subsequent to the Cu coating on the layer, well-defined nano-channeled tin oxide was mechanically separated from the specimen, leading to an electrode comprised of porous tin oxide and a Cu current collector. The porous tin oxide nearly maintained its initial nano-structured character in spite of there being a series of fabrication steps. The resulting tin oxide film electrode reacted reversibly with lithium as an anode in a rechargeable lithium battery. Moreover, the tin oxide showed far more enhanced cycling stability than that of powders obtained from anodic tin oxides, strongly indicating that this thin film electrode is mechanically more stable against cycling-induced internal stress. In spite of the enhanced cycling stability, however, the reduction in the initial irreversible capacity and additional improvement of cycling stability are still needed to allow for practical use.

• 한국세라믹학회지
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• 제54권5호
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• pp.438-442
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• 2017

This paper reports the facile synthesis of microlamella-structured porous copper (Cu)-oxide-based electrode and its potential application as an advanced anode material for lithium-ion batteries (LIBs). Nanowire-like Cu oxide, which is created by a simple thermal oxidation process, is radially and uniformly formed on the entire surface of Cu foam that has been fabricated using a combination of water-based slurry freezing and sintering (freeze casting). Compared to the Cu foil with a Cu oxide layer grown under the same processing conditions, the Cu foam anode with 63% porosity exhibits over twice as much capacity as the Cu foil (264.2 vs. 131.1 mAh/g at 0.2 C), confirming its potential for use as an anode electrode for LIBs.

• Corrosion Science and Technology
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• 제20권5호
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• pp.249-255
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• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• E2M - 전기 전자와 첨단 소재
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• 제9권7호
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• pp.727-732
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• 1996

In the present paper, the Cu films 4.mu.m thick were deposited by RF magnetron sputtering method on Si wafer. The Cu films deposited at a condition of 100W, 10mtorr exhibited a low electrical resistivity of 2.3.mu..ohm..cm and densed microstructure, poor adhesion. The Cu films grown by 200W, 20mtorr showed a good adhesion property and higher electrical resistivity of 7.mu..ohm..cm because of porous columnar microstructure. Therefore, The Cu films were deposited by double layer deposition method using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adhesion, and reflectance in the CU films [C $U_{4-d}$(low resistivity) / C $U_{d}$(high adhesion) / Si-wafer] on the thickness of d has been investigated. The films formed with this deposition methods had the low electrical resistivity of about 2.6.mu..ohm..cm and high adhesion of about 700g/cm.m.m.

• 한국재료학회지
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• 제27권3호
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• pp.172-178
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• 2017

The aim of this study is to consider the effect hydrogen on dezincification behavior of Cu-Zn alloys. The investigations include microstructural observations with scanning electron microscope and chemical composition analysis with energy dispersive spectrometer. The dezincification layer was found to occur in high pressure hydrogen atmosphere, not in air atmosphere. In addition, the layers penetrated into the inner side along the grain boundaries in the case of hydrogen condition. The shape of the dezincification layers was porous because of Zn dissolution from the ${\alpha}$ or ${\beta}$ phase. In the case of stress corrosion cracks formed in the Cu-Zn microstructure, the dezincification phenomenon with porous voids was also accompanied by grain boundary cracking.

• 전기화학회지
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• 제5권3호
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• pp.125-130
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• 2002

다공성 그물구조 금속을 반도체 칩 방열재료로써 활용하기 위한 실험을 실시하였다. 이를 위해 다공성 그물구조 구리와 반도체 칩 사이의 열팽창 차이를 최소화하기 위한 시도로써 다공성 구리에 대한 Fe/Ni 합금전착을 수행하였다. Fe/Ni 합금전착 실험으로 표준 Hull Cell을 구성하고 전류밀도 분포에 따른 Fe/Ni 합금층 내의 조성변화를 관찰하였으며, 실험결과 합금전착시 이상공석현상으로 인하여 전해액의 교반정도에 따라 합금층 조성이 크게 영향을 받는 것으로 나타났다. 본 실험에서는 paddle type 교반기를 사용하여 전해질의 확산을 제어하는 방법으로 원하는 조성의 Fe/Ni 합금층을 얻을 수 있었으며, 얻어진 Fe/Ni 후막을 대상으로 TMA 열분석을 실시한 결과 구리에 비해 훨씬 낮은 열팽창율을 보이는 것으로 나타났다. 또한, 본 실험에서 Fe/Ni 합금전착을 통하여 제작한 다공성 그물구조 금속을 대상으로 방열성능을 측정한 결과 구리 평판 대비 최대 2배 이상의 방열성능을 보여 반도체 칩 방열재료로의 활용 가능성을 높여 주었다.