Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.11a
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- Pages.152-152
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- 2008
Plating Process of Micro-needle for MEMS Probe Card
MEMS Probe Card용 Micro Needle 공정 연구
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Han, Myung-Soo
(Korea Photonics Technology Institute)
;
-
Ahn, Su-Chang
(Korea Photonics Technology Institute)
;
- Nam, An-Sik (JML Co.) ;
- Kim, Jang-Hyun (JML Co.)
- Published : 2008.11.06
Abstract
Micro probe with Ni-Co tip was designed. Unit processes for fabricating the micro probe were developed. We are investigated the micro probe tip using by Ni-Co alloy. One-step and three-step needle was fabricated by plating process, CMP, and photolithography process. The plating thickness was varied by current density and time. Futher data will be extract by different process conditions.