• 한국표면공학회지
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• 제22권1호
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• pp.43-51
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• 1989

The characteristion of composite electroless Nikel palting on the condition of adding 3kinds ceramic dispersives, Al2O3, Si3O4 and artificial diamond powder were studied. Decreasing solution temperature for composite plating was required to depress the spontaneous decomposition caused by dispersive including enlargement of reaction surface. The rate of composite plating was faster than that of general electroless-Nickel plating without dispersive. this increasing tendency of plating rate was remarkable for the active catalysis, like diamond powder.

• 한국전기전자재료학회논문지
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• 제11권8호
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• pp.658-663
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• 1998

Ferrite plating enables were grown by ferrite by plating method in solution at low temperature(<10$0^{\circ}C$). This faciltates the fabrication of new ferrite thin film devices using non- heat-resistant materials(plastic, GaAs ect) as substrates. Combining the ferrite plating with sonochemistry, application of power ultrasonic waves to stimulate chemical reactions, the crystallinity and qualities of films were improved. Modifying the reactions cell and plating conditions further improved the film quality.

• 한국표면공학회지
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• 제36권4호
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• pp.324-328
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• 2003

This study was made on the crevice corrosion behavior of chromium plating in fresh water. Under the various crevice, the electrochemical polarization test of chromium plating was carried out. Results are discussed In terms of corrosion potential, polarization resistance, corrosion current density and cathodic control of chromium plating.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2000년도 전력전자학술대회 논문집
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• pp.685-688
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• 2000

Pulse plating is about to deposit material at high current density compared to conventional DC plating. For example pulse plating can get more fine grain can improve adhension and metal distribution and current efficiency can reduce internal stress and crack. therefore we studied pulsed power supply which has high current density and improve deposition quality and increase plating speed in this paper.

• 대한치과교정학회지
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• 제28권1호
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• pp.123-133
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• 1998

TiN ion-plating된 Co-Cr 선재(.016", .016"x.022")와 ion-plating되지 않은 선재(.016", .016"x.022")를 이용하고, 3 가지 종류의 브라켓(TiN ion-plating된 금속 브라켓, 세라믹 브라켓 및 플라스틱 브라켓)을 대상으로 마찰실험을 행하고, 거기에서 얻어진 마찰 특성곡선과 곡선으로부터 구한 최대 정지마찰력, 그리고 선재와 브라켓의 표면양상을 주사전자현미경으로 관찰하여 TiN ion-plating의 효과를 검토한 결과 다음과 같은 결론을 얻었다. $\cdot$3가지 종류의 브라켓에 TiN ion-plating된 선재를 사용한 경우의 마찰력은 TiN ion-plating되지 않은 선재를 사용한 경우의 마찰력보다 각각 통계학적으로 유의성있게 낮았다(p<0.05). $\cdot$3가지 종류의 브라켓에 원형 선재를 사용한 경우의 마찰력은 각형 선재를 사용한 경우의 마찰력보다 각각 통계학적으로 유의성있게 낮았다(p<0.05). $\cdot$원형 선재를 사용한 경우 TiN ion-plating되지 않은 선재를 사용한 경우가 TiN ion-plating된 선재를 사용한 경우보다 선재 및 브라켓 슬롯의 표면이 더욱 거친 양상을 나타내었다. $\cdot$각형 선재를 사용한 경우 전반적으로 원형 선재를 사용한 경우보다 선재 및 브라켓 슬롯의 표면이 더욱 거친 양상을 나타내었다. $\cdot$TiN ion-plating된 원형 선재를 사용한 경우 정지마찰력과 운동마찰력의 차는 별로 없었으나 TiN ion-plating된 각형 선재를 사용한 경우 정지마찰력은 운동마찰력보다 다소 높았다. $\cdot$TiN ion-plating되지 않은 선재를 사용한 경우가 TiN ion-plating된 선재를 사용한 경우에 비해 정지마찰력이 운동마찰력보다 휠씬 높았다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2009년도 제33회 추계학술대회논문집
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• pp.603-607
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• 2009

액체로켓엔진 연소기의 내벽에 사용하기 위한 니켈/크롬 도금 공정 개발을 수행하였다. 열충격 시험을 통해 니켈 도금 조건을 선별하였고 니켈/크롬 도금이 수행된 축소형 연소기의 연소시험을 통해 도금 층의 내구성 검증을 수행하였다. 시험결과 도금 층의 균열 및 박리는 발견되지 않았고, 이 결과로부터 현재 사용중인 대기 플라즈마 용사된 세라믹 코팅의 대안으로 니켈/크롬 도금을 액체로켓엔진 연소기에 사용할 수 있으리라 사료된다.

• 품질경영학회지
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• 제45권3호
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• pp.327-333
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• 2017

Purpose: The purpose of this study is to research to protect to loss of chrome-plating of small arms barrel on high temperature in order to extend its life expectency. Methods: The reason why chrome-plating dropped out is main material is weak from heat. Therfore, to make barrel of small arms have higher heat-resistant property, nitriding for barrel before chrome-plating is needed and test of that barrel was handled to improve it. Results: Nitriding before chrome-plating is useful to protect to chrome-plating loss on high temperature. Conclusion: To protect loss of chome-plating of small arms barrel during on firing, pre-nitriding on barrel is effective finally it leads to extend to barrel's life expectency.

• 한국표면공학회지
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• 제40권1호
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• 한국염색가공학회지
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• 제22권1호
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• pp.77-82
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• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• 한국표면공학회지
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• 제25권4호
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• pp.189-206
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• 1992

The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,$ 70^{\circ}C$, and 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentra-tion, pH, and plating time were studied. The optimal plating condition found was 0.10M NiSO4.H2O, 0.11M Citrate, pH 6.8, $60^{\circ}C$, 30minutes. The contact resistance of films was comparatively low. It took 30minutes to obtain 1$\mu\textrm{m}$ thick film with 8mM DMAB concentration. The film surface roughness was improved with decreasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained at the condition of temperature $60^{\circ}C$ and pH 6.0. The micro-vickers hardness of film was about 800Hv. Plating rate of nickel on the hole pattern was slower than that of nickel on the line pattern.