• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.216-226
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• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.33.1-33.1
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• 2018

pH is expressed mathematically as $pH=-{\log}[H^+]$, is a measure of the hydrogen ion concentration, [$H^+$] to specify the acidity or basicity of an aqueous solution. The pH scale usually ranges from 0 to 14. Every aqueous solution can be measured to determine its pH value. The pH values below 7.0 express the acidity, above 7.0 are alkalinity and pH 7.0 is a neutral solution. The solution pH can be determined by indicator or by measurement using pH sensor, which measuring the voltage generated between a glass electrode and a reference electrode according to the Nernst Equation. The pH value of solutions depends on the temperature and the activity of contained ions. In nickel electroless plating process, the controlled pH value in some limited ranges are extremely important to achieve optimal deposition rate, phosphorus content as well as solution stability. Basically, nickel electroless plating solution contains of $Ni^{2+}ions$, reducing agent, buffer and complexing agents. The plating processes are normally carried out at $82-92^{\circ}C$. However, the change of its pH values with temperatures does not follow any rule. Thus, the purpose of study is to understand the relationship between pH and temperature of some based solutions and electroless nickel plating solutions. The change of pH with changing temperatures is explained by view of the thermal dynamic and the practical measurements.

• Journal of the Korean institute of surface engineering
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• v.40 no.1
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Journal of the Korean institute of surface engineering
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• v.25 no.3
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• pp.117-125
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• 1992

In the electrolysis process of zinc plating impurity ions must be removed from zinc chloride plating solution because it's harmful to the current efficiency and the purity of zinc plating. In this study using zinc ball as a prcipitant instead of zinc dust, the fundamental data for continuous cementation process was studied. Based upon two series of experiments that consist of batch experiment with cylindrical zinc specimen and continuous experiment with zinc balls, following results have been obtained. In the continuous experiment all impurity ions have been removed within 1 hour regardless of various experimental conditions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• Journal of the Korean institute of surface engineering
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• v.31 no.4
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• pp.209-216
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• 1998

It is well knownthat electroledd plating is the desirable surface treatment method which is being widely used to all kinds of material such as requiring corrosing resistance, wear resistance and conductivity, especially nonconductivity materials' surface plating. However, it is suggested that there are some problems that must be solved, for exaple, rate of plating, corrosion resistance, thickness of plating film etc. Therefore in this paper, when electroless nickel plating was performed on the PZT(Pb(Zr,Ti))with varying of solution composition such as NaOH, and $H_2NCH_2COOH$, the effect of the rate of plating and corrosion resistance were investigated.

• Journal of environmental and Sanitary engineering
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• v.17 no.3
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• pp.37-45
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• 2002

The Purpose of this study is to reduce environmental problems caused by landfill of bituminous coal fly ash emitted from the power plant and to reuse it. First of all, we experimented that Al and Si elements were extracted from fly ash and investigated that extracted Al and Si elements night use a coagulant. The extraction was carried out under various conditions ; concentration of the extraction solution, calcination temperature and calcination time. As the results, it was found that the optimum conditions of the extraction of Al and Si elements from fly ash were as follows, concentration of NaOH was 5N for both of them, calcination temperature was $700^{\circ}C$ and $600^{\circ}C$ and calcination time was 1hr and 1.5hr, respectively The extracted solution was used as a coagulant to treat the diluted metal-plating solutions which contained Pb and Cu, respectively. As the result of treatment on the diluted Pb-plating solution with 315NTU, the removal efficiency of turbidity was more than 90%, and the removal efficiency of Pb was about 80%. As for treatment of the non-turbid diluted Cu-plating solution, the removal efficiency of Cu was about 98%.

• Tribology and Lubricants
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• v.33 no.6
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• pp.256-262
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• 2017

Molten zinc plating is a process in which zinc is thinly coated over a metallic or non-metallic surface. It is used in various industrial fields for corrosion resistance and decoration. During the process, a steel sheet is passed through a roll that rotates inside the molten zinc liquid in the temperature range of $460^{\circ}C$ to $680^{\circ}C$, and the plating liquid flows into the roll causing abrasion and erosion of the roll surface. This problem is known to accelerate the replacement cycle of the roll and cause considerable economic loss owing to production line stoppage. Here, we propose a mechanism that operates at high temperature and pressure with a labyrinth type seal design to resolve this problem. We theoretically investigate the flow of the plating solution inside the seal and compute the minimum rotation speed required to prevent the plating solution from entering the seal chamber. In addition, we calculate the thermal deformation of the seal during operation and display thermally deformed dimensions at high temperatures. To verify the theoretical results, we perform experiments using pilot test equipment working in the actual plating environment. The experimental results are in good agreement with theoretical results. We expect our results to contribute towards the extension of the roll's life span and thereby reduce the economic losses.