• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 후기학술대회논문집
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• pp.196-197
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• 2005

Cathodic protection is one of the successful ways to prevent corrosion of steel structures in marine environments. The unique feature of cathodic protection in seawater is the formation of calcareous deposits on cathodic metal surface. The formation principles of calcareous deposit seawater had been known for a long time. That is, cathodic reduction reactions associated with cathodic protection in seawater generate $OH^-$ at the metal surface in accordance with the formular ; 1/2 $O_2$ + $H_2O$ + $2e^-$ $2OH^-$ and $2H_2O$ + $2e^-$ ${\rightarrow}$ $H_2$ + $2OH^-$. These reactions increase the pH at the metal / seawater interface. The high pH causes precipitation of $Mg(OH)_2$ and $CaCO_3$ in accordance with the formular ; $Mg^{2+}$ + $2(OH)^-$ ${\rightarrow}$ $Mg(OH)_2$ and $Ca^{2+}$ + $HCO_3^-$ + $OH^-$ ${\rightarrow}$ $H_2O$ + $CaCO_3$. These are typically the main compounds in calcareous deposits. It obviously has several advantages compared to the conventional coatings, since the environment-friendly calcareous deposit coating is formed by the elements($Mg^{2+}$, $Ca^{2+}$) naturally present in seawater. In this study, environmental friendly calcareous deposit films were prepared on steel plates by electro plating technic in natural seawater. The influence of current density on composition ratio, structure and morphology of the coated films were investigated by scanning electron microscopy formation process of calcareous deposits films in natural seawater. And we confirmed the properties of all the films can be improved greatly by controlling the material structure and morphology with effective use of the electroplating method in natural seawater.

• 한국표면공학회지
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• 제41권4호
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• pp.147-155
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• 2008

The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.68.2-68.2
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• 2017

인체접촉시 니켈도금의 알러지 반응을 억제하기 위한 대체 도금기술인 비 시안계 Cu-Sn 합금도금을 개발함에 있어서, 황산구리5수화물과 황산제일주석을 금속염으로 하여 황산 및 계면활성제, 유화제 등을 포함한 각종 유기첨가제를 포함하였고 특히 은백색조의 외관 색상과 안정적인 Cu-Sn 합금전착을 위해 2종의 착화제인 EDTP (Ethylenediaminetetrapropanol, $C_{14}H_{32}N_2O_4$)와 TEA (Triethanolamine)를 첨가한 비 시안계 Cu-Sn 합금 도금액을 도출하였다. Cu-Sn 합금도금 피막 조성의 균일화를 도모하기 위해서는 합금 도금액중의 Cu와 Sn 금속이온 농도를 일정하게 유지하는 것이 필요하다. 그러나 합금 도금액 중 2가 주석이온($Sn^{2+}$)은 수용액 중에서 4가 주석이온($Sn^{4+}$)으로 산화됨으로써 도금액 색상이 백탁이 되고 Stannic Hydroxide($Sn(OH)_4$, $SnO_2{\cdot}2H_2O$)이 생성되어 대량의 침전물이 침강하는 문제점이 발생되는 등시간 경과에 따른 도금액의 경시 변화가 발생되었다. 상기 침전물은 연속여과에 의해 제거 가능하나 합금 도금액 중 $Sn^{2+}$ 농도가 지속적으로 감소하게 된다. 이는 합금 도금액 중 금속이온 비율이 변동함으로써 합금도금 피막의 조성비를 일정하게 유지하는 것이 곤란해진다. 이에 $Sn^{4+}$ 침전물 생성을 방지하기 위한 산화방지제를 개발하고 또한 산화방지제의 첨가에 따른 도금 피막 외관에 미치는 영향을 평가하여 외관 개선을 위한 광택제를 개발하고자 한다. 본 연구의 결과를 토대로 니켈도금과 동등 이상의 기능 특성을 갖는 비 시안계 Cu-Sn 합금도금액을 개발하여 실용화하는 것을 목적으로 하였다.

• 한국정밀공학회지
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• 제25권4호
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• pp.134-139
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• 2008

A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.

• 한국표면공학회지
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• 제43권5호
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• pp.238-242
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• 2010

In the present work, the influence of oxide on the Cr-Si-N coatings was investigated for the Cr-Si-O-N coatings on AISI 304 and Si wafer deposited by hybrid system, which combines the DC magnetron sputtering technique and arc ion plating (AIP) using Cr and Si target in an $Ar/N_2/O_2$ gaseous mixture. As the O content in the Cr-Si-N coatings increased, the diffraction patterns of the Cr-Si-O-N coatings showed CrN and $Cr_2O_3$ phases. However, as the O content increased to 28.8 at.%, diffraction peak of $Cr_2O_3$ was disappeared in the Cr-Si-O-N coating. The $d_{200}$ value was decreased with increasing of O content. The average grain size increased from about 40 nm to 65 nm as the O content increased. The maximum micro-hardness of the Cr-Si-O-N coating was obtained 4507 Hk at the O content of 24.8 at.%. The average friction coefficient of the Cr-Si-O-N coatings was gradually decreased by increasing the O content and the average friction coefficient decreased from 0.37 to 0.25 by increasing the O content. These results indicated that amorphous phase was increased in the Cr-Si-O-N coatings by increasing of O content.

