• 한국전기전자재료학회논문지
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• 제24권7호
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• pp.525-531
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• 2011

In this paper, experimental analyses have been performed to compare the electrical characteristics of n channel LT(low temperature) and HT(high temperature) poly-Si TFTs(polycrystalline silicon thin film transistors) on quartz substrate according to activated step annealing. The size of the particles step annealed at low temperature are bigger than high temperature poly-Si TFTs and measurements show that the electric characteristics those are transconductance, threshold voltage, electric effective mobility, on and off current of step annealed at LT poly-Si TFTs are high more than HT poly-Si TFT's. Especially we can estimated the defect in the activated grade poly crystalline silicon and the grain boundary of LT poly-Si TFT have more high than HT poly-Si TFT's due to high off electric current. Even though the size of particles of step annealed at low temperature, the electrical characteristics of LT poly-Si TFTs were investigated deterioration phenomena that is decrease on/off current ratio depend on high off current due to defects in active silicon layer.

• 한국전기전자재료학회논문지
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• 제21권1호
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• pp.1-4
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• 2008

The electrical characteristics of polycrystalline silicon (poly-Si) thin film transistor (TFT) crystallized by excimer laser annealing (ELA) method were evaluated, The polycrystalline silicon thin-film transistor (poly-Si TFT) has higher electric field-effect-mobility and larger drivability than the amorphous silicon TFT. However, to poly-Si TFT's using conventional processes, the temperature must be very high. For this reason, an amorphous silicon film on a buried oxide was crystallized by annealing with a KrF excimer laser (248 nm)to fabricate a poly-Si film at low temperature. Then, High permittivity $HfO_2$ of 20 nm as the gate-insulator was deposited by atomic layer deposition (ALD) to low temperature process. In addition, the solid phase crystallization (SPC) was compared to the ELA method as a crystallization technique of amorphous-silicon film. As a result, the crystallinity and surface roughness of poly-Si crystallized by ELA method was superior to the SPC method. Also, we obtained excellent device characteristics from the Poly-Si TFT fabricated by the ELA crystallization method.

• 한국주조공학회지
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• 제14권1호
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• pp.28-34
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• 1994

Metallurgical-grade polycrystalline silicon was directionally solidified at growth rates of $0.2{\sim}1.0mm/min$ by using split type, reusable graphite molds which were coated with $Si_3N_4$ powder. The resultant grain sizes of the silicon ingots and the shapes of the solid/liquid(S/L) interfaces were investigated. X-ray diffraction was used to determine the preferred orientation in each of the silicon ingots. The impurity content of the silicon was analyzed and the resistivities of the ingots were measured. During the growth of an ingot, the shape of the S/L interface was concave to the silicon melt, and the resistivity decreased. The presence of Al which can be acting as a carrier, is thought to be the main factor causing such a decrease in resistivity. When a growth rate of 0.2㎜/min was used, the preferred orientation was found to be (111).

• 한국전기전자재료학회논문지
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• 제37권1호
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• pp.26-35
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• 2024

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p-Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

• 한국세라믹학회지
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• 제55권2호
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• pp.166-173
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• 2018

In order to investigate the effect of Mn on the dielectric and piezoelectric properties of PMN-PT [$Pb(Mg_{1/3}Nb_{2/3})O_3-PbTiO_3$], four different types of 71PMN-29PT samples were prepared using the solid-state single crystal growth (SSCG) method: (1) Undoped single crystals, (2) undoped polycrystalline ceramics, (3) Mn-doped single crystals, and (4) Mn-doped polycrystalline ceramics. In the case of single crystals, the addition of 0.5 mol% Mn to PMN-PT decreased the dielectric constant ($K_3{^T}$), piezoelectric charge constant ($d_{33}$), and dielectric loss (tan ${\delta}$) by about 50%, but increased the coercive electric field ($E_C$) by 50% and the electromechanical quality factor ($Q_m$) by 500%, respectively. The addition of Mn to PMN-PT induced an internal bias electric field ($E_I$) and thus specimens changed from piezoelectrically soft-type to piezoelectrically hard-type. This Mn effect was more significant in single crystals than in ceramics. These results demonstrate that Mn-doped 71PMN-29PT single crystals, because they are piezoelectrically hard and simultaneously have high piezoelectric and electromechanical properties, have great potential for application in fields of SONAR transducers, high intensity focused ultrasound (HIFU), and ultrasonic motors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.173-176
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• 2004

In this study we investigated post ELA(Excimer Laser Annealing) effect on SMC (Silicide Mediated Crystalization) poly-Si (Polycrystalline Silicon) to improve the characteristics of poly-Si. Combining SMC and XeCl ELA were used to crystallize the a-Si (amorphous Silicon) at various ELA energy density for LTPS (Low Temperature Polycrystalline Silicon). We fabricated the conventional SMC poly-Si with no SPC (Solid Phase Crystallization) phase using UV heating method[1] and irradiated excimer laser on SMC poly-Si, so called SMC-ELA poly-Si. After using post ELA we can get better surface morphology than conventional ELA poly-Si and enhance characteristics of SMC poly-Si. We also observed the threshold energy density regime in SMC-ELA poly-Si like conventional ELA poly-Si.

