• Title/Summary/Keyword: Polishing System

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Basic Studies on Corrective Polishing (형상수정 폴리싱에 관한 기초연구)

  • 김의종;김경일;김호상
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.783-786
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    • 2000
  • For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.

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Development of Computer Control Polishing System for Free Form Surface (자유곡면 연마를 위한 자동 연마 시스템 개발)

  • 전문식;오창진;이응석;김옥현
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.327-331
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    • 2001
  • In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

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Development of Automatic System for Die Polishing (금형의 자동연마 시스템 개발)

  • 안중환;정해도;이민철;전차수;이만형;조규갑
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.4
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    • pp.69-80
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    • 2000
  • Generally, die polishing is a lime consuming process, resulting in 30∼50% of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

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Development of Monitoring System for Polishing Robot Based on Web

  • Hong, Chang-Woo;Go, Seok-Jo;Lee, Min-Cheol
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.57.4-57
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    • 2001
  • Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. Some workers tend to gradually avoid the polishing work because of the poor working conditions caused by dust and noise. In the our previous study, an automatic polishing system was developed to reduce the polishing time and cope with the shortage of skilled workers. And, to operate the polishing robot system from remote sites, communication network was constructed and monitoring programs (a server program and a client program)) were developed. However, to monitor polishing process in remote sites, users have to install monitoring programs in a client PC. Thus, user can only operate the polishibg system ...

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Development of Monitoring System for Remote Management of Polishing Robot (연마 로봇의 원격 관리를 위한 모니터링 시스템 개발)

  • 고석조;이민철;홍창우
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.625-631
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    • 2002
  • In the previous study, a polishing robot system was developed to automate the polishing process and to cope with the shortage of skilled workers. This polishing robot system has several advantages: reduced time for setting polishing work, decreased labor costs, effective operation, continuous polishing work without an operator, improved machine accuracy, and the ability to polish a free curved surface die. However, still the problem remains that a worker must stay to monitor the polishing process in the poor working conditions for a long time. Nowadays some advanced manufacturing companies need to find a way to check the performance of their production equipments and plants from remote sites. Thus, this study constructed the communication network and developed the monitoring programs (a servo program and a client program) to operate the polishing robot from remote sites. Using these programs, workers are able to monitor and control the polishing robot on the web page, in any place where internet service is possible. To guarantee a stable operation in spite of a variable computer operating environment, the monitoring system is implemented in Java. The experimental results showed that the developed monitoring programs provided a stable communication.

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Development of Mirror~like Polishing System for Hemispherical High-¬speed Precision Bearing for Digital VTR Drum (디지탈 VTR 드럼용 반구 고속 정밀베어링의 경면연마 시스템)

  • 김정두;최민석;우기명;김영일
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.24-28
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    • 1996
  • Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

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A Study on the Distribution of Friction Heat generated by CMP Process (CMP 공정에서 발생하는 연마온도 분포에 관한 연구)

  • 김형재;권대희;정해도;이용숙;신영재
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.3
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    • pp.42-49
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    • 2003
  • In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.

A Study on the Characteristics of Material removal using a Round endmill Type MR Polishing System for 3D Shape (3차원 형상 연마를 위한 라운드 엔드밀 타입 MR연마시스템의 재료제거 특성에 관한 연구)

  • Hong, Kwang-Pyo;Shin, Bong-Cheol;Kim, Dong-Woo;Cho, Myeong-Woo;Je, TAe-Jin
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.5
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    • pp.632-638
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    • 2011
  • Recently, it has been studying for the polishing process of micro parts widely. However, present MR polishing system, it is difficult to minimize electromagnet and to polish sphere or slope parts. Then, it can not be obtained demanded surface quality. In this study, material removal characteristics of BK7 glass using round endmill type MR polishing system were investigated through series of experiment. The experiments were investigated by changing imposed polishing conditions, such as rotational speed and polishing depth. As a results, very high material removal was obtained at 0.7mm gap distance, 1,980rpm.

- Development of the multi axis whetstone system in the stone polishing process for the work environment improvement - (작업환경개선을 위한 석재연마공정에 있어서의 다축마석연마장치 개발)

  • Kang Ji Ho;Hong Dong Pyo
    • Journal of the Korea Safety Management & Science
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    • v.6 no.4
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    • pp.171-181
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    • 2004
  • A multi axis whetstone polishing system, which uses the flow system of the stone polishing machine head, has been developed. The test results show that the defect by line contact polishing does not occur in both ends of the stone and that it came to trim smoothly. In terms of the surface roughness, the corresponding index was decreased by 3.6 times, improving the polishing effect greatly. It decreased significantly the dust and noise with the wet polishing. The factors of the duty evasion at production site can thus be solved with the work environment improvement against the polishing process of the stone industry and work intensive reduction.

Design Variables of Chemical-Mechanical Polishing Conditioning System to Improve Pad Wear Uniformity (패드 마모 균일성 향상을 위한 CMP 컨디셔닝 시스템 설계 변수 연구)

  • Park, Byeonghun;Park, Boumyoung;Jeon, Unchan;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.38 no.1
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    • pp.1-7
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    • 2022
  • Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.