• Design & Manufacturing
• /
• v.11 no.2
• /
• pp.51-56
• /
• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1579-1582
• /
• 2005

Polishing is cutting process that polished workpiece by relative motion of abrasive grain between polishing tool and workpiece. According to relative motion forms(polishing patterns) of abrasive grain, the surface quality is different. Then, polishing patterns are important essential in polishing process. In work field, polishing patterns are determined by an expert of experience. Therefore, to work effective polishing, it is necessary that evaluate polishing characteristics for polishing patterns. And, polishing machine is made with cartesian coordinate robots, we estimate polishing characteristics by measurement of surface roughness.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2000.04a
• /
• pp.411-416
• /
• 2000

Cutting process has been automated by progress of CNC and CAD/CAM, but polishing process has been depended on only experiential knowledge of expert. To automate the polishing process, a polishing robot with w degrees of freedom which is attached to a machining center with 3 degrees of freedom has been developed. This automatic polishing robot is able to keep the polishing tool normal on the curved surface of die to improve a performance of polishing. Polishing task for a curved surface die demands repetitive operation and high precision, but conventional control algorithm can not cope with the problem of disturbance such as a change of load. In this research, a new sliding mode control algorithm is applied to the robot. The signal compression method is used to identify polishing robot system. to obtain an effect of 5 degrees of freedom motion, a synchronization between the machining center and polishing robot is accomplished by using M code of machining center. And also a trajectory for polishing the curved surface die by 5 degrees of freedom motion, a synchronization between the machining center and polishing robot is accomplished by using M code of machining center. And also a trajectory for polishing the curved surface die by 5 axes machining center is divided into data of two types for 3 axes machining center and 2 axes polishing robot. To evaluate polishing performance of the robot. various experiments are carried out.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.7
• /
• pp.14-21
• /
• 2019

Large-diameter hydraulic devices such as the hydraulic reservoir in aircraft that serves to balance the hydraulic pressure in the various hydraulic devices in the cabin and to store hydraulic oil are operated by the internal piston systems. However, since this operates in an environment with high temperature and humidity, it may cause the inner surface to flake during its operation. Therefore, an anodizing surface treatment is applied to improve the corrosion resistance, abrasion resistance, and smooth operation. However, anodizing increases the surface roughness. Accordingly, the polishing process that improves the surface roughness after anodizing is important. However, the existing polishing process is performed manually, which results in an inefficient process. Therefore, in this study, we selected the optimum polishing conditions for effective polishing using the experimental design to improve the polishing process for the $Al_2O_3$ film that forms after anodization. Through experiments, we confirmed that the surface uniformity after polishing was superior as the feed rate was slower when the same polishing time had been applied.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.1
• /
• pp.109-115
• /
• 2004

Polishing process has been applied to get extremely fine surfaces, e.g., mirror surfaces such as optical mirrors, lens, molds and etc. Nowadays not only fine surface quality but also submicron order of dimensional accuracy is required for many applications. To meet the requirements polishing process should be provided with an active control of polishing pressure especially for automation of polishing process. In this paper a study on development of an active polishing pressure control system has been presented. A new type of tool assembly has been developed to facilitate the control. The tool is attached to an axis of a polishing machine with a coil spring and control of the polishing pressure is done by the position control of the axis, which needs no additional actuator. The polishing pressure is successfully measured by the measurement of the spring deformation. Control specifications were quantitatively considered by weighting functions and a controller was designed by using loop-shaping technique based on the no synthesis. Some experiments have been executed on a polishing machine with a PC-NC controller. It is shown that the results were coincident well with the theoretical analyses and satisfied the design specifications.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.05a
• /
• pp.78-83
• /
• 2009

In general, Light-hardening polymer was used UV nanoimprint technology. A light-hardening polymer was had the problem of poor hardness, durability. In order to overcome the problem of polymer, inter change optical glass. However glass is very manufacture and a lowering of standars transmittance. In order to glass recover was necessary polishing process. The process is magnetorheological fluids polishing. MR polishing has been developed as a new precision finishing technique to obtain a fine surface. Hence, Magnetorheological fluids has been used for micro polishing to get micro parts. This polishing process guarantees high polishing quality by controlling the fluid density electrically. The applied material in experiments is fused silica glass. Fused silica glass is widely used in the optical field because of high degree of purity. For MR polishing experiments, MR fluid was composed with DI-water, carbonyl iron and nano slurry ceria. The wheel speed and electric current were chosen as the variables for analyzing the characteristics of MR polishing process. Outstanding surface roughness of Ra=1.58nm was obtained on the fused silica glass specimen. And originally glass transmittance was recover on the fused silica glass.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.139-144
• /
• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2000.04a
• /
• pp.8-13
• /
• 2000

Die polishing technology is very critical to determine quality and performance of the final products. Die polishing processes have not been automated because the automation requires a great deal of experience and skill of experts. Thus, to implement a fully automated polishing process, the development of polishing status monitoring system replacing the skill of experts is critical. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increased. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study, The polishing state monitoring system using AEms signal was developed. This system can be not only to monitor the abnormal state but also to estimate a state of surface roughness of polishing surface qualitatively.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.464-467
• /
• 2005

Among several polishing techniques for micro structures, polishing process using magnetorheological(MR) fluid has advantages in the finishing process of 3-D micro structures because abrasives in the fluid can reach surfaces with complex feature and play their role. Although many researchers have been trying to reveal its polishing mechanism of the MR polishing, it has not been successful because in-situ measurement of state variables is difficult and process parameters are complex. In fact, one of the key factors for applying process control methodologies, such as Run-to-Run control, is the measuring and monitoring of slurry quality because the process strongly depends on the fluid property. Therefore, it is necessary to maintain consistent slurry quality to guarantee the process repeatability. The proposed equipment achieves the longer life cycle of MR fluid and reduces the variability of products. A new method to measure the material removal rate in MRF polishing process is also proposed and discussed.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.1
• /
• pp.99-106
• /
• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.