• 제목/요약/키워드: Plating equipment

검색결과 39건 처리시간 0.021초

도금 공장의 화재 예방을 위한 도금장비 개선에 관한 연구 (A Study on improvement of plating equipment for fire prevention)

  • 김성재;김성곤;유우식
    • 대한안전경영과학회지
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    • 제19권4호
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    • pp.35-42
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    • 2017
  • A number of plating companies have been exposed to the risk of fire due to unexpected temperature increasing of water or other reasons in a plating bath. Since the companies are not able to forecast the unexpected temperature increasing of plating bath and most of raw materials in the bath have low ignition temperature, it is easy to be exposed to the risk of fire. Thus, in previous study, we tried to monitor and notice the dangerous change of temperature of water immediately to prevent the risk of fire from plating process. However, unfortunately previous studies were not able to shut out the fundamental cause of fire since bath temperature sensor can detect air temperature when the level sensor was malfunctioned. In this paper we developed the Teflon heater which contains a built in temperature sensor and improved plating equipment system. Teflon heater is improved using Pt $100{\Omega}$ sensor which can detect until $600^{\circ}C$. When the bath temperature sensor detects over $60^{\circ}C$ or the Teflon heater sensor detects over $240^{\circ}C$ they temporarily shut down the heater to control temperature. Also relay completely shuts down main power when detects instant temperature is detected over 5% of $240^{\circ}C$ by the heater sensor to prevent teflon melting down and fire spreads. Developed plating equipment system can monitor a real time temperature in the teflon tube and bath water. Therefore we think the proposed plating equipment can eliminate the possibility of fire in plating processes fundamentally.

Research on the Solution and Properties of Ni-P/n-$Al_2O_3$ Electroless Composite Plating

  • Huang, Yan-bin;Liu, Fei-fei;Zhang, Qi-yong;Ba, Guo-zhao;Liang, Zhi-jie
    • Corrosion Science and Technology
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    • 제6권5호
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    • pp.257-260
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    • 2007
  • In order to further improve the corrosion resistance and wear resistance of the Ni-P coatings of electroless plating, electroless Ni-P/n-$Al_2O_3$ composite deposits were prepared by adding some nano $Al_2O_3$ Particles in Ni-P plating bath. The bath composition and proproties were studied in this paper. The orthogonal test was applied in order to get the new composite solution, taking the initial stable potential as evaluation standard and considering the elements correlation at the same time. The processing parameters have been optimized by single factor experiment in which the depositing speed was chosen as the evaluation standard. The results showed that the process is stable and the composite Ni-P/n-$Al_2O_3$ deposits werebright and smooth, whose hardness and corrosion resistance are much better than simple Ni-P coatings. Furthermore the surface appearance and structure of the composite Ni-P/n-$Al_2O_3$ coating were investigated by SEM and XRD method. It was proved that the coating surface is typical cystiform cells and its structure is amorphous. All test results ofcomposite coating showed that all various physical coating properties had been improved by adding nano-particles. The hardness of optimal coating is more than 600HV and increases to 1000HV after heat-treating, and its hardness is 20~50% higher than Ni-P coating. The rust points appeared in 200 hour by immersing the coating into the 10%HCl solution and the corrosive speed is $3{\times}10^{-3}mg/(cm^2{\cdot}h)$which was obtained after 300 hour. In the same condition Ni-P coating is $5.6{\times}10^{-3}mg/(cm^2{\cdot}h)$. The salt spray resistance of the layers can exceed 600h with the thickness $20{\mu}m$.

Sn-Cu 무연 도금용액 및 피막의 신뢰성평가 (A Reliability Test for ph-free SnCu Plating Solution and It's Deposit)

  • 이홍기;허진영
    • 한국표면공학회지
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    • 제38권6호
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    • pp.216-226
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    • 2005
  • Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

도금액의 내부 유입 방지를 위한 래버린스 시일 설계 (Labyrinth Seal Design for Preventing Internal Inflow of Plating Solution)

  • 이덕규;김완두
    • Tribology and Lubricants
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    • 제33권6호
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    • pp.256-262
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    • 2017
  • Molten zinc plating is a process in which zinc is thinly coated over a metallic or non-metallic surface. It is used in various industrial fields for corrosion resistance and decoration. During the process, a steel sheet is passed through a roll that rotates inside the molten zinc liquid in the temperature range of $460^{\circ}C$ to $680^{\circ}C$, and the plating liquid flows into the roll causing abrasion and erosion of the roll surface. This problem is known to accelerate the replacement cycle of the roll and cause considerable economic loss owing to production line stoppage. Here, we propose a mechanism that operates at high temperature and pressure with a labyrinth type seal design to resolve this problem. We theoretically investigate the flow of the plating solution inside the seal and compute the minimum rotation speed required to prevent the plating solution from entering the seal chamber. In addition, we calculate the thermal deformation of the seal during operation and display thermally deformed dimensions at high temperatures. To verify the theoretical results, we perform experiments using pilot test equipment working in the actual plating environment. The experimental results are in good agreement with theoretical results. We expect our results to contribute towards the extension of the roll's life span and thereby reduce the economic losses.

아연도금공정의 안전성평가 (A Study on the Safety Assessment of Zinc Plating Process)

  • 이광원;박문희
    • 한국안전학회지
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    • 제18권4호
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    • pp.148-154
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    • 2003
  • There are now the plating process that have many hazardous factor cause of the using numerous noxious chemical and bad working environments. The purpose of the study is to make a selection of suitable safety evaluation method that can analyze and righteously find with numerous hazardous factor of the plating process. And another purpose is to systematically adjust the risk of plating process by comprehension of the role of process, equipment, and source material. Therefore, these studies are carried out in the following three investigations of this report. The first research understands the injurious human health and environment by analyzing hazardous material based on the MSDS. To evaluate the safety of process and compartment, the second research is proposed the security secure counterproposal by using the FMEA and the HAZOP. The final research is devoted to systematically analyze the hazard by applying for reasonable guide word and doing the HAZOP for hazardous factor in specific process.

무전해 주석도금시의 문제점과 그 대책에 대한 연구 (Study on tin immersion plating on printed circuit boads)

  • 김동필;염희택
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2001년도 추계학술발표회 초록집
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    • pp.3-3
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    • 2001
  • Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.

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INVESTIGATION OF MULTI-ARC PLASMA PLATING FILM EQUIPMENT BULAT-6 AND ITS TECHNICAL CHARACTERISTICS

  • Wen Xueya;Ma Te2ngcai;Hu Shejun
    • 한국진공학회지
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    • 제6권S1호
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    • pp.133-136
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    • 1997
  • In this paper multi-arc plasma plating film equipment Bulat-6 and its technical characteristics were analyzed in detail. This machine is the first of its kind in China. Influential factors and reducing methods on microdroplets of titanium were investigated. By method of electromagnetic field control and ion beam enhanced deposition excellent titanium nitride film could be obtained. Bicrohardness and adhesion were 250Mpa and 6.5Kg respectively.

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LED 검사장비용 탐침의 특성 규명 (Characterization of Probe Pin for LED Inspection System)

  • 심희수;김선경
    • 한국생산제조학회지
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    • 제24권6호
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    • pp.647-652
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    • 2015
  • A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

크롬 도금한 유압 실린더 로드와 시일 사이의 미끄럼접촉 해석 (Sliding Contact Analysis between Chromium Plated Hydraulic Cylinder Rod and Seals)

  • 박태조;김민규
    • 드라이브 ㆍ 컨트롤
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    • 제15권1호
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    • pp.10-15
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    • 2018
  • The hydraulic cylinder seals are used not only to protect leakage of the working fluids but also to prevent incoming of foreign particles into the system. Chromium plating is generally applied to improve corrosion and wear resistance. It has been noticed that sealing surface damage occurs due to the hard foreign/wear particles contained in the hydraulic oil. In this study, a three-bodied sliding contact problem related with a PTFE seal, a spherical particle and chrome-plated steel substrate is modeled to investigate the relations to wear mechanism. Using the nonlinear finite element software, MARC/MENTAT, the deformed shapes, the von Mises and first principal stress distributions with plating thickness were compared. The sealing surface was mainly abraded by hard particles embedded in the seal. The plastic deformation of the steel substrate decreased with thicker plating. Hence it could be more effective to coat the sealing surface of a hydraulic cylinder with a hard material such as TiN, TiC and DLC.

무전해 니켈/금도금 기술 개발에 관한 연구 (The Study on Development of Plating Technique on Electroless Ni/Au)

  • 박수길;박종은;정승준;엄재석;전세호;이주성
    • 전기화학회지
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    • 제2권3호
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    • pp.138-143
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    • 1999
  • 최근 large scale integrated circuits(LSI) 및 printed circuit board(PCB)의 세밀화가 전자기기의 소형화로 인하여 필수 불가결하게 되었다. 전해 도금은 LSI및 PCB의 전도도 및 부식저항을 향상시키기 위해서 전도성 라인의 말단에 적용되고 있다. 그러나 회로 기판의 소형화 및 고직접화로 인하여 적용되지 못하고 있다. 따라서 최근 무전해 도금은 복잡한 장치와 외부에서 전원을 필요치 않는 작동의 간편함 때문에 매우 각광 받고 있는 방법 중의 하나이다. 본 연구는 무전해 니켈/금도금의 도금 기술 개발을 위해 시험하였다. 무전해 니켈 도금은 $85^{\circ}C$의 도금 욕에서 PCB기판 위에 침적 시켰고 그 다음 금층은 동일한 방법으로 $90^{\circ}C$에서 니켈 층위에 침적 시켰다. Bonderbility는 무전해 니켈/금도금의 안정성을 평가하기 위해 gold wire 또는 solder ball 테스트로 실험하였다.