• Title/Summary/Keyword: Plating conditions

Search Result 239, Processing Time 0.023 seconds

On Electroless Plating and Double Sided Buried Contact Silicon Solar Cells

  • Ebong, A.U.;Kim, D.S.;Lee, S.H.;Honsberg, C.B.
    • Korean Journal of Materials Research
    • /
    • v.6 no.6
    • /
    • pp.568-575
    • /
    • 1996
  • The double sided buried contact(DSBC)silicon solar cell processing requires doping of the rear and front grooves with boron and phosphorus respectively. The successful electroless plating of these grooves with the appropriate metals haave been found to depend on the boron conditions for the rear fingers. However, an increased understanding of electroless plating has removed this restriction. Thus the DSBC cells using different boron conditions can be electrolessly plated with ease. This paper presents the recent work done on metallizing the double sided buried contact silicon solar cells with heavily doped boron grooves. The cells results indicate that, the heavier the boron grooves, the poorer the cell performance because of the probable higher metal contact recombination associated with boron grooves.

  • PDF

Influences of Plating Conditions on Magnetic Properties of Co-P Thin Films by Electroless Plating (무전해도금에 의한 코발트- 인 박막의 자성에 미치는 도금조건의 영향)

  • Choi, Byoung-Ik;Yeo, Woon-Kwan;Lee, Ju-Seong
    • Journal of the Korean institute of surface engineering
    • /
    • v.19 no.1
    • /
    • pp.3-12
    • /
    • 1986
  • Influences of pH, temperature, and composition of bath on the deposition rate and the magnetic properties were studied for two kinds of electroless Co-P plating bath. The results obtained are as follows. Ammonia alkaline citrate bath was more stable than ammonia alkaline tartrate bath, and the film deposited from citrate bath gave a higher squareness. The magnetic properties of the film obtained from citrate bath greatly depended upon pH. Under the optimum conditions, the film deposited from citrate bath had coercive force of 330 Oe and squareness of 0.67. However the films deposited from tartrate bath had coercive force of 300 Oe and squareness of 0.58.

  • PDF

Preparation of Composite Particles via Electroless Nickel Plating on Polystyrene Microspheres and Effect of Plating Conditions (무전해 니켈 도금된 폴리스티렌 복합 입자 제조 및 도금 조건의 영향)

  • Kim, Byung-Chul;Park, Jin-Hong;Lee, Seong-Jae
    • Polymer(Korea)
    • /
    • v.34 no.1
    • /
    • pp.25-31
    • /
    • 2010
  • Polymer core and metal shell composite particles have been prepared by the electroless nickel plating on the surface of monodisperse polystyrene microspheres. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling the dispersion medium in dispersion polymerization. Electroless nickel plating was performed on the polystyrene particle with diameter of $3.4\;{\mu}m$. The morphology of polystyrene/nickel composite particles was investigated to see the effect of the plating conditions, such as the $PdCl_2$ and glycine concentrations and the dropping rate of nickel plating solution, on nickel deposition. With $PdCl_2$ and glycine concentrations at more than 0.4 g/L and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was introduced by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min showed rather uniform plating.

A Study on Formation of Ni-Tl-P deposits by Electroless Plating (무전해도금에 의한 Ni-Tl-P 피막형성에 관한 연구)

  • 류일광;추현식
    • Journal of the Korean institute of surface engineering
    • /
    • v.33 no.2
    • /
    • pp.126-134
    • /
    • 2000
  • This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

  • PDF

Tribological Characteristics of Silver Electroless-Plating Process According to Thicknesses Variation (무전해 도금 코팅 공정을 이용한 은 박막의 두께 변화에 따른 트라이볼로지 특성)

  • Lee, Hyun-Dai;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.37 no.2
    • /
    • pp.219-225
    • /
    • 2013
  • In this study, the tribological characteristics of silver films that were deposited on a glass substrate by electroless plating were investigated. The electroless-plating method has many notable advantages. It is easy and economical to obtain solid films using this coating process, and it can be applied to both nonconducting and conducting substrates. In this study, silver was selected as the electroless-plating material because it is one of the most common materials used as a solid lubricant. The mechanical properties of silver electroless-plated specimens were investigated for various coating conditions. The thickness of the coating could be controlled by varying the electroless-plating time. The properties of the coatings were investigated using AFM, SEM, and a tribotester.

