• Title/Summary/Keyword: Plating

Search Result 1,855, Processing Time 0.04 seconds

A Study on the Low Temperature Preparation and the Practical Application of Ferrite Films by New Techniques. (신 기술에 의한 페라이트 막의 저온 제작과 그 응용에 관한 연구)

  • 최동진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.8
    • /
    • pp.658-663
    • /
    • 1998
  • Ferrite plating enables were grown by ferrite by plating method in solution at low temperature(<10$0^{\circ}C$). This faciltates the fabrication of new ferrite thin film devices using non- heat-resistant materials(plastic, GaAs ect) as substrates. Combining the ferrite plating with sonochemistry, application of power ultrasonic waves to stimulate chemical reactions, the crystallinity and qualities of films were improved. Modifying the reactions cell and plating conditions further improved the film quality.

  • PDF

A Study on the Crevice Corrosion Behavior of Chromium Plating (크롬도금의 틈부식 거동에 관한 연구)

  • 곽남인;임우조
    • Journal of the Korean institute of surface engineering
    • /
    • v.36 no.4
    • /
    • pp.324-328
    • /
    • 2003
  • This study was made on the crevice corrosion behavior of chromium plating in fresh water. Under the various crevice, the electrochemical polarization test of chromium plating was carried out. Results are discussed In terms of corrosion potential, polarization resistance, corrosion current density and cathodic control of chromium plating.

Pulse Rectifier For Electroplating (전기도금용 펄스 전원장치)

  • 권순걸
    • Proceedings of the KIPE Conference
    • /
    • 2000.07a
    • /
    • pp.685-688
    • /
    • 2000
  • Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.

  • PDF

The Frictional Resistance Of Tin Ion-Plated Co-Cr Orthodontic Wire (TiN 피막처리된 Co-Cr계 교정용 선재의 마찰저항력)

  • Lee, Ho-Kyu;Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
    • /
    • v.28 no.1 s.66
    • /
    • pp.123-133
    • /
    • 1998
  • The effectiveness of TiN ion-plating was examined with TiN ion-plated Co-Cr wires(.016“, .016”x.022“) on three different types of bracket(TiN ion-plated metal bracket ceramic bracket and plastic bracket). Maximum static frictional forces and characteristic curves obtained from the frictional characteristic graph, were compared and surface roughness of wires and bracket slots before and after friction experiment was observed by SEM. The obtained results were as follows $\cdot$The frictional forces of TiN ion-plated wires were significantly lower than those of non ion-plated wires(p<0.05). $\cdot$On the effect of wire shape, the frictional forces of round wires were significantly lower than those of rectangular wires(p<0.05) $\cdot$As the result of the SEM observation on the wires and bracket slots after the friction experiment the surface of non ion-plated wires was rougher than that of TiN ion-plated ones. $\cdot$The difference between the static frictional forces and the kinetic frictional forces was not significant in case of the TiN ion-plated round ins, but the static frictional forces were a little higher than the kinetic frictional forces in the TiN ion-plated rectangular wires. $\cdot$The static frictional forces were much higher than the kinetic frictional forces in the case of non ion-plated wires.

  • PDF

Development of Ni/Cr Plating Process for LRE Thrust Chamber (액체로켓엔진 연소기용 니켈/크롬 코팅의 공정 개발)

  • Cho, Hwang-Rae;Bang, Jeong-Suk;Rhee, Byung-Ho;Lee, Kwang-Jin;Lim, Byoung-Jik;Han, Yeoung-Min;Choi, Hwan-Seok
    • Proceedings of the Korean Society of Propulsion Engineers Conference
    • /
    • 2009.11a
    • /
    • pp.603-607
    • /
    • 2009
  • A Ni/Cr plating process has been developed for applying to inner wall of liquid rocket engine(LRE) thrust chamber. Ni plating conditions were selected through thermal shock test and endurance verification of the plating layers was performed through hot firing test of a subscale thrust chamber with Ni/Cr plating. Test results showed that a crack or separation of the plating layers was not found. Judging from the results, Ni/Cr plating could be applied to LRE thrust chamber as a substitute of air plasma sprayed ceramic coating which is presently being used.

