• Title/Summary/Keyword: Polishing method

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Effect of Modified Fiber Tip on Joint Angle Measurement (광섬유 종단각도 효과를 이용한 관절각 측정)

  • Jung, Gu-In;Kim, Ji-Sun;Lee, Tae-Hee;Choi, Ju-Hyeon;O, Han-Byeol;Kim, A-Hee;Jun, Jae-Hoon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.7
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    • pp.929-933
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    • 2014
  • The measurement of joint angle is important to evaluate the patient's disability. The modified fiber tip and light propagation of the developed fiber sensor were investigated to increase the range of angle detection. Different shapes of fiber tips were manufactured with a polishing machine to deliver light signal in various patterns. Output signals were analyzed to obtain joint angle change with inverse polynomial models. The measured joint angles were displayed with LabVIEW program and the reliability was tested by comparing with a commercial angle sensor. This method can be used in rehabilitation field to determine patient's progress.

A Study on CMP Characteristics According to Shape of Colloidal Silica Particles (콜로이달 실리카 입자 형상에 따른 CMP 특성에 관한 연구)

  • Kim, Moonsung;Jeong, Haedo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.1037-1041
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    • 2014
  • Slurry used for polishing semiconductors processed by exchange, pressurization, and multi-step feeding has been studied to investigate the effect of the size and shape of slurry particles on the oxide CMP removal rate. First, spherical silica sol was prepared by the ion exchange method. The spherical silica particle was used as a seed to grow non-spherical silica sol in accordance with the multi-step feeding of silicic acid by the ion exchange and pressurization methods. The oxide removal rate of both non-spherical silica sol and commercially available slurry were compared with increasing average particle size in the oxide CMP. The more alkaline the pH level of the non-spherical silica sol, the higher was the removal rate and non-uniformity.

Complete denture rehabilitation of fully edentulous patient with severe bone resorption and class II jaw relation using piezography (심한 골 흡수와 2급 악간관계를 보이는 완전 무치악 환자의 Piezography를 이용한 총의치 수복)

  • Kwon, Wooil;Song, Young-Gyun;Lee, Joon-Seok
    • The Journal of Korean Academy of Prosthodontics
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    • v.54 no.4
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    • pp.445-450
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    • 2016
  • Piezography, prosthetic space recorded by pronunciation, can be used as a reference for arrangement of artificial teeth and polishing surface of a denture. In this case, a 67 year old female patient was presented for new dentures. Old dentures had class II relationship and poor retention. For fabrication of stable dentures, using piezography and lingualized occlusion was planned. After taking impressions with conventional method, conventional denture bases with wax rim were fabricated. Then, additional mandibular denture base was fabricated for piezography. With fast setting silicon impression material, piezography was recorded by using six pronunciations, 'si', 'so', 'me', 'te', 'de', and 'mu'. According to the piezographic space, mandibular artificial teeth were arranged and modified for lingualized occlusion. As a result, the patient was satisfied with new dentures functionally and esthetically.

THE COMPARATIVE STUDY OF THERMAL INDUCTIVE EFFECT BETWEEN INTERNAL CONNECTION AND EXTERNAL CONNECTION IMPLANT IN ABUTMENT PREPARATION (구강내에서 임플랜트 지대주 형성 시 내부연결방식과 외부연결방식간의 열전달 효과 비교)

  • Huh, Jung-Bo;Ko, Sok-Min
    • The Journal of Korean Academy of Prosthodontics
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    • v.45 no.1
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    • pp.60-70
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    • 2007
  • Statement of problem: The cement-type abutment would be needed for the reduction of its body in order to correct the axis and to assure occlusal clearance. In the case of intraoral preparation, there is a potential risk that generated heat could be transmitted into the bone-implant interface, where it can cause deterioration of tissues around the implant and failed osseointegration. Purpose: The purpose of this study was to assess the difference of the heat transmitting effect on external and internal connection implant types under various conditions. Material and method: For evaluating the effects of alternating temperature, the thermocoupling wires were attached on 3 areas of the implant fixture surface corresponding to the cervical, middle, and apex. The abutments were removed 1mm in depth horizontally with diamond burs and were polished for 30 seconds at low speed with silicone points using pressure as applied in routine clinical practice. Obtained data were analyzed using Mann-Whitney rank-sum test and Wilcoxon / Kruskal-Wallis Tests. Result: Increased temperature on bone-implant interface was evident without air-water spray coolant both at high speed reduction and low speed polishing (p<.05). But, the difference between connection types was not shown. Conclusion: The reduction procedure of abutment without using proper coolant leads to serious damage of oral tissues around the implant irrespective of external and internal connection type.

