• Elastomers and Composites
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• v.36 no.2
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• pp.121-129
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• 2001

The friction characteristics of natural rubber plates under various conditions including sliding speed, normal force, hardness, lubrication conditions and thickness of plate are analyzed experimentally. The frictional force and normal force are measured by a tester pin and a load ceil with strain gages. Experimental results suggest that the coefficient of friction decreases with increasing the hardness of rubber and decreasing the thickness of plate. The effect of sliding speed is not significant over the speed range employed. The coefficient of friction is found to be about 0.1 under oil lubrication condition and varies from 0.9 to 3.9 under no lubrication condition.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.13 no.2
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• pp.50-56
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• 2014

This paper describes the design, fabrication, and measurement of a 4-port femtocell MIMO antenna for LTE 700MHz(Band12, 13, 14, 17, 28, 44) applications. Based on microstrip patch antenna, an impedance matching is achieved by short pin. In order to obtain sufficient bandwidth and isolation between antenna elements in a limited dimension, a cross decoupler is used. With a Voltage Standing Wave Ratio (VSWR)${\leq}2$, the measured result of the fabricated antenna provides 105MHz(0.698~0.803MHZ) bandwidth and shows the gain with 1.97dBi and isolation above 13dB. As one of the key parameters for MIMO performance evaluation, correlation coefficient of MIMO is achieved within 0.2.

• Journal of Korean Association for Spatial Structures
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• v.3 no.1 s.7
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• pp.87-97
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• 2003

The structural system that discreterized from continuous shells is frequently used to make a large space structures. As well these structures show the unstable phenomena when a load level over the limit load, and snap-through and bifurcation are most well known of it. For the collapse mechanism, rise-span ratio, element stiffness and load mode are main factor, which it give an effect to unstable behavior. In our real situation, most structures have semi-rigid joint that has middle characteristic between pin and rigid joint. So the knowledge of semi-rigid joint is very important problem of stable large space structure. And the instability phenemena of framed space structures show a strong non-linearity and very sensitive behavior according to the joint rigidity For this reason In this study, we are investigating to unstable problem of framed structure with semi-rigidity and to grasp the nonlinear instability behavior that make the fundamental collapse mechanism of the large space frame structures with semi-rigid joint, by proposed the numerical analysis method. Using the incremental stiffness matrix in chapter 2, we study instability of space structures.

• The Research Journal of the Costume Culture
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• v.14 no.6
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• pp.956-970
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• 2006

The purposes of this study was to analyze the characteristics of national races' costumes in Chinese contemporary costumes. For the purpose, this researcher concentrated on the relations between national races' costumes and Chinese contemporary costumes and discuss systematically depending on references such as fashion magazines, picture albums, and historical records. The results of study were as follows: First, the formation of fashion has been influenced by Man, Uighur, and Choson races. For example, Qipao, the tight style of Man race's fashion, Uighur race's bell style sleeve and cyclic skirt are applied to women's modern fashion. Second, weaving, printing, and embroidery technique of a minority race developed more than Han race, so applied still. Recently, Chinese contemporary costumes accepted the weaving technique of Miao and Uighur race through publicizing of a minority culture. Third, a national race's costumes are famous with splendid design and applied to modern fashion directly. They are commonly made to hair pin, necklace, earing, bracelet and so on. Recently, styles from a national race's costumes and old style are becoming popular to Chinese and it's easier to found such a fashion in market.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.12
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• pp.2647-2654
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• 2009

In this paper, we propose H.264 Encoder integrating Intra Prediction, Deblocking Filter, Context-Based Adaptive Variable Length Coding, and Motion Estimation encoder module. This designed module can be operated in 440 cycle for one-macroblock. To verify the Encoder architecture, we developed the reference C from JM 9.4 and verified the our developed hardware using test vector generated by reference C. The designed circuit can be operated in 166MHz clock system, and has 1800K gate counts using Charterd 0.18 um process including SRAM memory. Manufactured chip has the size of $6{\times}6mm$ and 208 pins package.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.163-166
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• 2016

Hydrophobicity is the key concept to understand the water plays in protein folding, protein aggregation, and protein-protein interaction. Traditionally, the hydrophobicity of protein is defined based on the scales of the hydrophobicity of residue, assuming that the hydrophobicity of free amino acids is maintained. Here, we explore how the hydrophobicity of constituting amino acids in protein rely on the protein context, in particular, on the total charge and secondary structures of a protein. To this end, we calculate and investigate the hydration free energy of three short proteins based on the integral-equation theory of liquids. We find that the hydration free energy of charged amino acids is significantly affected by the protein total charge and exhibits contrasting behavior depending on the protein total charge being positive or negative. We also observe that amino acids in the ${\beta}-sheets$ display more enhanced the hydrophobicity than amino acids in the loop, whereas those in the ${\alpha}-helix$ do not clearly show such a tendency. And the salt-bridge forming amino acids also exhibit increase of the hydrophobicity than that with no salt bridge. Our results provide novel insights into the hydrophobicity of amino acids, and will be valuable for rationalizing and predicting the strength of water-mediated interaction involved in the biological activity of proteins.

• Journal of Surface Science and Engineering
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• v.49 no.3
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• pp.238-244
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• 2016

Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on ${\alpha}$- or ${\beta}$- phases and how to achieve uniform deposition over the entire surface on ${\alpha}$- and ${\beta}$-phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly ${\alpha}$- and ${\beta}$-phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on ${\beta}$-phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the ${\beta}$-phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size ${\beta}$-phase particles which is ascribed to gas bubbles formed at the ${\beta}$-phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the ${\alpha}$- and ${\beta}$-phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.673-676
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• 2003

In this paper, we designed the embedded system used for wireless LAN communication. Embedded system kernel is made from general linux kernel 2.4.18 by applying the ARM patch (2.4.18-rmk7) and the SA1100 patch(2.4.18-rmk7), then porting board level suitable to target system. The SA-1110 PCMCIA interface provides controls for one PCMCIA card slot with a PSKTSEL pin for support of a second slot. The embedded system requires external logic to complete the PCMCIA socket interface. For dual-voltage support, level shifting buffers are required for all SA-1110 input signals. Hot insertion capability requires that each socket be electrically isolated from each other, and from the remainder of the memory system. embedded system is for socket services approaching PCMCIA socket, detecting number of sockets, sensing insertion and removal, and applying power. It also provides interface with Card services. Embedded system supports Host driver for lucent chips that is installed orinoco driver cross compiled. The meaning can say that is doing wireless LAN communication through wireless LAN in imbedded system.