• 한국결정성장학회지
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• 제12권1호
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• pp.36-41
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• 2002

$H_2$(5%)/Ar의 환원분위기에서 $900^{\circ}C$ 이상의 온도로 소결함으로써 화학양론적인 조성비를 만족하면서 이중 페롭스카이트 구조를 갖는 $Sr_2FeMoO_6$ (SFMO) 소결체를 제조하였다. SFMO 소결체는 우수한 강자성 특성을 나타내었고 8K에서 15%와 상온에서 3% 정도의 자기저항비를 나타내었다. 이 SFMO 소결체를 타겟으로하여 스퍼터링법으로와의 단결정 기판 위에 비정질 SFMO 박막을 증착한 후, 적절한 H$_2$(5%)/Ar의 환원분위기, $680^{\circ}C$ 이상) 열처리 조건의 고상결정법으로 이중 페롭스카이트 구조의 다결정 SFMO 박막을 제조하였다. 이 SFMO 박막은 강자성 특성을 잘 나타내었으나, 자기저항 특성은 상온에서는 나타나지 않았고 8K에서 약 0.3-0.5%의 자기저항비를 나타내었다. 이와같이 박막의 경우 자기저항 특성이 떨어지는 이유는 제조된 SFMO 박막이 화학양론비를 만족하지 못하고 조직의 치밀도가 떨어져서 결정립 사이에서 발생하는 자기스핀 터널링이 제대로 발생하지 못하였기 때문이라 생각되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.107-110
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• 1999

The ultrasonic spray method was employed to make (Y,Gd)BO$_3$:Eu Phosphor, and its optical properties under 147nm VUV and 254 nm UV excitations were characterized and then compared with that produced by the solid-state reaction. The mixed solution of acetate hydrates of Y, Gd, Eu and boric acid diluted in water or methanol was used as the precursor fur the spray. It was found that (Y,Gd)BO$_3$:Eu phosphor made by this ultrasonic spray had a spherical shape and fine particle size of 1${\mu}{\textrm}{m}$. The crystalline structure for the as-sprayed phosphor was amorphous, but it converted into the same polycrystalline phase of solid state reaction after post heat treatment at 110$0^{\circ}C$ for 2hr. The emitting intensity under VUV and UV excitations for the spray-formed (Y,Gd)BO$_3$:Eu phosphor, however, was inferior to the later one. The excitation spectra were also studied and compared under VUV and UV excitations to explain the change of emitting intensity with Gd substitution in (Y$_{1-x}$ Gd$_{x}$)BO$_3$:Eu Phosphors made by spray and solid state reaction.on.

• 한국자기학회지
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• 제21권3호
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• pp.108-115
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• 2011

이 글에서는 응집물질물리 실험에 필수적인 소규모의 연구용 고순도 시료 제작에 있어 기본적인 사항들을 살펴본다. 연구자들이 쉽게 접근할 수 있는 시료 제작법들을 중심으로 제작 과정과 유의점등을 소개하려 한다. 가장 흔히 사용되는 고상소결법으로 부터 시작하여 다양한 환경에서 다결정 및 단결정 제작에 필수적인 석영관을 이용한 시료 제작에 대해 설명하고 단결정 제작의 기초와 다양한 단결정 성장법에 대해서도 전반적으로 소개하여 시료 제작을 처음 접하는 연구자들의 이해를 돕도록 한다.

• Journal of Information Display
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• 제10권3호
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• pp.117-120
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• 2009

A new crystallization method for amorphous silicon, called selective area heating (SAH), was proposed. The purpose of SAH is to improve the reliability of amorphous silicon films with extremely low thermal budgets to the glass substrate. The crystallization time shortened from that of the conventional solid-phase crystallization method. An isolated thin heater for SAH was fabricated on a quartz substrate with a Pt layer. To investigate the crystalline properties, Raman scattering spectra were used. The crystalline transverse optic phonon peak was at about 519 $cm^{-1}$, which shows that the films were crystallized. The effect of the crystallization time on the varying thickness of the $SiO_2$ films was investigated. The crystallization area in the 400nm-thick $SiO_2$ film was larger than those of the $SiO_2$ films with other thicknesses after SAH at 16 W for 2 min. The results show that a $SiO_2$ capping layer acts as storage layer for thermal energy. SAH is thus suggested as a new crystallization method for large-area electronic device applications.