  • PDF

A CASE STUDY ON THE EFFECT OF NITRIDING FOR CHROME-PLATING LOSS OF SMALL ARMS BARREL (소구경화기 총열의 크롬도금 손실방지를 위한 질화 영향 사례연구)

  • Shin, JW;Shin, TS;Choi, SY;Chung, SH;Kim, BK;Kwon, HR
    • Journal of Korean Society for Quality Management
    • /
    • v.45 no.3
    • /
    • pp.327-333
    • /
    • 2017
  • Purpose: The purpose of this study is to research to protect to loss of chrome-plating of small arms barrel on high temperature in order to extend its life expectency. Methods: The reason why chrome-plating dropped out is main material is weak from heat. Therfore, to make barrel of small arms have higher heat-resistant property, nitriding for barrel before chrome-plating is needed and test of that barrel was handled to improve it. Results: Nitriding before chrome-plating is useful to protect to chrome-plating loss on high temperature. Conclusion: To protect loss of chome-plating of small arms barrel during on firing, pre-nitriding on barrel is effective finally it leads to extend to barrel's life expectency.

A Study on the ENIG Surface Finish Process and Its Properties (ENIG 표면처리 공정 및 특성에 관한 연구)

  • Lee, Hong-Kee;Son, Seong-Ho;Lee, Ho-Young;Jeon, Jun-Mi
    • Journal of the Korean institute of surface engineering
    • /
    • v.40 no.1
    • /
    • pp.32-38
    • /
    • 2007
  • Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

Fabrication of Highly Conductive Yarn using Electroless Nickel Plating (무전해 니켈 도금법을 이용한 고성능 도전사의 제조)

  • Hong, So-Ya;Lee, Chang-Hwan;Kim, Joo-Yong
    • Textile Coloration and Finishing
    • /
    • v.22 no.1
    • /
    • pp.77-82
    • /
    • 2010
  • Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

Selective Contact Hole Filling by electroless Ni Plating (무전해 Ni 도금에 의한 선택적 CONTACT HOLE 충전)

  • 우찬희;권용환;김영기;박종완;이원해
    • Journal of the Korean institute of surface engineering
    • /
    • v.25 no.4
    • /
    • pp.189-206
    • /
    • 1992
  • The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,$ 70^{\circ}C$, and 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentra-tion, pH, and plating time were studied. The optimal plating condition found was 0.10M NiSO4.H2O, 0.11M Citrate, pH 6.8, $60^{\circ}C$, 30minutes. The contact resistance of films was comparatively low. It took 30minutes to obtain 1$\mu\textrm{m}$ thick film with 8mM DMAB concentration. The film surface roughness was improved with decreasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained at the condition of temperature $60^{\circ}C$ and pH 6.0. The micro-vickers hardness of film was about 800Hv. Plating rate of nickel on the hole pattern was slower than that of nickel on the line pattern.

  • PDF

Study On Effect of Fe Density on Electrolyte Exfoliation of Chromium Plating Layer (전해액의 Fe 농도에 의한 크롬도금 탈락 연구)

  • Park, Jin-Saeng
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.39 no.12
    • /
    • pp.1297-1303
    • /
    • 2015
  • The internal chromium plating of a long-axis tube is widely used in military and industrial application, with the thick hard plating formed using a mixed solution of Chromium acid and catalytic $H_2SO_4$. A large-caliber gun can endure a high explosive force as a result of the increased stiffness and wear resistance provided by this internal hard chromium surface. The internal chromium layer of a tube is prone to exfoliation caused by the high kinetic energy of the projectile and high pressure of the explosion. Therefore, we reviewed the plating process. Chromium plating comprises many steps, including the removal of Grease, water cleaning, electrolytic abrasion, etching, plating, water cleaning, and hydrogen brittleness removal. The exfoliated chromium plating layer is affected by the adhesion property of the plating. In particular, the Fe concentration of the electrolyte affects the adhesion property. The optimum Fe concentration for effectively suppressing the exfoliation of the plating layer was established by using a scanning electron microscope to determine the surface roughness, and the effectiveness was proved in an adhesion test, etc.