• Geomechanics and Engineering
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• v.12 no.6
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• pp.1021-1046
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• 2017

The assessment of slope stability is an essential task in geotechnical engineering. In this paper, a three-dimensional (3D) finite element analysis (FEA) was employed to investigate the performance of different shear pin arrangements to increase the stability of a soil block resting on an inclined plane with a low-interface friction plane. In the numerical models, the soil block was modeled by volume elements with linear elastic perfectly plastic material in a drained condition, while the shear pins were modeled by volume elements with linear elastic material. Interface elements were used along the bedding plane (bedding interface element) and around the shear pins (shear pin interface element) to simulate the soil-structure interaction. Bedding interface elements were used to capture the shear sliding of the soil on the low-interface friction plane while shear pin interface elements were used to model the shear bonding of the soil around the pins. A failure analysis was performed by means of the gravity loading method. The results of the 3D FEA with the numerical models were compared to those with the physical models for all cases. The effects of the number of shear pins, the shear pin locations, the different shear pin arrangements, the thickness and the width of the soil block and the associated failure mechanisms were discussed.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.4
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• pp.38-48
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• 1992

OEIC(Optoelectronic Integrated Circuit)'s can be integrated horizontally or vertically. Horizontal integration approach is, however, more immune to parasitic and more universally applicable. In this paper, a structural modeling, fabrication and characterization of PIN photodiodes which can be used in the horizontal integration are performed. For device modeling, we build a transmission line model from 2-D device simulation, from which lumped model parameters are extracted. The speed limits of the PIN photodiodes can also be calculated under various structural conditions from the model. Thus optimum design of horizontally integrated PIN photodiodes for high speed operation are possible. Such InGaAs/InP PIN photodiodes for long-wavelength communications are fabricated using pit etch, epi growth, planarization, diffusion and metallization processes. Planarization process using both RIE and wet etching and diffusion process using evaporated Zn$_{3}P_{2}$ film are developed. Characterization of the fabricated devices is performed through C-V and I-V measurements. At a reserve bias of 10V, the dark current is less than 5nA and capacitance is about 0.4pF. The calculated bandwidth using the measured series resistance and capacitance is about 4.23GHz.

• Proceedings of the KIEE Conference
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• 2002.04a
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• pp.96-98
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• 2002

This paper proposes the digital pin line checker which can extremely improve the efficiency of the pine line checking using a micro processor. The line checker is designed which can check efficiently up to maximum 2048 pin. Alarm busser is designed ringing real-timely the case that the pin line is connected differently with real node number. Accordingly the comparing and identifying work visually the node number showing on the displaying board with real node number is avoided after the electronic stimulus enforce to the pin of the fixture by the test engineer. The digital line checker is designed based on the 8051. And the effectiveness and accuracy of the proposed line checking strategy is tested by simulating the several error connections for pin lines on the small scale board.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.44-51
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• 2017

In the present study, AA 5083-O plates are joined by friction stir welding technique. A universal milling machine was used to perform the welding process of the work-pieces which were fixed on the proper position by a vice. The joints were friction stir welded by two tools with different pin profiles; cylindrical threaded pin and tapered smooth one at different rotational speed values; 400 rpm and 630 rpm, and different welding speed values; 100 mm/min and 160 mm/min. During FSW of each joint, the temperature was measured by infra-red thermal image camera. The welded joints were inspected by visually as well as by the macro- and microstructure evolutions. Furthermore, the joints were tested for measuring the hardness and the tensile strength to study the effect of changing the FSW parameters on the mechanical properties. The results show that increasing the rotational speed results in increasing the peak temperature, while increasing the welding speed results in decreasing the peak temperature for the same tool pin profile. Defect free welds were obtained at lower rotational speed by the threaded tool profile. Moreover, the threaded tool pin profile gives superior mechanical properties at lower rotational speed.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.7-12
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• 2004

Large-sized pins are usually used to lift and handle large low speed diesel engine crankshaft. There has then been a need to reduce and optimize the weight of the traditionally used pins. Making an hole by cutting the inside of the pin out was investigated in view of static and fracture strength. To compensate the stress increase caused by the introduction of the inner hole, the groove in the circumferential direction pre-existing on the pin is to be removed. Finite element analysis was carried out for both the original model and weight reduced model. Stress intensity factors for semi-elliptical defects assumed on the pin for the original model and weight reduced model was calculated using the ASME method and compared with the fracture toughness test result of the pin material. The diameter of the cutting hole for the revised model was determined based on the analysis results.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2522-2525
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• 2001

