[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.9729/AM.2016.46.3.167

Cross-Sectional Transmission Electron Microscopy Sample Preparation of Soldering Joint Using Ultramicrotomy

Bae, Jee-Hwan (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Kwon, Ye-Na (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Yang, Cheol-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University)

Publication Information

Applied Microscopy / v.46, no.3, 2016 , pp. 167-169 More about this Journal

Abstract

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

Keywords

Sn-Ag solder; Electroless nickel immersion gold plating; Interfacial reaction layer; Ultramicrotomy; Transmission electron microscopy;

Citations & Related Records

Reference

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