• Korean Journal of Materials Research
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• v.12 no.6
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• pp.447-451
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• 2002

Pulsed DC-plasma nitriding has been applied to form nitride layer having only a diffusion layer. The discharge current with the variation of discharge gases is proportional to the intensity of $N_2^+$ peak in optical emission spectroscopy during the plasma nitriding. The discharge current, microhardness in surface of substrate and depth of nitride layer increased with the ratio of $N_2\;to\;H_2$ gas in discharge gases. When the ratio of $N_2\;to\;H_2$ is lower than 60% in the discharge gases, high microhardness value of 1100Hv nitride layer which contains no compound layer has been formed.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.57-65
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• 1997

A study was undertaken to determine the influence of welding variables such as shielding and plasma gases, torch standoff, travel speed and heat input, etc. on the quality of plasma arc welds in Zircaloy-4 sheet, 2mm thick. Effect of shielding gases and their flow rates on the mechanical properties of Zircaloy-4 welds by plasma arc welding were determined in terms of tensile, bardness and bend tests. The microstructure and fracture surface of Zircaloy-4 welds were investigated by optical and scanning electron microscopies. In addition, the causes of porosity and undercut in plasma arc welds of Zircaloy-4 were also investigated. Zircaloy-4 weld bead width and depth by helium shielding gas showed a wider and deeper than those by argon. It was found that Zircaloy-4 welds with shielding gas of helium did dxhibit a little smoother and uniform weld beads than those with shielding gas of argon. It was also found that the optimum gas flow rates for Zircaloy-4 welding were 0.45l/min for plasma gas with Ar and 4.5 - 6 l/min for shielding gas with He. In addition, there was no big difference in the microstructure and fracture surface of the weld metals made by either Ar shielding gas or He shielding gas.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.11-18
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• 2003

In this study we attempted to diagnose the states and properties of plasma generated while depositing SiON thin films using PECVD (Plasma enhanced chemical vapor deposition). The temperature and density of electron gases formed in a PECVD chamber were measured by Langmuir probe method. Their values were also estimated under some assumptions we made in this work. Comparison between experimental and theoretical values of the temperature and density of electron gases was made. The experimental and estimated results revealed that, as RF Power gets higher, the electron density linearly increases, but that the electron temperature does not vary.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.34-46
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• 2002

Si-O-C-H films with a low dielectric constant were deposited on a p-type Si(100) substrate using a mixture gases of the bis-trimethylsilyl-methane (BTMSM) and oxygen by an inductively coupled plasma chemical vapor deposition (ICPCYD). High density plasma of about $~10^{12}\textrm{cm}^{-3}$ is obtained at low pressure (<400 mTorr) with rf power of about 300W in ICPCVD where the BTMSM and $O_2$ gases are fully dissociated. Fourier transform infrared (FTIR) spectra and X-ray photoelectron spectroscopy (XPS) spectra show that the film has $Si-CH_3$ and OH-related bonds. The void within films is formed due to $Si-CH_3$ and OH-related bonds after annealing at $500^{\circ}C$ for the as-deposition samples. The lowest relative dielectric constant of annealed film at $500^{\circ}C$ is about 2.1.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.26-33
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• 2002

This study was undertaken to obtain the fundamental knowledges on the weld deflects and it's realtime monitoring method. The paper describes the results of high speed photography, acoustic emission (AE) detection and plasma light emission (LE) measurements during $CO_2$ laser welding of STS 304 stainless steel and A5083 aluminum alloy in different welding condition. The characteristic frequencies of plasma and keyhole fluctuations at different welding speed and shield gases were measured and compared with the results of Fourier analyses of temporal AE and LE spectra, and they had considerably good agreement with keyhole and plasma fluctuation. Namely, the low frequency peaks of AE and LE shifted to higher frequency range with the welding speed increase, and leer the argon shield gas it was higher than that in helium and nitrogen gases. The low frequencies dominating in fluctuation spectra of LE probably reflect keyhole opening instability. It is possible to monitor the weld bead deflects by analyzing the acoustic and/or plasma light emission signals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.472-476
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• 1998

The surface reactions of silica film($SiO_2-P_2O_5-B_2O_3-GeO_2$) with fluorocarbon plasma has been studied by using angle -resolved x-ray photoelectron spectroscopy(XPS). It has been confirmed that residual carbon consists of C-C and C-CFx bonds and fluorine mainly binds silicon in the case of etched silica by using $CF_4$ gas plasma. The surface reaction of silica with various fluorocarbon gases, such as $CF_4,C_2F_6 and CHF_3$ were investigated. XPS results showed that though the etching gases were changed, the elements and binding states of the residual layers on the etched silica by using various fluorocarbon gas plasma were nearly the same . This seems to be due to the high volatility of byproducts, that is, $SiF_4 and CO_2$ etc..

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.194-197
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• 1997

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.93.1-93
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• 2003

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.3
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• pp.135-140
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• 2020

Since the process gas that is essential in the semiconductor process is a harmful gas, it is an essential task to solve it in an environmentally friendly manner. Currently, the cleaning technology used in the semiconductor process is mostly a wet cleaning based on hydrogen peroxide developed in the 1970s, and the SC-1 cleaning liquid for removing particles on the surface uses a mixture of ammonia and hydrogen peroxide. Therefore, environmental problems are caused, and economic problems caused by excessive water use are also serious. For this reason, the products developed through this study are used to decompose the process harmful gas from the chamber outlet into a harmless gas before entering the vacuum pump, or by incineration and the gaseous components are deposited on the pump. I want to solve the problem. In this paper, CPS (Confined Plasma Source) is proposed to save environment and improve productivity by replacing harmful gases (N2, CF4, SF6⋯., Etc) which are indispensable in semi-contamination process with innocuous gases or incineration with plasma, to study.

• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.127-134
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• 2002

Recently, Plasma display panel(PDP) has been in the spotlight as one of the next generation flat-panel-display device. The luminance and luminous efficiency improvement is the hot issues for making a plasma display into a large flat panel device. In this paper, We suggest a new penning gas mixture, in order to find the optimum mixture gas in plasma display panel. The optimum gas composition has been found by the partial pressure of inert gases(such as Af and Kr added to matrix of He(70%)-Ne(27%)Xe(3%) and Ne(96%)-Xe(4%)). The influences of Ar or Kr addition to Ne(96%)-Xe(4%) and He(70%)-Ne(27%)-Xe(3%) mixture gases are experimentally investigated for AC Plasma Display Panel. When rare As(0.01%-0.03%) or Kr(0.01%-0.03%) is added Ne-Xe and He-Ne-Xe mixture gases, the luminance increases over 10%-20% and luminous efficiency increases over 10%-20% at 200 Torr. It is sure that luminance and efficiency are improved by Penning effect. Also, This influence of Penning effect is shown by increased wall charge(10%-25%). In addition to the result, firing voltage and minimum sustain voltage was approximately decreased by 2V-3V.