Preparation and Characterization of Surface Energy of BPDA-BAPP Polyimide

  • Published : 2009.06.25

Abstract

The surface properties (water sorption and repellency, adhesion) are closely related to the surface tension of polymer solids. The critical surface tension (${\gamma}_c$) and surface tension (${\gamma}_s$) of a polymer solid were estimated by the contact angle method by our quantitative imaging system. BPDA (3,3',4,4'-biphenyl tetracarboxylic dianhydride)-BAPP (1,3-Bis(4-aminophenoxy) propane) polyimide was successfully synthesized. The ${\gamma}_c$ values were analyzed by a Zisman plot, a Young-$Dupr\acute{e}$-Good-Girifalco plot, and a log ($1+cos{\theta}$) vs log ${\gamma}_L$ plot. The ${\gamma}_s$ value of BPDA-BAPE polyimide was evaluated using the geometric mean equation and our multiple regression analysis. The calculated values of ${{\gamma}_s^d$ (a dispersion component), ${{\gamma}_s^p$ (a polar component), ${{\gamma}_s^h$ (a hydrogen bonding component), and ${\gamma}_s$ were 30.79, 9.32, 0.20, and 40.31 $mN{\cdot}m^{-1}$, respectively. The ${\gamma}_s$ of BPDA-BAPP polyimide containing both a methylene group and an ether group was larger than that of the polyimide containing only a methylene group.

