• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.600-602
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• 1995

Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.212-215
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• 2005

Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

• Applied Microscopy
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• v.46 no.3
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• pp.167-169
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• 2016

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

• Clinics in Shoulder and Elbow
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• v.18 no.2
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• pp.105-112
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• 2015

In orthopedic trauma surgery, treatment of intraarticular distal humerus fractures is a challenge. With development of implants and biomechanical studies, surgical strategies with recommendations including preoperative computed tomography images, proper approaches and open reduction and internal fixation with dual plates have emerged. In addition, as an effort to provide stable fixation to permit early elbow motion, different methods of internal fixation, particularly plate configuration, have evolved. Using dual plates, either oriented parallel to each other or orthogonal, stable fixation has been achieved and satisfactory clinical outcomes have been reported. With rationales and advantages/disadvantages of each plate configuration, both techniques are selected according to surgeons' preference, and, in specific cases, one could be preferred over another. The key to successful fixation by either technique is obtaining anatomical reduction with restoration of two stable columns of the distal humerus.

• Journal of Magnetics
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• v.11 no.3
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• pp.119-122
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• Journal of Magnetics
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• v.2 no.2
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• pp.38-41
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• 1997

Spinel ferrite thin films Fe3-x MnxO4 (x=0.000, 0.006, 0.0010, 0.015, 0.023) were prepared on the coverglass by ferrite plating technique. To investigate the uniaxial anisotrpy of the samples, the saturation and effective magnetization of the thin films were measured by VSM(vibrating sample magnetometer) and FMR(ferromagnetic resonance) measurements respectively. The spectroscopic splitting g factor were estimated from the ferromagnetic resonance curves. For x=0.000, 0.006, the effective magnetization was measured of temperatures form T=77 K to T=300 K. The results were analyzed in terms of Bloch's law Ms(T) = Ms(0) (1-BT3/2-CT5/2). The Bloch coefficient B, C were determined by fitting. Ms(0) was obtained by extrapolating Meff to 0 K. From this result, the spin wave stiffness constants D was also determined.

• Journal of the Korean institute of surface engineering
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• v.24 no.3
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• pp.125-136
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• 1991

a mathematical model is presented to describe the current distribution on a rotaing disk electrode under the galvanostatic pulse conlitions. A numerical technique by finite difference method to the transient convective diffusion equation, coordinate transformation and separation of variables to Laplace equation, and an iterative algorithm to solve the above equations simtltaneously with approximate boundary conditions were developed. An experimental investigated based on copper deposition in a copper sulfate-sulfuric acid system was performed and satisfactory agreement was obtained between expermental and theoretical current distribution. The current distribution of copper deposition is secondary current distribution within the experimental conditions. Dimensionless variables, N and J as well as Wagner number were used to determine the criteria for the uniformity of current distribution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.155-157
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• 2008

High velocity oxy-fuel (HVOF) thermal spraying coating has been used widely throughout the last 60 years mainly in defense, aerospace, and power plants. Recently this coating technique is considered as a promising candidate for the replacement of the traditional electrolytic hard chrome plating (EHC) which pollutes the environment and causes lung cancer by toxic hexa-valent $Cr^{6+}$. In this study, two kinds of cermet coatings, WC-CoCr and WC-CrC-Ni, are formed by HVOF spraying. The corrosion and electrochemical properties are evaluated by polarization tests in 3.5 wt% solutions.

• 연구논문집
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• s.22
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• pp.151-160
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• 1992

The wear resistance of electroless Ni-P-X(X A1203, Diamond) composite coating layers was studied by Taber abrasion test technique. The wear resistance of composite coating layers was particularly relied upon the codeposited content, particle size and distribution of particles, and heat treatment of coating layers, as well as the electroless nickel plating bath employed. In this study, we lay emphasis on the wear resistance of electroless composite coating layers containing A1203 particles(1.2~Im, 6.7hIm, 11.5lIm, 20l1m) or diamond particles (1.5jim, 5gm). From the result of composite coating A1203 and diamond particles, the wear resistance of composite coating layers is as follows.