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http://dx.doi.org/10.5695/JKISE.2007.40.1.032

A Study on the ENIG Surface Finish Process and Its Properties  

Lee, Hong-Kee (Nano-surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology)
Son, Seong-Ho (Nano-surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology)
Lee, Ho-Young (Nano-surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology)
Jeon, Jun-Mi (Nano-surface Technology Team, Division of Production Technology, Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean institute of surface engineering / v.40, no.1, 2007 , pp. 32-38 More about this Journal
Abstract
Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.
Keywords
Nickel; Electroless plating; ENIG; Black pad; Solderability;
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