Si PIN diodes are subject to be damaged from the exposure of fast neutron by displacement of Si lattice structure. The defects are effective recombination centers for carriers which migrate through the base region of the PIN diode when forward voltage is applied. It causes an increase in current and a decrease in resistivity of the diode. This paper presents the development of a neutron sensor based on displacement damage effect. PIN diodes having various structures were made bymicro-fabrication process, and neutron beam test was performed to identify neutron damage effect to the diode. From a result of the test, it was shown that the forward voltage drop of the diode, at a constant current, has good linearity for neutron dosage. Also it was found that the newton dosage can be measured by the pin diode neutron dosimeter with constant current power.

• Pediatric Gastroenterology, Hepatology & Nutrition
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• v.22 no.5
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• pp.441-446
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• 2019

Purpose: Safety pin ingestion is common in some regions of the world and may lead to severe morbidity and mortality. The aim of this study was to present some practical suggestions for ingested safety pins using an accompanying algorithm, presented for the first time in the literature to the best of our knowledge. Methods: Twenty children with ingested safety pins during a 4-year period were retrospectively included in the study. Results: Median age of patients was 9.5 months (interquartile range, 6.3-14 months), and 70% were girls. On endoscopic examination, safety pins were observed in the stomach (25%), duodenal bulb (20%), upper esophagus (15%), middle esophagus (10%), and second part of the duodenum (10%) but were not observed in 20% of the cases. Safety pins were removed using endoscopy in 15 cases (75%). In four cases (20%), no safety pin was observed on endoscopic examination. In one case (5%) involving a 6-month-old infant, the safety pin could not be removed although it was observed using endoscopy. No surgical intervention was needed for any patient. No complications such as perforation or deaths developed, except for erosions, due to the foreign body removal procedure. Conclusion: Safety pins are easily removed endoscopically. The best option is to remove the safety pin using endoscopy while it is still in the esophagus and stomach. For this reason, endoscopic procedures should be performed as soon as possible in children who have ingested safety pins.

• International Journal of Internet, Broadcasting and Communication
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• v.14 no.4
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• pp.198-205
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• 2022

Along with a variety of coding education, physical computing education for controlling various sensors is being actively conducted for elementary, middle, and high school students in line with the era of the fourth industrial revolution. A problem with physical computing education using Arduino is pin connection errors between Arduino and various sensors. Most of the students who come into contact with the Arduino for the first time often do not know the purpose of the Arduino pin and the connection position of the pin. Also, hardware built with incorrect pin connections to the Arduino board often does not work properly. If this case continues, students will lose interest in coding education. Therefore, in this paper, we implemented an augmented reality application that informs the connection process of the Arduino board and the sensor during physical computing coding education using Arduino, and designed and implemented educational content for the Arduino pin position and connection process. First, we explain the role of the Arduino board and the sensor and the location of the pins. After that, the students run the educational augmented reality educational content using their smartphones and check the correct pin connection process between the Arduino and the sensor. In the physical computing education, augmented reality content is used to increase the understanding and immersion of the class. It is expected that the educational effect will also increase by inducing fun and interest in physical computing coding education.

• Tribology and Lubricants
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• v.38 no.6
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• pp.227-234
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• 2022

Recently, the demand for improving energy efficiency has rapidly increased because of the growing concerns over environmental issues. In this work, the tribo-test and simulation for the initial wear and lubrication performance were performed for the piston pin in the small end system of the connecting rod of a marine engine, to obtain useful data for improving the efficiency of marine engine systems. In addition, a diamond-like carbon (DLC) coating was applied to the piston pin to explore feasibility of eliminating the bush used in the system. The initial wear and lubrication characteristics between the uncoated piston pin and bush were compared with that between the DLC-coated piston pin and connecting rod in the tribo-test. The simulation for the wear and lubrication performance according to the wear progression was conducted based on the data obtained from the test. The wear characteristics were quantitatively assessed by the wear depth and wear volume, and the lubrication performance was characterized with the change of pressure and minimum oil film thickness with respect to the crank angle. It was found that the DLC-coated piston pin may provide better initial wear characteristics and lubrication performance. The results of this work may provide fundamental information for marine engines with improved efficiency.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.3
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• pp.245-251
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• 2015

In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.