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http://dx.doi.org/10.5695/JKISE.2016.49.6.567

Improvement of Sealing Property of Electrostatic Chuck by Applying Polysilazane Sealant  

Choi, Jaeyoung (Department of Energy Engineering, Dankook University)
Park, Hyunsu (Department of Energy Engineering, Dankook University)
Son, Min Kyu (R&D Center, YMC Co., Ltd)
Jeong, Chang-oh (R&D Center, YMC Co., Ltd)
Kim, Woo-Byoung (Department of Energy Engineering, Dankook University)
Publication Information
Journal of the Korean institute of surface engineering / v.49, no.6, 2016 , pp. 567-574 More about this Journal
Abstract
We have analyzed chemical properties of polysiloxane and polysilazane films, respectively, as sealing materials for electrostatic chuck (ESC) and have investigated the possibility of polysilazane as an alternative sealant to polysiloxane. It has been revealed that Si-O with organic bonding ($Si-CH_3$) existed in polysiloxane films compared to only pure Si-O bonding in polysilazane films. The sealing property of polysilazane has been found outstanding even in a short time of application. In the polysiloxane films containing $H_2O$, pin holes have been found possibly due to $CO_2$ gas evolution, and low adhesion with Si substrate has been observed after heat stress test in connection with the existence of organic bonding. After acid resistance test in 0.5 vol.% HF, 68 wt.% $HNO_3$, and 37 wt.% HCl solution, polyilazane films have shown a longer survival times. Compared to the conventional polysiloxane sealant, polysilazane is expected as a new sealing material because of good thermal and chemical stability.
Keywords
Electrostatic chuck; Polysiloxane; Polysilazane; Sealing material;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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