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http://dx.doi.org/10.4313/JKEM.2005.18.2.148

Hydrophilic Effect of the Polyimide by Atmospheric Low-temperature Plasma Treatment  

Cho, J.H. ((주)창조 엔지니어링)
Kang, B.K. ((주)창조 엔지니어링)
Kim, K.S. ((주)창조 엔지니어링)
Choi, B.K. (강릉대학교 금속재료공학과)
Kim, S.H. (강릉대학교 세라믹공학과)
Choi, W.Y. (강릉대학교 금속재료공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.18, no.2, 2005 , pp. 148-152 More about this Journal
Abstract
Atmospheric low-temperature plasma was produced using dielectric barrier discharge (DBD) plate-type plasma reactor and high frequency of 13.56 Hz. The surfaces of polyimide films for insulating and packaging materials were treated by the atmospheric low-temperature plasma. The contact angle of 67$^{\circ}$ was observed before the plasma treatment. The contact angle was decreased with deceasing the velocity of plasma treatment. In case of oxygen content of 0.2 %, electrode gap of 2 mm, the velocity of plasma treatment of 20 mm/sec, and input power of 400 W, the minimum contact angle of 13$^{\circ}$ was observed. The chemical characteristics of polyimide film after the plama treatment were investigated using X-ray photoelectron spectroscopy (XPS), and new carboxyl group bond was observed. The surfaces of polyimide films were changed into hydrophilic by the atmospheric low-temperature plasma. The polyimide films having hydrophilic surface will be very useful as a packaging and insulating materials in electronic devices.
Keywords
Plasma; Atmospheric; Low-temperature; Polyimide; Hydrophilic;
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