• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.342-348
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• 2021

For the characterization or failure analysis of electronic devices such as PCB (printed circuit boards), the most common method is the measurement of voltage waveforms with an oscilloscope. However, because there are many types of problems that cannot be detected by voltage waveform analysis, several other methods such as X-ray transmission, infrared imaging, or eddy current measurement have been applied for these analyses. However, these methods have also been limited to general analyses because they are partially useful in detecting physical defects, such as disconnections or short circuits. Fundamentally current waveform measurements during the operation of electronic devices need to be performed, however, commercially available current sensors have not yet been developed, particularly for applications in highly integrated PCB products with sub-millimeter fine pitch. In this study, we developed a highly sensitive PHR (planar hall resistance) magnetic sensor for application in highly integrated PCBs. The developed magnetic sensor exhibited sufficient features of an ultra-small size of less than 340 ㎛, magnetic field resolution of 10 nT, and current resolution of 1 mA, which can be applicable for PCB analyses. In this work, we introduce the development process of the magnetic sensing probe and its characteristic results in detail, and aim to extend this pin-type current probe to applications such as current distribution imaging of PCBs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.1
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• pp.21-24
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• 2020

We investigated a solution-driven Yttrium Tin Oxide (YSnO) film that was imprinted using a parallel nanostructure as a liquid crystal (LC) alignment layer. The imprinting process was conducted at the annealing temperature of 100℃. To evaluate the effect of this process, we conducted surface analyses including atomic force microscopy (AFM). During imprinting, the surface roughness was reduced, and anisotropic characteristics were observed. Planar LC alignment was observed at a pretilt angle of 0.22° on YSnO film. Surface anisotropy induced by imprinting method forces LC to align along the direction of the parallel nanostructure, which is an alternative to conventional polyimide treated using a rubbing process.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.16-21
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• 2005

Photonic crystals, periodic structure with a high refractive index contrast modulation, have recently become very interesting platform for the manipulation of light. The existence of a photonic bandgap, a frequency range in which the propagation of light is prevented in all directions, makes photonic crystal very useful in application where the spatial localization of light is required, for example waveguide, beam splitter, and cavity. However, the fabrication of 3 dimensional photonic crystals is still difficult process. A concept that has recently attracted a lot of attention is a planar photonic crystal based on a dielectric membrane, suspended in the air and perforated with two dimensional lattice of hole. The fabrication of Si master with pillar structure using hot embossing process is investigated for two dimensional, low-index-contrast photonic crystal waveguide. From our research we show that the multiple stamp copy process proved to be feasible and useful.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1065-1068
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• 2003

The nano imprint process is one of the next generation lithography has been mentioned as one of major nanoreplication techniques because it is simple process, low cost, high replication fidelity and relatively high throughput. This process requires a surface contact between a template with patterns and a wafer on a stage. After contact, the vertical moving the template to the wafer causes some directional motions of the stage. Thus the stage must move according to the motions of the template to avoid the damage of the transferred patterns on the wafer. This study is to develop the wafer stage with a passive compliance to overcome the damage. This stage is designed with the concept like that it has a monolithic, symmetry and planar 6-DOF mechanism.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.48-54
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• 2012

This paper introduces the kinematic calibration method to improve the positioning accuracy of a parallel mechanism. Since all the actuators in the parallel mechanism are controlled simultaneously toward the target position, the volumetric errors originated from each motion element are too complicated. Therefore, the exact evaluation of the error sources of each motion element and its calibration is very important in terms of volumetric errors. In the calibration processes, the measurement of the errors between commands and trajectories is necessary in advance. To do this, a digitizer was used for the data acquisition in 3 dimensional space rather than arbitrary planar error data. After that, the optimization process that was used for reducing the motion errors were followed. Consequently, Levenberg-Marquart algorithm as well as the error data acquisition method turned out effective for the purpose of the calibration of the parallel mechanism.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.3
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• pp.177-181
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• 2016

Hot shearing is a method of producing various high-quality planar machine parts by using reduced punch load. In order to predict the results of this process, the deformation behavior of work material at elevated temperatures need to be studied. In this research, a tensile test was carried out for 5052 aluminum alloy at high temperatures of $240-540^{\circ}C$ and strain rates of 0.001-0.1/s. The results of the tensile tests were studied to predict the deformation of the alloy during the hot shearing process. The results showed that hot shearing within a temperature range of $340-440^{\circ}C$ and a strain rate rage of 0.001-01/s will be the most effective in reducing punch load and increasing the sheared edge in the case of 5052 aluminum alloy.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.496-500
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• 2003

In This paper, a pole-zero optimized design method for multi-layed planar interdigital stripeline linear group delay bandpass filter with tap input port is presented. As a design example, a four-pole group delay filter with center frequency of 2.14GHz, bandwidth of 160MHz, and group delay variation of ${\pm}0.1nS$ for LTCC technology or multilayerd PCB technology is designed. In the design process, as well the whole structure is not necessary to be simulated, and within three times of optimizing process we have good result as well. This design method could be useful for controlling error correction of manufacturing process as well as design stage.

• Journal of Welding and Joining
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• v.19 no.2
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• pp.208-214
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• 2001

In this study, we constructed a visual sensor system for weld seam tracking in real time in GMA welding. A sensor part consists of a CCD camera, a band-pass filter, a diode laser system with a cylindrical lens, and a vision board for inter frame process. We used a commercialized robot system which includes a GMA welding machine. To extract the weld seam we used a inter frame process in vision board from that we could remove the noise due to the spatters and fume in the image. Since the image was very reasonable by using the inter frame p개cess, we could use the simplest way to extract the weld seam from the image, such as first differential and central difference method. Also we used a moving average method to the successive position data or weld seam for reducing the data fluctuation. In experiment the developed robot system with visual sensor could be able to track a most popular weld seam. such as a fillet-joint, a V-groove, and a lap-joint of which weld seam include planar and height directional variation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.277-280
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• 2008

Recently, a demand of nano/micro patterned polymer for display or biochip has been rising. Then many studies have been carried out. Nano/micro-embossing is a deformation process where the workpiece materials is heated to permit easier material flow and then forced over a planar patterned tool. In this work, the hot-emboss process is performed with different forming conditions; forming temperature, load, press hold time, to get the proper condition for linear pattern fabrication on plated-type polymers (PC). Replicated pattern depth increases in proportion to the forming temperature, load and time. Reduction of the workpiece thickness increases according to press hold time. In process of time, reduction ratio of workpiece thickness decreases because of surface area increment of the workpiece and pressure decline on it.

• Proceedings of the KIEE Conference
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• 2000.11d
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• pp.857-859
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• 2000

A planar MEA(Multi-channel Electrode Array) has been developed for monitoring the electrical activity of electrogenic cells in a cell culture by an extracellular recording. The material, fabrication process, characterization of the array, cleaning effect and impedance according to opening size by impedance measurement are described.