• Title/Summary/Keyword: Plane of array

Search Result 385, Processing Time 0.031 seconds

The analysis and design of X-ray cross sectional imaging system for PCB solder joint inspection (PCB 납땜 검사를 위한 X선 단층 영상 시스템의 해석 및 설계)

  • 노영준;강성택;김형철;김성권
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 1996.10b
    • /
    • pp.109-112
    • /
    • 1996
  • The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

  • PDF

Improvement Residual Non-uniformity in Thermal Imaging System Using Correlated Double Sample Signal Processing (상관이중표본화 신호처리를 이용한 적외선 열상시스템의 잔여불균일성 개선)

  • Suk, Jung-Youp;Jang, Sung-Kun;Kim, Sung-Un;Yeou, Bo-Yeoun
    • Proceedings of the IEEK Conference
    • /
    • 2008.06a
    • /
    • pp.1043-1044
    • /
    • 2008
  • In this study, a novel algorithm of the improvement residual non-uniformity (RNU) in thermal imaging system is proposed using correlated double sample signal processing. The proposed method attempts to eliminate offset variation of ROIC in IR detector causing the variation of FPA (focal plane array) temperature and suppling power. Experimental results show that the proposed method confirmed a better performance than the existing RNU system.

  • PDF

3-dimensional Electric Field Analysis for Field Emission Devices (전계방출소자의 3차원 전계해석)

  • Kim, Yeong-Hoon;Jung, Jae-Hoon;Lee, Byoung-Ho
    • Proceedings of the KIEE Conference
    • /
    • 1997.11a
    • /
    • pp.662-664
    • /
    • 1997
  • 3-dimensional finite element method(FEM) electrical field analysis was performed to obtain electric fields on a field emission device tip in an array form. The simulation was performed by applying the Neumann boundary condition to the intermediate plane between tips. To verify our algorithm, comparison between simulation results and experimental data from another paper was made and the difference was discussed. Finally, analysis on triode structure was performed.

  • PDF

Fabrication of 64x1 linear array infrared detector using Hg1-xCdxTe (Hg1-xCdxTe를 이용한 64x1 선형 적외선 감지 소자 제작)

  • Kim, Jin-Sang;Suh, Sang-Hee
    • Journal of Sensor Science and Technology
    • /
    • v.18 no.2
    • /
    • pp.135-138
    • /
    • 2009
  • $64{\times}1$ forcal plane infrared detector has been fabricated by using HgCdTe epi layer. HgCdTe was grown on GaAs substrate by using metal organic chemical vapor deposition. This paper describes key developments in the epi layer growth and device fabrication process. The performance of IR imaging system is summarized.

The Analysis on the relation between the Compression Method and the Performance of MSC(Multi-Spectral Camera) Image data

  • Yong, Sang-Soon;Choi, Myung-Jin;Ra, Sung-Woong
    • Proceedings of the KSRS Conference
    • /
    • 2007.10a
    • /
    • pp.530-532
    • /
    • 2007
  • Multi-Spectral Camera(MSC) is a main payload on the KOMPSAT-2 satellite to perform the earth remote sensing. The MSC instrument has one(1) channel for panchromatic imaging and four(4) channel for multi-spectral imaging covering the spectral range from 450nm to 900nm using TDI CCD Focal Plane Array (FPA). The compression method on KOMPSAT-2 MSC was selected and used to match EOS input rate and PDTS output data rate on MSC image data chain. At once the MSC performance was carefully handled to minimize any degradation so that it was analyzed and restored in KGS(KOMPSAT Ground Station) during LEOP and Cal./Val.(Calibration and Validation) phase. In this paper, on-orbit image data chain in MSC and image data processing on KGS including general MSC description is briefly described. The influences on image performance between on-board compression algorithms and between performance restoration methods in ground station are analyzed and discussed.