Keywords

References

  1. W. S. Ruska, Microelectronic Processing: An Introduction to the Manufacture of Integrated Circuits, McGraw-Hill, New York, 1987, pp 68-76
  2. A. Endo, M. Takada, K. Adachi, H. Takasago, T. Yada, and Y.Onishl, J. Electrochem. Soc.: Solid-State Sci. Tech., 34, 2522 (1987)
  3. K. L. Mittal, Polyimides: synthesis, characterization, and applications, Plenum Press, New York, 1984
  4. C. Feger, M. M. Khojasteh, and M. S. Htoo, Advances in polyimide science and technology, Technomic Publications, Lancaster, 1993
  5. C. E. Sroog, J. Polym. Sci.: Macromol. Rev., 11, 161 (1979)
  6. A. M. Wilson, Use of Polyimides in VLSI fabrication, in Polyimides, 1st ed., K. L. Mittal, Ed., Plenum Press, New York, 1984, pp 715-733
  7. A. M. Wilson, Thin Solid Films, 83, 145 (1981) https://doi.org/10.1016/0040-6090(81)90661-1
  8. E. Sacher and J. R. Susko, J. Appl. Polym. Sci., 26, 679 (1981) https://doi.org/10.1002/app.1981.070260226
  9. M. Ree, M. J. Goldberg, G. Czornyj, H. S. Han, and C. C. Gryte, Polym. Mater. Sci. Eng., 68, 126 (1993)
  10. D. H. Lee, Polymer(Korea), 11, 206 (1987)
  11. F. Belluchi, I. Khamis, S. D. Senturia, and R. M. Lantanison, J. Electrochem. Soc., 137, 1778 (1990) https://doi.org/10.1149/1.2086797
  12. B. S. Kim, S. H. Bae, Y. H. Park, and J.-H. Kim, Macromol. Res., 15, 357 (2007) https://doi.org/10.1007/BF03218799
  13. A. S. Mathew, I. Kim, and C. S. Ha, Macromol. Res., 15, 114 (2007) https://doi.org/10.1007/BF03218762
  14. H. S. Lee, A. Roy, A. S. Badami, and J. E. McGrath, Macromol. Res., 15, 160 (2007) https://doi.org/10.1007/BF03218768
  15. H. S. Han, Ph. D. Thesis, Columbia University, New York, 1993
  16. D. D. Denton, D. R. Day, D. F. Priore, and S. D. Senturia, J. Electron. Mater., 14, 119 (1985) https://doi.org/10.1007/BF02656671
  17. J. Melcher, Y. Deben, and G. Arlt, IEEE Elecrt. Insul., 24, 31 (1989)
  18. E. Sacherand and J. R. Sucko, J. Appl. Polym. Sci., 23, 2355 (1979) https://doi.org/10.1002/app.1979.070230813
  19. H. J. Merrem, R. Klug, and H. Hartner, New Developments in Photosensitive Polyimide, in Polyimides, 2nd ed., K. L. Mittal, Ed., Plenum Press, New York, 1989, pp 919-931
  20. E. Tchangai, Y. Segui, and K. Doukkali, J. Appl. Polym. Sci., 38, 305 (1989) https://doi.org/10.1002/app.1989.070380212
  21. J.-H. Jou, R. Huang, P.-T. Huang, and W.-P. Shen, J. Appl. Polym. Sci., 43, 857 (1991) https://doi.org/10.1002/app.1991.070430503
  22. Y. Kwon and K.-H. Kim, Macromol. Res., 14, 424 (2006) https://doi.org/10.1007/BF03219105
  23. M. Ree, Macromol. Res., 14, 1 (2006) https://doi.org/10.1007/BF03219064
  24. S. J. Shin, J. H. Chi, W. C. Zin, T. Chang, M. Ree, and J. C. Jung, Polymer(Korea), 30, 97 (2006)
  25. M. Ree, T. J. Shin, and S. W. Lee, Korea Polym. J., 9, 1 (2001)
  26. M. Ree, T. J. Shin, Y. H. Park, H. Lee, and T. Chang, Korea Polym. J., 7, 370 (1999)
  27. W. H. Goh, K. Kim, and M. Ree, Korea Polym. J., 6, 241 (1998)
  28. H. Han and M. Ree, Korea Polym. J., 5, 152 (1997)
  29. H. W. Fox and W. A. Zisman, J. Colloid Sci., 5, 514 (1950) https://doi.org/10.1016/0095-8522(50)90044-4
  30. R. E. Johnson and R. H. Dettre, J. Colloid Sci., 20, 73 (1965)
  31. A. M. Gaudin, Flotation, McGraw-Hill, New York, 1957, p.163
  32. A. W. Adams, F. P. Shirley, and K. T. Kunichika, J. Colloid Interf. Sci., 34, 461 (1970) https://doi.org/10.1016/0021-9797(70)90206-7
  33. T. Fort and H. T. Patterson, J. Colloid Sci., 18, 217 (1963) https://doi.org/10.1016/0095-8522(63)90013-8
  34. Y. Kitazaki and T. J. Hata, J. Adhes. Soc. Jpn., 8, 131 (1972)
  35. Y. Kano and S. Akiyama, Polymer, 33, 1690 (1992) https://doi.org/10.1016/0032-3861(92)91068-D
  36. H. W. Fox and W. A. Zisman, J. Colloid Sci., 7, 109 (1952a) https://doi.org/10.1016/0095-8522(52)90054-8
  37. H. W. Fox and W. A. Zisman, J. Colloid Sci., 7, 428 (1952b) https://doi.org/10.1016/0095-8522(52)90008-1
  38. A. Zisman, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, , pp 1-51 https://doi.org/10.1021/ba-1964-0043.ch001
  39. F. M. Fowkes, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 99-111 https://doi.org/10.1021/ba-1964-0043.ch006
  40. R. J. Good, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 74-87 https://doi.org/10.1021/ba-1964-0043.ch004
  41. R. J. Good, in Treaties on Adhesion and Adhesive, R. L. Patrick, Ed., Marcel Dekker, New York, 1967, Vol. 1, pp 9-68
  42. R. J. Good and L. A. Girifalco, J. Phys. Chem., 64, 561 (1960) https://doi.org/10.1021/j100834a012
  43. Y. Kano and T. Saito, Setchaku, 32, 396 (1988)
  44. S. Wu, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982a, p 105
  45. D. H. Kaelble and K. C. Uy, J. Adhes., 2, 51 (1970)
  46. S. Wu, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982b, pp 257-259
  47. A. W. Adamson, Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990a, pp 389-392
  48. M. K. Ghosh and K. L. Mittal, Polyimides: Fundamentals and Applications, Marcel Dekker, New York, 1996, pp 16-18
  49. S. Wu, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982c, p.162
  50. S. Wu, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982d, p. 183
  51. A. W. Adamson, Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990b, pp 397-398
  52. W. Gutowski, J. Adhes., 19, 29 (1985) https://doi.org/10.1080/00218468508071212
  53. K.-H. Kim and Y. Kwon, J. Chem. Eng. Jpn., 38, 641 (2005) https://doi.org/10.1252/jcej.38.641
  54. K.-H. Kim, Y.-G. Kim, and Y. Kwon, Mol. Cryst. Liq. Cryst., 470, 145 (2007)
  55. J. Brandrup and E. H. Immergut, Polymer Handbook, 3rd ed., Wiley-Interscience, John Wiley & Sons, New York, 1989, p.VI/422