• 한국표면공학회지
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• 제51권1호
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• pp.62-70
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• 2018

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

• 한국표면공학회지
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• 제44권5호
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• pp.173-178
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• 2011

Separator of stack in polymer electrolyte membrane fuel cell (PEMFC) is high cost and heavy. If we make it low cost and lighter, it will have a great ripple. In this study, low carbon steel is used as base metal of separator because the cost of low carbon steel is very cheaper commercial metal material than stainless steels, which is widely used as separator. Low carbon steel has not a good corrosion resistance. In order to improve the corrosion resistance and electrolytic conductivity, low carbon steel needs to be surface treated. We made Chromium electroplated layer of $5{\mu}m$, $10{\mu}m$ thickness on the surface of low carbon steel and it was nitrided for 2 hours at $1000^{\circ}C$ in a furnace with 100 torr nitrogen gas pressure. Cross-sectional and surface microstructures of surface treated low carbon steel are investigated using SEM. And crystal structures are investigated by XRD. Interfacial contact resistance and corrosion tests were considered to simulate the internal operating conditions of PEMFC stack. The corrosion test was performed in 0.1 N $H_2SO_4$ + 2 ppm $F^-$ solution at $80^{\circ}C$. Throughout this research, we try to know that low carbon steel can be replaced stainless steel in separator of PEMFC.

• 폴리머
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• 제30권6호
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• pp.471-477
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• 2006

이온성 고분자-금속 복합체(ionic polymer metal composite, IPMC)는 낮은 구동 전압에서도 비교적 빠른 응답 속도를 갖는 전기활성고분자(electro active polymer, EAP) 재료이다. IPMC는 인간의 근육과 유사한 인성 및 변형 특성을 나타내므로 최근 인공근육용 구동체 개발을 위한 많은 연구들이 진행되어 왔으며, 또한 우주항공, 센서 및 펌프 등의 다양한 분야에서 적용가능성이 조사되고 있다. 본 연구에서는 액상 내피온을 이용하여 용액 캐스팅 방법으로 다양한 두께의 내피온 막을 제조하는 방법을 도입하였다. IPMC 제조방법은 Oguro가 제안한 방법을 기초로 하여 도금온도를 변화시켜 무전해 도금법을 이용하여 내피온 내부로의 1차 전극을 형성시켰으며, 형성된 1차 전극의 안정성과 표면전기저항을 낮추기 위하여 이온빔보조증착법(ion beam assisted deposition, IBAD)을 도입하여 금과 이리듐을 1차 전극표면 위에 증착하여 2차 전극을 형성시켰다. 1, 2차 무전해 도금한 IPMC와 2차 IBAD 코팅한 IPMC 전극의 표면과 단면 형상을 SEM으로 관찰하였으며, 전압을 인가할 때 IPMC 내부의 수분증발 및 이온전도도의 변화를 조사하였다. 또한 다양한 두께의 IPMC를 제조하여 두께변화에 따른 변위와 구동력을 측정하였다.

• Bulletin of the Korean Chemical Society
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• 제33권4호
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• pp.1135-1140
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• 2012

An electrochromatographic microchip with carboxyl-group-derivatized mono-disperse silica packing was prepared from the corresponding colloidal silica solution by utilizing capillary action and self-assembly behavior. The silica beads in water were primed by the capillary action toward the ends of cross-patterned microchannel on a cyclic olefinic copolymer (COC) substrate. Slow evaporation of water at the front of packing promoted the self-assembled packing of the beads. After thermally binding a cover plate on the chip substrate, reservoirs for sample solutions were fabricated at the ends of the microchannel. The packing at the entrances of the microchannel was silver coated to fix utilizing an electroless silver-plating technique to prevent the erosion of the packed structure caused by the sudden switching of a high voltage DC power source. The electrochromatographic behavior of the microchip was explored and compared to that of the microchip with bare silica packing in basic borate buffer. Electrophoretic migration of Rhodamine B was dominant in the microchip with the carboxyl-derivatized silica packing that resulted in a migration approximated twice as fast, while the reversible adsorption was dominant in the bare silica-packed microchip. Not only the faster migration rates of the negatively charged FITC-derivatives of amino acids but also the different migration due to the charge interaction at the packing surface were observed. The electrochromatographic characteristics were studied in detail and compared with those of the bare silica packed microchip in terms of the packing material, the separation potential, pH of the running buffer, and also the separation channel length.

• 전기화학회지
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• 제8권3호
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• pp.130-134
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• 2005

본 연구에서는 그동안 전기화학적으로 합성되지 못했던 III-V족 화합물 반도체 InSb를 구연산 용액으로부터 합성하였으며 자체 제조한 AAO를 나노템플릿으로 이용하여 정전압 도금을 실시하여 InSb 나노와이어를 제조하였다 제조된 InSb나노와이어는 X선 회절분석 결과 단결정의 나노와이어는 아니었으나 정확하게 화학양론을 만족시키는 화합물임을 확인하였고, 평판 박막 상태의 InSb와는 달리 나노와이어의 길이방향으로 (220) 방향의 결정이 주로 성장하는 우선결정방위를 가지고 있음을 알 수 있었다. 또한 집합적으로 배열된 상태에서 측정된 I-V특성 곡선에서는 n형 반도체의 특성을 보이되 밴드갭이 좁고, 전자이동도가 큰 InSb고유의 특성상 반금속과 유사한 전기적 특성을 보유하고 있음을 확인하였다.