  • PDF

Space-bandwidth product in digital holography (디지털 홀로그래피의 공간 대역폭)

  • Han, Jun-Gu
    • Broadcasting and Media Magazine
    • /
    • v.16 no.2
    • /
    • pp.63-72
    • /
    • 2011
  • 디지털 홀로그래피는 가간섭성 광원을 이용하여 광파의 위상 정보를 기록 또는 재생하는 기술이다. 이러한 홀로그래피 방식의 광파 재생은 광파를 산란시키는 3차원 대상물을 정확하게 표현할 수 있어서 이상적인 디스플레이 방법으로 여겨진다. 디지털 홀로그래피에서 광파의 샘플링 영역과 그 대역폭의 곱은 공간 대역폭으로 정의되며, 이러한 공간 대역폭은 디지털 홀로그래픽 시스템의 능력을 나타내는 가장 기본적인 수치이다. 공간 대역폭은 샘플링 개수로 이해될 수 있으며 이는 focal plane array (FPA)나 spatial light modulator (SLM)의 픽셀 개수와 일치한다. 디지털 홀로그래피 기술로 기존의 디스플레이가 가지는 크기와 시야각 수준의 광파를 표현하고자 한다면 매우 큰 공간 대역폭이 요구된다. 따라서 디지털 홀로그래픽 디스플레이 시스템의 공간 대역폭을 늘리기 위한 방법은 꾸준히 연구되어 오고 있으며 최근 주목할 만한 시스템들이 제안되었다. 공간 대역폭에 대한 이해를 바탕으로 SLM을 이용한 홀로그래픽 디스플레이에서 가시 부피와 해상도에 대해 논하고, 최근 주목 받고 있는 홀로그래픽 디스플레이의 공간 대역폭을 정리하였다.

Wet Treatment를 이용한 Nonpolar InGaN/GaN Micro-Column LED Array 개발

  • Gong, Deuk-Jo;Bae, Si-Yeong;Kim, Gi-Yeong;Lee, Dong-Seon
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.395-395
    • /
    • 2013
  • GaN는 LED, 태양전지, 그리고 전자소자 등에 쓰이는 물질로, 관련 연구가 활발히 진행되고 있으며, 이와 더불어 top-down방식을 활용한 소자제작 방법 또한 발달되고 있다. 하지만, 일반적으로 LED 제작에 사용되는 c-plane GaN의 경우, c축 방향으로 발생하는 분극의 영향을 받게되며, 분극은 LED내 양자우물의 밴드를 기울게 하여 전자와 홀의 재결합률을 감소시켜 낮은 내부양자효율을 야기한다. 이러한 문제를 해결하기 위해 여러 가지 방법들이 제시되었으며, 그 중에서도 a면, 혹은 m면과 같은 nonpolar면을 사용하는 GaN LED가 주목받고 있다. 본 연구에서는, top-down방식을 통해 약 $2{\mu}m$ 크기의 diameter를 갖는 micro-sized column LED를 구현하였으며, 식각 후 드러나는 semipolar면을 wet treatment를 통해 제거하여 nonpolar면을 드러나게 하였으며, 이 면에 Ni/Au를 contact하여, 전기적, 광학적 특성을 논하였다. Fig. 1은 I-V 특성 그래프이며, Fig. 2는 EL측정 결과(광학적 특성)이다.

  • PDF

A $2{\times}2$ Microstrip Patch Antenna Array for Moisture Content Measurement of Paddy Rice (산물벼 함수율 측정을 위한 $2{\times}2$ 마이크로스트립 패치 안테나 개발)

