• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.100-103
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• 2001

In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.6
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• pp.283-291
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• 2012

In order to increase the anti-oxidation property during the tailor welding blanked hot press forming process for a high strength boron steel sheet, we performed a different coating method on the boron-steel sheet such as 87% Al - 13% Si and Fe - 8.87 Zn dipping plating procedure. However, during laser welding process, the Al-Si coated steel sheet has showed a low tensile strength and about half value of elongation than the original boron-steel sheet. Aluminum and silicon, elements of coating layer were diffused into the boron-steel matrix and have shown a low strength result than non-coated specimen. On the other hand, Zinc-coated boron-steel has expectedly showed a excellent tensile strength and micro-harness value in the welded area like original boron-steel.

• Journal of the Korean Magnetics Society
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• v.15 no.3
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• pp.198-201
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• 2005

We investigated the effects of organic additives on the properties of nickel-copper thin films prepared by electroplating. Compared with thin films fabricated by pure electrolyte only, the films utilizing organic additives show different crystalline orientations. With no alteration of plating conditions simply adding the organic materials changed the composition of copper and nickel. The concentration of nickel could be varied to $65-95\%$ depending on the species and concentration of the additives. The change of material property has contributed to the increase or decrease of the magnetoresistance.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.267-275
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• 1995

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.

• Journal of Hydrogen and New Energy
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• v.4 no.1
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• pp.41-50
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• 1993

The hydrogen absorption and desorption characteristics of microencapsulated (CFM)$Ni_{4.7}Al_{0.2}Fe_{0.1}$ and $MmNi_4Fe$ powder with Ni and/or Cu by means of chemical plating method have been investigated. Initial hydrogen absorption rate and activation property were increased remarkably by encapsulation and subsequent compacting. Pellets abtained by compacting of Cu-encapsulated fine powder have fairly good strength even after 30 cycles of hydriding and dehydriding. Encapsulated alloy powder and their compacts show a good resistance to degradation by $O_2$ or CO in hydrogen.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.6
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• pp.335-340
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• 2003

To improve properties of wear resistance and anti-corrosion of the trivalent chromium platings, oxinitrocarbunsing and steam oxidation were conducted. Armophous trivalent Cr platings could be transformed to chromium carbides of high hardness, that showed low friction and wear rate. Even though micro-cracks were within as platings, superior anti-corrosion property was obtained by these treatments due to healing of cracks at the interface between the trivalent chromium platings and substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.183-192
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• 2001

1- Buildup PCB technology is utilized to a bare chip attach substrate technology for packaging of semiconductor chip 2- Requirement for the substrate design rule is described in SIA International Technology Roadmap for Semiconductor. 3- There are seven fabrication methods of build-up technology. 4- Coating and lamination for resin and photo, and laser for micro via hope processes are available. Below $50\mu\textrm{m}$ in diameter is possible. 5- Fine pitch lines down to $30\mu\textrm{m}$ can be achieved by pattern plating with better electrical property. 6- Dielectric loss reduction is a key material improvement item for next generation build-up technology. 7- High band width up to 512 GB/s is possible with current wiring groundrule.

• Tribology and Lubricants
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• v.12 no.2
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• pp.32-40
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• 1996

The tribological role of copper alloy fine particles in an additive is not well known compared to solid lubricants such as $MoS_{2}$ and PTFE. In this experimental investigation, a series of friction and wear test was undertaken to gain a better understanding of an additive containing copper alloy fine particles and to identify the effectiveness of copper alloy particles in improving tribological performance of the lubricant. Friction and wear of specimens under lubricated contact condition were studied and the worn surfaces were characterized by AES (Auger Electron Spectroscopy), SEM (Scanning Electron Microscopy) and optical microscopy. It was revealed that a copper-contained layer was formed and this layer resulted in considerable reduction in both friction and wear due to its lubricity and anti-wear property. The analysis of worn surface revealed that copper of the fine alloy particles in the additive helps healing the worn surface by plating and filling wear pits.

• Proceedings of the KIEE Conference
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• 2001.10a
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• pp.104-106
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• 2001

In this paper, it is object of design of high efficiency slotless BLDC motor using film coil. Slotless BLDC motor is able to have high efficiency property and low cogging torque, due to magnetization of stator core have constant contribution by slotless core. But it is difficult to make coil winding of slotless BLDC motor. So we make amateur of slotless BLDC motor using film coil. Film coil is fabricated by drilling, electro-plating and etching of copper/insulator/copper plate. In this paper, after design of slotless BLDC motor for moving axial blower, it is fabricated by NdFeB permanent magnet type rotor and film coil.

• Bulletin of the Korean Chemical Society
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• v.19 no.5
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• pp.533-539
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• 1998

A magnetic film was deposited on a slide glass substrate from aqueous solutions of $FeCl_2$ and $NaNO_2$ at 363 K. XRD analysis showed that the film was polycrystalline magnetite $(Fe_{3(1-{\sigma})}O_4)$ without impurity phase. The lattice constant was 0.8390 nm. Mossbauer spectrum of the film could be deconvoluted by the following parameters: isomer shifts for tetrahedral $(T_d)$ and octahedral $(O_h)$ sites are 0.28 and 0.68 mm/s, respectively, and corresponding magnetic hyperfine fields are 490 and 458 kOe, respectively. The estimated chemical formula of the film by the peak intensity of Mossbauer spectrum was $Fe_{2.95}O_4$. Low temperature transition of the magnetite (Verwey transition) was not detected in resistivity measurement of the film. Properties of the film were discussed with those of pressed pellet and single crystal of synthetic magnetites. On the surface of the film, magnetite particles of about 0.2 μm in diameter were identified by noncontact atomic force microscopy (NAFM) and magnetic force microscopy (MFM).