• 한국기계가공학회지
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• 제10권3호
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• pp.108-112
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• 2011

In order to obtain excellent flatness and surface roughness of glass substrate disk, uniform distribution of abrasives should be important for uniform polishing. We introduced coated-type magnetic abrasives and magnetic field to a lapping for the improvement of surface roughness and removal rate. Polishing properties with the conventional diamond abrasives and the coated-type magnetic abrasives were compared. As a result, the coated-type magnetic abrasives showed small surface roughness and large removal rate by applying magnetic field. And it also was shown that coated-type magnetic abrasives could save the more amount of polishing liquid under the same removal rate than the conventional diamond abrasives can.

• 대한기계학회논문집A
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• 제38권8호
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• pp.887-892
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• 2014

일반적인 자기연마가공에서 브러쉬는 연마입자와 자성입자 그리고 약간의 절삭유가 혼합되어 형상을 갖춘다. 그러나 공구가 고속으로 회전하게 되면 대부분의 연마입자는 원심력의 증가로 공구에서부터 떨어져나간다. 이러한 현상은 가공 효율을 저하시키는 결과를 야기한다. 이러한 문제점을 해결할 수 있는 방법 중 하나는 절삭유 대신에 실리콘 겔과 같은 고점성의 물질을 사용하여 입자의 구속을 증가시키는 것이다. 연마입자의 과도한 탈락에 대응하는 또 다른 방법은 습식자기연마(WMAP)이다. 습식자기연마는 절삭유가 공작물의 표면에 충분히 공급된 상태의 자기연마를 의미한다. 본 연구에서는 습식자기연마에서 구속된 연마입자의 구속량과 표면거칠기 향상의 상관관계를 분석하였다. 그 결과 습식자기연마에서 연마입자의 구속률이 낮음에도 불구하고 표면거칠기가 더 많이 향상됨을 알 수 있었다.

• 한국정밀공학회지
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• 제30권12호
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• 한국전기전자재료학회논문지
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• 제17권10호
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• Tribology and Lubricants
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• 제33권5호
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• pp.228-233
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• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.968-971
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• 2002

Two decisive mechanisms of the electrorhological polishing for a small part(for example, a aspherical surface in a micro lens) are explained. Firstly, non-uniform electric field generated in the polishing structure increases a shear stress of ER fluids which is maximized dramatically near the tool, therefore, substrate adjacent to the tool can be removed effectively by mixed abrasives in the ER fluid. Secondly, abrasives in a non-uniform electric field are governed by the dielectrophoretic phenomena. Abrasives move toward the tool because the field gradient is highest near the tool and then abrasives are actively holded in that area. This phenomena is observed and evaluated by the optical measurement.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.314-318
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• 2002

Recently, new polishing tool which was made by magnetic intelligent compound(Magic) was invented. The distribution of abrasives in this new tool can be controlled by magnetic field. Therefore, we can make a special polishing tool which has well arranged abrasives after cooling. In this study, 3 dimensional polishing machine was developed in order to polish complicated - shaped inner surfaces of molds. The performance of developed machine was investigated by measuring the roughness of polished surface using new polishing tool.

• 한국생산제조학회지
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• 제20권3호
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• pp.274-279
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• 2011

In this study, new abrasives that were composed of iron powder and carbon nanotube (CNT) particle were attempted to be abrasives for magnetic abrasive polishing. Because the CNT particles itself are very small ones with high hardness and magnetic strength, these properties are effective for magnetic abrasive polishing of nonmagnetic materials. As an experimental result for evaluating the machining characteristics in magnetic abrasive polishing, the CNT particles showed better performance than the conventional abrasives such as Fe and CBN powder.

• 한국정밀공학회지
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• 제21권10호
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• pp.34-41
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• 2004

A new method to fabricate the fine magnetic abrasives by using mechanical alloying is proposed. The mechanical alloying process is a solid powder process where the powder particles are subjected to high energetic impact by the balls in a vial. As the powder particles in the vial are continuously impacted by the balls, cold welding between particles and fracturing of the particles take place repeatedly during the ball milling process using a planetary mill. After the manufacturing process, fine magnetic abrasives which the guest abrasive particles c lung to the base metal matrix without bonding material can be obtained. The shape of the newly fabricated fine magnetic abrasives was investigated using SEM and its polishing performance was verified by experiment. It is very helpful to finishing the injection mold steel in final polishing stage. The areal ms surface roughness of the workpiece after several polishing processes has decreased to a few nanometer scales.

• 한국정밀공학회지
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• 제21권8호
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.