• Journal of Korean Society of Steel Construction
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• v.16 no.6 s.73
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• pp.737-745
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• 2004

In general, most of the beam-to-column connections for steel structures are regarded as either rigid connections or pin connections. Recently, the concept of a semi-rigid connection was introduced for a correct analysis of steel structures. Several experimental and theoretical researches have been performed regarding the structural behaviors of frames and buildings with semi-rigid connections. The results are not well known, and structural frame/building has not been designed to introduce the concept of semi-rigid connections between a beam and column until this time. To resolve this, this research depends on design specifications prepared by other advanced countries for the design of buildings with semi-rigid connections. Such a specification, however, should incorporate domestic characteristics of steel material properties and load conditions. This paper deals with structural capacities and deformable behaviors for a split-T tensile connection with F10T high-strength bolts to investigate the structural characteristics of semi-rigid frames. The experimental parameters include the thickness of T-flanges, painted or not, preloaded or not, and load pushover pattern. A total of 20 specimens were fabricated and tested with a 300-ton UTM. The structural capacities and behavior for split-T tensile connections were evaluated on each research parameter.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2009.06a
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• pp.467-470
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• 2009

A novel 8 V DC power source with an external series-parallel connection of 50 Dye-Sensitized Solar Cells(DSSCs) has been proposed. One DSC has the optimized length to width ratio of $5.2{\times}2.6$ cm and an active area 8 $cm^2$($4.62{\times}1.73$ cm) which attained a conversion efficiency of 4.2%. From the electrochemical impedance spectroscopic analysis, it was found that the resistance elements related to the Pt electrode and electrolyte interface behave like that of diode and the series resistance corresponds to the sum of the other resistance elements. In addition, the TEMoo mode pulsed Nd:YAG laser beam is used to improve the incident photon to current efficiency(IPCE) of DSSC. From this result, this novel 8V-0.38A DC power source shows stable performance with an energy conversion efficiency of about 4.5% under 1 sun illumination(AM 1.5, Pin of 100 $mW/cm^2$).

• Steel and Composite Structures
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• v.44 no.3
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• pp.437-450
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• 2022

When the vertical load-bearing members in high-rise structures fail locally, the beam-column joints play an important role in the redistribution of the internal forces. In this paper, a static laboratory test of three full-scale flush flange beam-reinforced connections with side and cover plates (CP-FBSP connection) with double half-span steel beams and single L-shaped columns composed of concrete-filled steel tubes (L-CFST columns) was conducted. The influence of the side plate width and cover plate thickness on the progressive collapse resistance of the substructure was thoroughly analyzed. The failure mode, vertical force-displacement curves, strain variation, reaction force of the pin support and development of internal force in the section with the assumed plastic hinge were discussed. Then, through the verified finite element model, the corresponding analyses of the thickness and length of the side plates, the connecting length between the steel beam flange and cover plate, and the vertical-force eccentricity were carried out. The results show that the failure of all the specimens occurred through the cracking of the beam flange or the cover plate, and the beam chord rotations measured by the test were all greater than 0.085 rad. Increasing the length, thickness and width of the side plates slightly reduced the progressive collapse resistance of the substructures. The vertical-force eccentricity along the beam length reduced the progressive collapse resistance of the substructure. An increase in the connecting length between the beam flange and cover plate can significantly improve the progressive collapse resistance of substructures.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.100-106
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• 2009

A novel 8 V DC power source with an external series-parallel connection of 50 Dye-sensitized Solar Cells (DSCs) has been proposed. One DSC has the optimized length to width ratio of $5.2{\times}2.6\;cm$ and an active area $8\;cm^2$ ($4.62{\times}1.73\;cm$) which attained a conversion efficiency of 4.02%. From the electrochemical impedance spectroscopic analysis, it was found that the resistance elements related to the Pt electrode and electrolyte interface behave like that of diode and the series resistance corresponds to the sum of the other resistance elements. Surface morphology and sheet resistance of Pt counter electrode did not degrade the performance of the cell. This novel 8V-0.33A DC power source shows stable performance with an energy conversion efficiency of 4.24% under 1 sun illumination (AM 1.5, Pin of $100\;mW/cm^2$).

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.12
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• pp.967-974
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• 2013

Recently the authors had proposed the z-pinning patch concept to simply manufacture z-pinned composite structures at industrial production site and manufactured composite single-lap shear joint specimens using the concept. Through static tensile test on the specimens they had obtained 54~68% improvement of the joint strength. As a sequential study of it, in this study, fatigue test has performed to measure an improvement of joint strength under cyclic loading. The z-pin's material is stainless steel and its surface was specially machined into zagged shapes and chemically corroded to increase the connection force with composite materials. Approximately 98~125% improvement of the joint strength under cyclic loading was obtained.