  • 김기복;김종헌;노상하
    • Journal of Biosystems Engineering
    • /
    • v.25 no.2
    • /
    • pp.97-106
    • /
    • 2000
  • To develop the grain moisture meter using microwave free space transmission technique, a 10.5GHz microwave signal with the power of 11mW generated by an oscillar with a dielectric resonator is transmitted to an isolator and radiated from a transmitting $2{\times}2$ microstrip patch array antenna into the sample holder filled with the 12 to 26%w.b. of Korean Hwawung paddy rice. the microwave signal, attenuated through the grain with moisture, is collected by a receiving $2{\times}2$ microstrip patch array antenna and detected using a Shottky diode with excellent high frequency characteristic. A pair of light and simple microstrip patch array antenna for measurement of grain moisture content is designed and implemented on atenflon substrate with trleative dielectric constant of 2.6 and thickness of 0.54 by using Ensemble ver. 4.02 software. The aperture of microstrip patch arrays is 41 mm width and 24mm high. The characteristics of microstrip patch antenna such as grain. return loss, and bandwidth are 11.35dBi, -38dB and 0.35GHz($50^{\circ}$ at far-field pattern of E and H plane. The width of the sample holder is large enough to cover the signal between the antennas temperature and bulk density respectively. The calibration model for measurement of grain moisture content is proposed to reduce the effects of fluectuations in bulk density and temperature which give serious errors for the measurements . From the results of regression analysis using the statistically analysis method, the moisture content of grain samples (MC(%)) is expressed in terms of the output voltage(v), temperature (t), and bulk density of samples(${\rho}b$)as follows ;$$MC(%)\;=\;(-3.9838{\times}10^{-8}{\times}v^{3}+8.023{\times}10^{-6}{\times}v^{2}-0.0011{\times}v-0.0004{\times}t+0.1706){\frac{1}{{\rho}b}}{\times}100$ Its determination coefficient, standard error of prediction(SEP) and bias were found to be 0.9855, 0.479%w.b. and -0.0.369 %w.b. respectively between measured and predicted moisture contents of the grain samples.

  • PDF

Development of Microlens Array for Maskless Lithography Application (Maskless lithography 응용을 위한 마이크로렌즈 어레이 개발)

  • Nam, Min-Woo;Oh, Hae-Kwan;Kim, Geun-Young;Seo, Hyun-Woo;Wei, Chang-Hyun;Song, Yo-Tak;Yang, Sang-Sik;Lee, Kee-Keun
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.16 no.4
    • /
    • pp.33-39
    • /
    • 2009
  • A microlens array (MLA) was developed based on the wet-etched quartz substrate and coating of UV adhesive on the substrate for maskless lithography application. The developed MLA has the focal length of ${\sim}45\;{\mu}m$ and the spot size of ${\sim}1\;{\mu}m$. The spot size of the focused beam passing through the MLA was detected by CCD camera, and its intensity was monitored by beam profiler. Uniform spots with nearly identical intensities were observed on the focal plane when a beam passes through the fabricated MLA. The focal length was varied depending on thickness of the coated UV adhesive. The thicker the thickness of the UV adhesive was, the shorter the focal length of the MLA was. With a general mask aligner, UV beam focusing was tested onto photoresist (PR). The beams were well focused onto PR when UV passes through the MLA. Depending on the variable distances from the MLA, beam sizes onto PR were controlled. Even at high temperature for a long time, the performances of the MLA were not changed.

  • PDF

Evaluation of Stiffness Profile for a Subgrade Cross-Section by the CAP(Common-Array-Profiling)-SASW Technique (CAP SASW 기법에 의한 지반단면의 전단강성구조 평가)

  • Joh Sung-Ho;Jang Dae-Woo;Kang Tae-Ho;Lee Il-Wha
    • Journal of the Korean Geotechnical Society
    • /
    • v.21 no.4
    • /
    • pp.71-81
    • /
    • 2005
  • Surface wave techniques were initially based on 2-D plane waves and were later improved to the techniques based the 3-D based cylindrical waves. However, body-wave interference, near-field effect and limited technology in surface wave measurements restricted the use of 3-D cylindrical waves to the 1-D evaluation of subgrade stiffness. In this study, by the numerical simulation of SASW measurements, the dispersion properties of surface waves including vertical, horizontal Rayleigh waves and Love waves were thoroughly investigated in the 3-D domain, and a new filter criteria to minimize the near-field effect was established, which led to CAP (common-array-profiling)-SASW technique. The CAP-SASW technique enabled the evaluation of subgrade stiffness fur a specific subgrade segment, not for a whole section of measurement array. Therefore, a contour plot of subgrade stiffness with a ground-truth quality can be obtained by the CAP-SASW technique. The procedure proposed in this study was verified by comparing the shear-wave velocity profiles with the shear-wave velocity profiles of downhole testing at two geotechnical sites.