Preparation of Electromagnetic Wave Shielding Fabrics by Electroless Plating (무전해 도금법에 의한 전자파 차단 의류소재의 제조)

  • Kim Su Mi;Song Wha Soon
    • Journal of the Korean Society of Clothing and Textiles
    • /
    • v.29 no.1 s.139
    • /
    • pp.149-156
    • /
    • 2005
  • The purpose of this study was to produce the high quality of electromagnetic wave shielding fabrics. In this study, we have produced polyester fabrics by electroless Ag plating. The untreated polyester was etched with $4\%$ NaOH solution added accelerant(Benzyl Dimethyl Dodecyl Ammonium Chloride) then it was catalyzed by $SnCl_2$ solution and activated by $PdCl_2$ solution. Electroless Ag plating was carried out by changing conditions such as temperature. time, weight loss rate of polyester and kind of reducing agents. The electromagnetic wave shielding effectiveness of polyester fabric by electroless Ag plating was measured by RF Impedance Analyzer and element of electromagnetic wave shielding substance was measured using Electron probe micro analyzer. The results were as follows; The plating bath using potassium sodium tartrate by reducing agent was excellent electromagnetic wave shielding effectiveness. Element of electromagnetic wave shielding substance was silver. Electromagnetic wave shielding effectiveness was shown over 64dB at the temperature of $40^{\circ}C$, treating time 30min., weight loss rate $20\%$.

A Study on the Functional Electroless Ni Plating for Controled Morphology on the CBN Powder (CBN분말상에 석출형상 제어를 위한 무전해 기능성 니켈합금도금에 관한 연구)

  • Chu, H.S.;Kim, D.K.
    • Journal of the Korean institute of surface engineering
    • /
    • v.41 no.6
    • /
    • pp.312-324
    • /
    • 2008
  • In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

Effect of Current Density and Current Efficiency on the Decorative Property of Chromium Deposits using Oxalic Acid (수산을 사용한 크롬도금의 광택성에 미치는 전류밀도와 전류효율의 영향)

  • Oh, L.S.;Park, J.D.
    • Journal of Power System Engineering
    • /
    • v.5 no.1
    • /
    • pp.89-96
    • /
    • 2001
  • Decorative property of chromium deposition from oxalic acid bath containing chromium oxide and ammonium sulfate, has been examined over a wide range of bath compositions and plating conditions. The followings were determined as optimum bath composition, $CrO_3\;200{\sim}250g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700g/{\ell},\;(NH_4){_2}SO_4\;40{\sim}120g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density of $15{\sim}250Adm^2 $ at the bath temperatures of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration, bath temperature, and current density. The current efficiency decreased with increasing current density and bath pH, and increased with Increasing bath temperature. The highest current efficiency was obtained in the bath containing $80g/{\ell}$ of ammonium sulfate. Bright chromium deposits were not obtained at conditions of all the highest current efficiencies.

  • PDF

Plating Process of Micro-needle for MEMS Probe Card (MEMS Probe Card용 Micro Needle 공정 연구)

  • Han, Myung-Soo;Ahn, Su-Chang;Nam, An-Sik;Kim, Jang-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.11a
    • /
    • pp.152-152
    • /
    • 2008
  • Micro probe with Ni-Co tip was designed. Unit processes for fabricating the micro probe were developed. We are investigated the micro probe tip using by Ni-Co alloy. One-step and three-step needle was fabricated by plating process, CMP, and photolithography process. The plating thickness was varied by current density and time. Futher data will be extract by different process conditions.

  • PDF

Electroless Nickel-Boron Plating on p-type Si Wafer by DMAB (DMAB에 의한 P형 실리콘 기판 무전해 니켈-붕소 도금)

  • 김영기;박종환;이원해
    • Journal of the Korean institute of surface engineering
    • /
    • v.24 no.4
    • /
    • pp.206-214
    • /
    • 1991
  • In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

  • PDF