• Journal of The Korean Digital Architecture Interior Association
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• v.12 no.4
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• pp.67-75
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• 2012

The damage of greenhouse has been increasing due to frequent collapse of frame in greenhouse caused by the heavy snow and strong wind. But, greenhouses are constructed by steel tube members of pipe style and pin connection of them, so these greenhouses are very weak. Therefore, this study was carried out to find the type of member section and structural frame system in stress tolerant greenhouses. The modeling types for analysis were designed in accordance with structural frame configuration and member section in greenhouse. These types of models, which are existing type, diagrid type, symmetric and asymmetric section type of frame member in greenhouse were classified. Displacement analysis varying the vertical and horizontal loads for a series of models was carried out. As a result of this paper, it was verified that the structural frame configuration of diagrid type and asymmetric type of member section is better than existing type in the frame of greenhouses against snow loads and wind loads.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.567-574
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• 2016

We have analyzed chemical properties of polysiloxane and polysilazane films, respectively, as sealing materials for electrostatic chuck (ESC) and have investigated the possibility of polysilazane as an alternative sealant to polysiloxane. It has been revealed that Si-O with organic bonding ($Si-CH_3$) existed in polysiloxane films compared to only pure Si-O bonding in polysilazane films. The sealing property of polysilazane has been found outstanding even in a short time of application. In the polysiloxane films containing $H_2O$, pin holes have been found possibly due to $CO_2$ gas evolution, and low adhesion with Si substrate has been observed after heat stress test in connection with the existence of organic bonding. After acid resistance test in 0.5 vol.% HF, 68 wt.% $HNO_3$, and 37 wt.% HCl solution, polyilazane films have shown a longer survival times. Compared to the conventional polysiloxane sealant, polysilazane is expected as a new sealing material because of good thermal and chemical stability.

• Journal of Communications and Networks
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• v.9 no.2
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• pp.198-209
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• 2007

This paper provides a thorough study on shared segment protection (SSP) for mesh communication networks in the complete routing information scenario, where the integer linear program (ILP) in [1] is extended such that the following two constraints are well addressed: (a) The restoration time constraint for each connection request, and (b) the switching/merging capacity constraint at each node. A novel approach, called SSP algorithm, is developed to reduce the extremely high computation complexity in solving the ILP formulation. Basically, our approach is to derive a good approximation on the parameters in the ILP by referring to the result of solving the corresponding shared path protection (SPP) problem. Thus, the design space can be significantly reduced by eliminating some edges in the graphs. We will show in the simulation that with our approach, the optimality can be achieved in most of the cases. To verify the proposed formulation and investigate the performance impairment in terms of average cost and success rate by the additional two constraints, extensive simulation work has been conducted on three network topologies, in which SPP and shared link protection (SLP) are implemented for comparison. We will demonstrate that the proposed SSP algorithm can effectively and efficiently solve the survivable routing problem with constraints on restoration time and switching/merging capability of each node. The comparison among the three protection types further verifies that SSP can yield significant advantages over SPP and SLP without taking much computation time.

• Journal of the Korea Management Engineers Society
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• v.23 no.4
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• pp.33-48
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• 2018

Despite that QR codes are spreading worldwide in Pin Tech, logistics distribution, etc., South Korea is staying at the level of using QR codes in limited areas such as website connection and marketing communication. The purpose of this study is to propose measures for more effective use of QR codes by examining the effects of personal innovativeness on user's behavioral intentions by applying personal innovativeness to QR codes. To this end, this study was intended to examine the relationships between performance expectancy (PE), effort expectancy (EE), social expectancy (SE), and personal innovativeness, which are variables used in the Unified Theory of Acceptance and Use of Technology (UTAUT) model among innovative technology acceptance models, and behavioral intentions. For this study, a questionnaire survey was conducted with students in collages in the metropolitan area in May 2018 and the results were statistically verified using IBM SPSS 21. The results showed that PE, EE, and SE had significant positive(+) effects on personal innovativeness and behavioral intentions of QR code users. The mediating effects of personal innovativeness were tested and the results indicated that personal innovativeness partially mediates between PE and behavioral intentions and between EE and behavioral intentions but not between SE and behavioral intentions. The fact that since QR codes are expressed as a component to users through other media rather than its internal factors, the personal innovativeness of QR code users plays an important role in increasing the use of QR codes could be identified through this study.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.261-278
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• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm