• Title/Summary/Keyword: Plasma Gases

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FUV IMAGING SPECTROSCOPIC OBSERVATIONS OF INTERSTELLAR MEDIUM WITH FIMS

  • SEON KWANG-IL;HAN WONYONG;LEE DAE-HEE;NAM UK-WON;PARK JANG-HYUN;YUK IN-SOO;JIN HO;MIN KYUNG WOOK;RYU KWANG-SUN;EDELSTEIN JERRY;KORPELA ERIC
    • Journal of The Korean Astronomical Society
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    • v.38 no.2
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    • pp.69-72
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    • 2005
  • The FIMS (Far-ultraviolet IMaging Spectrograph; also known as SPEAR, Spectroscopy of Plasma Evolution from Astrophysical Radiation) is the primary payload of the STSAT-1, the first Korean science satellite, which was launched in September, 2003. The FIMS performs spectral imaging of diffuse far-ultraviolet emission with the unprecedented wide field of view and the relatively good spectral resolution. We present far-ultraviolet spectral observations of highly ionized interstellar medium including supernova remnants, superbubbles, soft X-ray shadows, and the molecular hydrogen fluorescent emission lines. The FIMS has detected He II, C III, 0 III, O IV, Si IV, O VI, and $H_2$ fluorescent emission lines. The emission lines arise in shocked or thermally heated and in photo-ionized gases. We present an overview of the FIMS instrument and its initial observational results.

Thin and Hermetic Packaging Process for Flat Panel Display Application

  • Kim, Young-Cho;Jeong, Jin-Wook;Lee, Duck-Jung;Choi, Won-Do;Lee, Sang-Geun;Ju, Byeong-Kwon
    • Journal of Information Display
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    • v.3 no.1
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    • pp.11-16
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    • 2002
  • This paper presents a study on the tubeless Plasma Display Panel (PDP) packaging using glass-to-glass electrostatic bonding with intermediate amorphous silicon. The bonded sample sealing the mixed gas with three species showed high strength ranging from 2.5 MPa to 4 MPa. The glass-to-glass bonding for packaging was performed at a low temperature of $180^{\circ}C$ by applying bias of 250 $V_{dc}$ in ambient of mixed gases of He-Ne(27 %)-Xe(3 %). The tubeless packaging was accomplished by bonding the support glass plate of $30mm{\times}50mm$ on the rear glass panel and the capping glass of $20mm{\times}20mm$. The 4-inch color AC-PDP with thickness of 8 mm was successfully fabricated and fully emitted as white color at a firing voltage of 190V.

Influence of PECVD SiNx Layer on Multicrystalline Silicon Solar Cell (PECVD SiNx 박막의 다결정 실리콘 태양전지에 미치는 영향)

  • Kim, Jeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.7
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    • pp.662-666
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    • 2005
  • Silicon nitride $(SiN_x)$ film is a promising material for anti-reflection coating and passivation of multicrystalline silicon (me-Si) solar cells. In this work, a plasma-enhanced chemical vapor deposition (PECVD) system with batch-type reactor tube was used to prepare highly robust $SiN_x$ films for screen-printed mc-Si solar cells. The Gas flow ratio, $R=[SiH_4]/[NH_3]$, in a mixture of silane and ammonia was varied in the range of 0.0910.235 while maintaining the total flow rate of the process gases to 4,200 sccm. The refractive index of the $SiN_x$ film deposited with a gas flow ratio of 0.091 was measured to be 2.03 and increased to 2.37 as the gas flow ratio increased to 0.235. The highest efficiency of the cell was $14.99\%$ when the flow rate of $SiH_4$ was 350 sccm (R=0.091). Generally, we observed that the efficiency of the mc-Si solar cell decreased with increasing R. From the analysis of the reflectance and the quantum efficiency of the cell, the decrease in the efficiency was shown to originate mainly from an increase in the surface reflectance for a high flow rate of $SiH_4$ during the deposition of $SiN_x$ films.

Study on the Silicon Nano-needle Structure for Nano floating Gate Memory Application (나노 부유 게이트 메모리 소자 응용을 위한 실리콘 나노-바늘 구조에 관한 연구)

  • Jung, Sung-Wook;Yoo, Jin-Su;Kim, Young-Kuk;Kim, Kyung-Hae;Yi, Jun-Sin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.12
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    • pp.1069-1074
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    • 2005
  • In this work, nano-needle structures ate formed to solve problem, related to low density of quantum dots for nano floating gate memory. Such structures ate fabricated and electrical properties' of MIS devices fabricated on the nano-structures are studied. Nano floating gate memory based on quantum dot technologies Is a promising candidate for future non-volatile memory devices. Nano-structure is fabricated by reactive ion etching using $SF_6$ and $O_2$ gases in parallel RF plasma reactor. Surface morphology was investigated after etching using scanning electron microscopy Uniform and packed deep nano-needle structure is established under optimized condition. Photoluminescence and capacitance-voltage characteristics were measured in $Al/SiO_2/Si$ with nano-needle structure of silicon. we have demonstrated that the nano-needle structure can be applicable to non-volatile memory device with increased charge storage capacity over planar structures.

유기막 위에 증착된 저온 ITO(Indium Tin Oxide) 박막의 식각특성

  • 김정식;김형종;박준용;배정운;이내응;염근영
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.99-99
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    • 1999
  • 투명전도막인 Ito(Indium Tin Oxide)는 flat panel display 와 solar cell 같은 optoelectronic 이나 microelectronic device에서 널리 이용되어 지고 있다. 현재 상용화되고 있는 거의 대부분의 ITO 박막은 sputtering법에 의해 제조되고 있으나 공정상의 이유로 15$0^{\circ}C$이상의 기판온도가 요구되어진다. 그런, 실제 display device 제조공정에서는 비정질 실리콘 박막이나 유기막 위에 ITO박막을 제작할 필요성이 증대되어 지고 있고, 또한 다른 전자소자에 있어서도 상온 ITO 박막 형성 공정에 대한 필요성이 증대되고 있다. 이러한 이유로 본 실험에서는 IBAE(Ion Beam Assisted Evsporation)을 이용하여 저온 ITO박막을 유기막 위에 증착하는 공정에 대한 연구를 수행하였다. 이렇게 증착된 ITO 박막의 결정성은 비정질이었다. 또한, 모든 display device 제작에는 식각공정이 필수인데 기존에 사용되고 있는 wet etching 법은 등방성 식각특성 때문에 미세 pattern 형성에 부적합?, 따라서 비등방성 식각에 용이한 plasma etching법을 사용하여 저온 증착된 ITO 박막의 식각특성을 알아보았다. 실험에 사용된 식각장비는 자장 강화된 유도결합형 플라즈마 식각장비(MEICP)를 사용하였으며, 13.56MHz의 RF power를 사용하였다. 식각조건으로 source power는 600W~1000W, 기판 bias boltage는 -100V~-250V를 가하였으며, Ar, CH4, O2, H2, BCl3의 식각 gases, 5mTorr~30mTorr의 working pressure 변화 그리고 기판 온도에 따른 식각특성을 관찰하였다. ITO 가 증착된 기판으로는 유기물 중 투명전도성 박막에 기판으로서 사용가능성이 클 것으로 기대되어지는 PET(polyethylene-terephtalate), PC(polycarbonate), 아크릴을 사용하여 기판 변화가 식각특성에 미치는 영향에 대해서 각각 관찰하였다. 식각속도의 측정은 stylus profiler를 이용하여 측정하였으며 식각후에 표면상태는 scanning electron spectroscopy(SEM)을 이용하여 관찰하였다.

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SiON/SiO2 Multilayer Deposited by PECVD for Low-Loss Waveguides (저손실 광도파로 제작을 위해 PECVD 법에 의해 증착된 SiON/SiO2 다층박막)

  • 김용탁;김동신;윤대호
    • Journal of the Korean Ceramic Society
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    • v.41 no.3
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    • pp.197-201
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    • 2004
  • SiO$_2$ and SiON thick films were deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) technique on silicon wafer (100) using SiH$_4$ and $N_2$O as precursor gases. In this work, the influence of rf power, and rf bias power on the optical and physical properties of SiO$_2$ and SiON thick films is presented. The refractive index decreases with increasing rf power, and rf bias power. The refractive index of the films varied from 1.4493 to 1.4952 at wavelength at 1552 nm, with increasing rf power, the nitrogen content decreases while the oxygen content increases, in a manner that the O/N ratio increases approximately linearly.

A Study on the Etching Characateristics of TiW Films using BCl$_3$/SF6/ gas chemistries (BCl$_3$/SF6 gas chemistries에 의한 TiW막의 식각특성 연구)

  • 권광호;김창일;윤선진;김상기;백규하;남기수
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.3
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    • pp.1-8
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    • 1997
  • The surface properties after plasma etching of TiW alloy using the chemistries of BCl$_{3}$ and SF$_{6}$ gases with varying mixing ratio have been investigated using XPS(X-ray photoelectron spectrocopy). The elements existed on the etched sampled have been extracted with BCL$_{3}$/SF$_{6}$ ratio and their chemical binding states have also been analysed. It was confirmed that the thickness of native oxide formed on the TiW films is thinner than 10nm by using Ar sputtering. At the same time, the roughness of etched surface has been esamnied using AFM (atomic force microscopy). on the basis of the basis of this results, the relations between the caanges of oxygen contents detected by XPS and the rouhness of etched surface have been discussed. And the etch rate and etched profile of Tiw films have been examined and the changes of the etch rate and etched prfile have been discussed with XPS results. From XPS results, the role of passivation layer consisted of Ti-S compound with XPS results. From XPS results, the role of passivation layer consisted of Ti-S compound has been proposed. Ti-S compound seems to make a role of passivation layer that surpresses Ti-O formation.ion.

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A Study on the Surface Properties of Al Alloys after Reactive Ion Etching (Al 합금의 반응성 이온 식각후 표면 특성 연구)

  • Kim, Chang-Il;Kwon, Kwang-Ho;Park, Hyung-Ho
    • Proceedings of the KIEE Conference
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    • 1995.11a
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    • pp.338-341
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    • 1995
  • The surface properties after plasma etching of Al(Si, Cu) solutions using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched Al(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxized (partially chlorinated) states, copper shows Cu metallic states and Cu-Clx(x$CuCl_x$ (x$CuCl_x$ (1

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Optical Emission Characteristics of Atmospheric Pressure Dielectric Barrier Discharge (대기압 유전체배리어방전의 발광특성)

  • Kim, Jin Gi;Kim, Yoon Kee
    • Korean Journal of Materials Research
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    • v.25 no.2
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    • pp.100-106
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    • 2015
  • Plasma properties of dielectric barrier discharges (DBDs) at atmospheric pressure were measured and characterized using optical emission spectroscopy. Optical emissions were measured from argon, nitrogen, or air discharges generated at 5-9 kV using 20 kHz power supply. Emissions from nitrogen molecules were markedly measured, irrespective of discharge gases. The intensity of emission peaks was increased with applied voltage and electrode gap. The short wavelength peaks (315.9 nm and 337.1 nm) measured at the middle of DBDs were significantly increased with applied voltage. The optical emission from DBDs decreased with the addition of oxygen gas, which was especially significant in argon discharge. Emission from oxygen molecules cannot be measured from air discharge and argon discharge with 4.8% oxygen. The emission intensity at 337.1 nm and 357.7 nm related with nitrogen molecule was sensitively changed with electrode types and discharge voltages. However, the pattern of argon emission spectrum was nearly the same, irrespective of electrode type, oxygen content, and discharge voltage.

Electron Emission Property of Carbon Nanotubes Grown Using Different Source Gases

  • Han, Jae-Hee;Lee, Tae-Young;Yoo, Ji-Beom;Park, Chong-Yun;Jung, Tae-Won;Yu, Se-Gi;Yi, Whi-Kun;Kim, Jong-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.658-661
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    • 2002
  • Chemical species during growth of carbon nanotubes (CNTs) in direct current-plasma enhanced chemical vapor deposition were studied in details using $C_3H_4-NH_3$ and $CO-NH_3$ mixtures through optical emission spectroscopy (OES). In the $C_3H_4-NH_3$ system, the relative intensities of CN (388.3 nm) and CH (431.4 nm) decreased and that of $C_2$ (436 nm) increased, leading to $sp^2$-graphization into the CNT structure, leading to improvement of field emission property of CNTs. In the $CO-NH_3$ system, the trend is completely reversed. Attributing to the atomic oxygen for helping the graphitization of carbon, CNTs could be grown under the flow rate of CO (180 sccm)-$NH_3$ (10 sccm). Through these results, we suggest the growth mechanism in our system.

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