Property variation of transistor in Gate Etch Process versus topology of STI CMP (STI CMP후 Topology에 따른 Gate Etch, Transistor 특성 변화)

  • Kim, Sang-Yong;Chung, Hun-Sang;Park, Min-Woo;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.181-184
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    • 2001
  • Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STD structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters. we studied the correlation between CMP thickness of STI using high selectivity slurry. DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased. the N-poly foot is deteriorated. and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point,, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by $100\AA$. 3.2 $u\AA$ of IDSN is getting better in base 1 condition. In POE 50% condition. 1.7 $u\AA$ is improved. and 0.7 $u\AA$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

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A Study on the Neoasozine Residues in Rice Grain by Neutron Activation Method (방사화(放射化) 분석법(分析法)에 의한 미곡(米穀)중 네오아소진 잔류분(殘留分)에 관한 연구(硏究))

  • Kim, Yong-Hwa;Lee, Koon-Ja;Lee, Su-Rae
    • Korean Journal of Food Science and Technology
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    • v.13 no.1
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    • pp.20-24
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    • 1981
  • Residues of neoasozine in rice grain were determined by neutron activation and colorimetric techniques. Twice application of the chemical before flowering did not lead to any increased residue level while 4-times application resulted in significant increase in the residue level up to 0.54-0.75 mg $As_2O_3/kg$. The partition ratio of arsenic residues into polished rice grain and bran was 73 : 27 in 100% polishing while most of the residues in the bran was transferred to oil cake fraction during solvent extraction, reaching up to 2.9 mg $As_2O_3/kg$. The neutron activation technique was advantageous because of its high sensitivity and the smaller sample amounts required for analysis.

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The effects of the surface defects on the hydroformability of extruded aluminum tubes (알루미늄 압출 관재의 표면 결함이 하이드로포밍 성형에 미치는 영향도에 관한 연구)

  • Kim D. H.;Kim B. J.;Park K. S.;Moon Y. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.247-250
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    • 2005
  • The need for improved fuel efficiency, weight reduction has motivated the automotive industry to focus on aluminum alloys as a replacement for steel-based alloy. To cope with the needs for high structural rigidity with low weight, it is forecasted that substantial amount of cast components will be replaced by tubular parts which are mainly manufactured by the extruded aluminum tubes. The extrusion process is utilized to produce tubes and hollow sections. Because there is no weld seam, the circumferential mechanical properties may be uniform and advantageous for hydroforming. However the possibility of the occurrence of a surface defect is very high, especially due to the temperature increase from forming at high pressure when it comes out of the bearing and the roughness of the bearing, which cause the surface defects such as the dies line and pick-up. And when forming a extruded aluminum tube, the free surface of the tube becomes rough with increasing plastic strain. This is well known as orange peel phenomena and has a great effect not only on the surface quality of a product but also on the forming limit. In an attempt to increase the forming limit of the tubular specimen, in the present paper, surface asperities generated during the hydroforming process are polished to eliminate the weak positions of the tube which lead to a localized necking. It is shown that the forming limit of the tube can be considerably improved by simple method of polishing the surface roughness during hydroforming. And also the extent of the crack propagation caused by dies lines generated during the extrusion process is evaluated according to the deformed shape of the tube.

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Preparation of Inorganic Ultrafiltration Membrane by Anodic Oxidation in Oxalic Acid (수산전해액하에서 양극산화에 의한 무기 UF막의 제조)

  • Lee, Chang-Woo;Hong, Young-Ho;Chang, Yoon-Ho;Hahm, Yeong-Min
    • Applied Chemistry for Engineering
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    • v.9 no.4
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    • pp.536-541
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    • 1998
  • The porous size alumina membrane was prepared by anodic oxidation with current method in an aqueous solution of oxalic acid. The aluminum metal plate was pretreated with thermal oxidation, chemical polishing and electropolishing before anodic oxidation. Membrane thickness and pore size distribution were investigated with several anodizing conditions; reaction temperature, cumulative charge, electrolyte concentration and current density. The porous alumina membrane obtained was $55{\sim}75{\mu}m$ thick with straight micropore of 45~100nm. Also, the porous alumina membrane has an uniform pore diameter and pore distribution. It was inorganic ultrafiltration membrane as a kind of the ceramic membrane.

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Development of point-of-use filter evaluation method using chemical mechanical planarization slurry (Chemical mechanical planarization 슬러리에 사용되는 point-of-use 필터의 평가 방법 개발)

  • Jang, Sunjae;Kulkarni, Atul;Kim, Hyeong-U;Kim, Taesung
    • Particle and aerosol research
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    • v.12 no.4
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    • pp.145-150
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    • 2016
  • During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

Design of Optical Filter with Multilayer Slab/Fiber Structure (다층 슬랩-광섬유접속구조를 갖는 광필터의 설계)

  • Jeoung, Chan-Gwoun;Kang, Young-Jin;Kim, Sun-Youb
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.6
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    • pp.1369-1375
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    • 2007
  • The recent, a large capacity of telecommunication networks is required in order to it is in proportion to capacity of information communication increase and to satisfy a demand because of the demand about Internet, a multimedia service of internet, Video of internet protocol(VoIP), Audio/Video streaming. As a result, DWDM(Dense Wavelength Division Multiplexing)technologies are emerging to be a prevailing the method of solving it without additional optical fiber network building and high-speed equipment. Therefore this thesis proposed the optical filter of fiber/multilayer slab coupled structure combining it to multilayer slab waveguide by polishing the cladding of one side of fiber to design the optical filter having these functions. When a separation distance of fiber and slab was $3{\mu}m$, The optical filter proposed as the simulation result was satisfied with a DWDM filter characteristic with FWHM of 0.1nm on TM mode and TE mode as 32nm polarization independence in a communication window of $1.3{\mu}m$ when center wavelength was each ${\lambda}_0=1.274755{\mu}m$ and ${\lambda}_0=1.30591{\mu}m$.

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