• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.9-13
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• 2002

A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

• Journal of Electrochemical Science and Technology
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• v.13 no.3
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• pp.339-346
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• 2022

Silicon (Si) has attracted considerable attention due to its high theoretical capacity compared to conventional graphite anode materials. However, Si-based anode materials suffer from rapid capacity loss due to mechanical failure caused by large volume change during cycling. To alleviate this phenomenon, crosslinked polymeric binders with strong interactions are highly desirable to ensure the electrode integrity. In this study, thermally crosslinked polyimide binders were used for Si-alloy anodes in Li-ion batteries. The crosslinked polyimide binder was found to have high adhesion strength, resulting in enhanced electrode integrity during cycling. Therefore, the Si-alloy anodes with crosslinked polyimide binder provide enhanced electrochemical performance, such as Coulombic efficiency, capacity retention, and cycle stability.

• Korean Journal of Materials Research
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• v.18 no.9
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1110-1114
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles generated are about 3$^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle are at about 1.7$^{\circ}$ lower on the glass substrate than on thin plastic substrate. We obtain that AFM (atomic force microscope) image of rubbed PI surface with polymer film has formed the micro-groove structure at the low curring temperature (120$^{\circ}C$). However, no grooves are obtained on the glass substrate at the same temperature. It is considered that this alignment may be attributed to roughness of micro-groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that the pretilt angle in the polyimide surface is attributable to the increasing of imidization rato.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.224-224
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• 2008

고주파용 집적회로 기판소재로의 응용을 위해 세라믹 특유의 취성을 개선한 $Al_2O_3$-polyimide 복합체 후막을 에어로졸데포지션법을 이용해 제조하고 그 특성을 평가하였다. 그 결과 기공이 거의 없이 치밀한 구조를 갖는 $Al_2O_3$-polyimide 복합체 후막이 구리 및 유리 기판 상에 성막 되었음이 SEM 및 EDS을 통해 확인되었다. 상용 $Al_2O_3$ 출발 파우더를 사용한 복합체 제조시 1 MHz에서 유전율은 6.7, 유전 손실률은 0.026 이었다. 유전특성의 향상을 위하여 에어로졸데포지션법으로 성막된 $Al_2O_3$-polyimide 복합체 후막의 후속 열처리 결과 유전손실율이 0.026에서 0.007로 감소하였다. 또한 집적회로 기판소재로의 응용을 위한 저온화 제조공정 확립을 위하여 $Al_2O_3$ 출발 파우더의 공정 전 열처리 후 상온에서 성막한 경우에도 어떠한 후속 열처리 없이 유전손실률이 0.007로 감소하였다.

• Macromolecular Research
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• v.11 no.3
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• pp.157-162
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• 2003

6FDA-based polyimides were prepared from the thermal imidization reaction of 6FDA with diamines of BAPAF, DAP, and DABA having a polar group of hydroxyL or carboxyl. Properties of the dense polyimide membranes were characterized and their gas permeation properties for H$_2$, $CO_2$, $O_2$, $N_2$, and CH$_4$ were investigated. Permeabilities, diffusion coefficients and diffusivity selectivities of polar group-containing polyimide membranes including 6FDA-BAPAF, 6FDA-DAP, and 6FDA-DABA polymer for the gases did not change largely. The separation properties of 6FDA-TrMPD polyimide membrane used as a reference polymer were compared with those of the polyimide membranes mentioned above. It was found that the polyimides of 6FDA-BAPAF, 6FDA-DAP, and 6FDA-DABA, which were soluble in alcohol or/and 2-methoxyethanol, could be applicable to the preparation of a dense composite membrane by dip-coating method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.2
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• pp.148-152
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• 2005

Atmospheric low-temperature plasma was produced using dielectric barrier discharge (DBD) plate-type plasma reactor and high frequency of 13.56 Hz. The surfaces of polyimide films for insulating and packaging materials were treated by the atmospheric low-temperature plasma. The contact angle of 67$^{\circ}$ was observed before the plasma treatment. The contact angle was decreased with deceasing the velocity of plasma treatment. In case of oxygen content of 0.2 %, electrode gap of 2 mm, the velocity of plasma treatment of 20 mm/sec, and input power of 400 W, the minimum contact angle of 13$^{\circ}$ was observed. The chemical characteristics of polyimide film after the plama treatment were investigated using X-ray photoelectron spectroscopy (XPS), and new carboxyl group bond was observed. The surfaces of polyimide films were changed into hydrophilic by the atmospheric low-temperature plasma. The polyimide films having hydrophilic surface will be very useful as a packaging and insulating materials in electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.13-17
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• 2000

The electrical properties of polyimide for interlayer dielectric applications are investigated with ECR (Electron Cyclotron Resonance) etching process. ECR etching with $Cl_2$-based plasma, generally used for aluminum etching, results in an increase in the dielectric constant of polyimide, while $SF_{6}$ plasma exhibits a high polyimide etch rate and a reducing effect of the dielectric constant. The leakage current of the polyimide is significantly suppressed after plasma exposure. Combination of Al etching with $Cl_2$plasma and polyimide etching with $SF_{6}$ plasma is expected as a good tool for realizing the multilevel metallization structures.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Macromolecular Research
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• v.17 no.6
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• pp.388-396
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• 2009

The surface properties (water sorption and repellency, adhesion) are closely related to the surface tension of polymer solids. The critical surface tension (${\gamma}_c$) and surface tension (${\gamma}_s$) of a polymer solid were estimated by the contact angle method by our quantitative imaging system. BPDA (3,3',4,4'-biphenyl tetracarboxylic dianhydride)-BAPP (1,3-Bis(4-aminophenoxy) propane) polyimide was successfully synthesized. The ${\gamma}_c$ values were analyzed by a Zisman plot, a Young-$Dupr\acute{e}$-Good-Girifalco plot, and a log ($1+cos{\theta}$) vs log ${\gamma}_L$ plot. The ${\gamma}_s$ value of BPDA-BAPE polyimide was evaluated using the geometric mean equation and our multiple regression analysis. The calculated values of ${{\gamma}_s^d$ (a dispersion component), ${{\gamma}_s^p$ (a polar component), ${{\gamma}_s^h$ (a hydrogen bonding component), and ${\gamma}_s$ were 30.79, 9.32, 0.20, and 40.31 $mN{\cdot}m^{-1}$, respectively. The ${\gamma}_s$ of BPDA-BAPP polyimide containing both a methylene group and an ether group was larger than that of the polyimide containing only a methylene group.