Effects of Electron Beam Heating(EBH) on the Properties of ion Plated Ti(C, N) Films

이온도금된 Ti(C, N)피막의 물성에 대한 전자빔가열 효과

  • 김치명 (아주대학교 재료공학과) ;
  • 고경현 (아주대학교 재료공학과) ;
  • 안재환 (아주대학교 재료공학과) ;
  • 배종수 (한국기계연구원 재료공정 연구부) ;
  • 정형식 (한국기계연구원 재료공정 연구부)
  • Published : 1995.10.01

Abstract

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.

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