• 제목/요약/키워드: Pick-up head

검색결과 31건 처리시간 0.024초

심해저 망간단괴 집광기의 채집장치에 관한 연구 (A Study on Pick-up Device of Beep Sea Manganese Nodules Collector)

  • 홍섭;심재용;이태희;최종수
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.891-895
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    • 1996
  • Performance and efficiency of hybrid (hydraulic-mechanical) pick-up device of deep sea manganese nodules collector are very sensitive to altitude and altitude of pick-up head relative to undulating seafloor. For this reason, motion control of pick-up head relative to the changing deep sea topography and other disturbances is of particular importance in design of pick-up device. The concept of design axiom is applied to a pick-up device of hybrid type. Kinematic analysis conducted in absolute Cartesian coordinates gives position, velocity, and acceleration of the hydraulic cylinders which enable the pick-up head to keep the preset optimal distance from seafloor. Inverse dynamic analysis provides the driving forces of hydraulic cylinders and the reaction forces at each joint. Design sensitivity analysis is performed in order to investigate the effects of possible design variables on the change of the maximum strokes of hydraulic cylinders. The direct differentiation method is used to obtain the design sensitivity coefficients.

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비접촉식 웨이퍼 그리퍼용 공압 파지식 헤드 설계 (Design of the Air Pressure Pick-up Head for Non-Contact Wafer Gripper)

  • 김준현
    • 한국생산제조학회지
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    • 제21권3호
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    • pp.401-407
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    • 2012
  • The recent manufacturing process in the thin wafers and flat panel necessitate new approaches to reduce handling fragile and surface-sensitive damage of components. This paper presents a new pneumatic levitation for non-contact handling of parts and substrates. This levitation can achieve non-contact handling by blowing air into an air pressure pick-up head with radial passages to generate a negative pressure region. Negative pressure is caused by the radial air flow by nozzle throat and through holes connecting to the bottom region. The numerical analysis deals with the levitational motion with different design factors. The dynamic motion is examined in terms of force balance(dynamic equilibrium) occurring to the flow field between two objects. The stable equilibrium position and the safe separation distance are determined by analyzing the local pressure distribution in the fluid motion. They make considerable design factors consisting the air pressure pick-up head. As a result, in case that the safe separation distance is beyond 0.7mm, the proposed pick-up head can levitate stably at the equilibrium position. Furthermore, it can provide little effect of torque, and obtain more wide picking region according to the head size.

비접촉식 그리퍼 적용을 위한 공기압 파지식 헤드 내부 관통로 고찰 (Study on Through Paths Inside the Air Pressure Pick-Up Head for Non-Contact Gripper)

  • 김준현
    • 한국생산제조학회지
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    • 제21권4호
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    • pp.563-569
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    • 2012
  • In the semiconductor and display device production processes, the handling of sensitive objects needs new carrying technology. Floating carrying motion is a practical alternative solution for non-contact handling of parts and substrates. This paper presents a study of through paths inside the air pressure pick-up head to generate the floating motion. The air motion by conceptual designed paths inside the head gradually develops positive pressure and vacuum between narrow objects. Positive pressure occurs through the head tip before discharging outside of the head. Negative pressure is developed by evacuating the inside head bottom as result of the radial flow connecting the vertical through-holes. The numerical analysis was done to figure out the stable levitation caused by the two acting forces between surfaces. In comparing with the standard case that the levitation gap gets 0.7-0.9 mm, it confirms the suggested head characteristics to show floating capacity in accordance with the head size, number of through-hole, and locations of through-hole in succession of conceptual design for a prototype.

LED칩 제조용 다이 본더의 전산 설계 및 해석에 대한 연구 (A Study on the Computational Design and Analysis of a Die Bonder for LED Chip Fabrication)

  • 조용규;이정원;하석재;조명우;최원호
    • 한국산학기술학회논문지
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    • 제13권8호
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    • pp.3301-3306
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    • 2012
  • LED 칩 패키징에서 다이 본딩은 분할된 칩을 리드 프레임에 고정시켜 칩이 이후 공정을 견딜 수 있도록 충분한 강도를 제공하는 중요한 공정이다. 기존의 다이 본더의 픽업 장치는 단순히 콜렛의 하강 동작과 이젝터 핀의 상승 동작만으로 구동되어 픽업 장치와 다이가 접촉하는 순간 충격에 의한 다이의 손상과 위치 정렬 오차에 대한 문제점이 발생한다. 본 연구에서는 위치 정렬 에러 및 다이의 손상을 최소화시키기 위하여 고정밀, 고속 이송이 가능한 픽업 헤드를 사용한 다이 본더 시스템을 개발하였다. 구조적 안정성을 평가하기 위해 다이 본더의 유한요소모델을 생성하였고 구조 해석을 수행하였다. 그다음, 다이 본더의 작동 주파수에 대해 픽업 헤드의 유한요소모델을 이용하여 진동해석을 수행하였다. 해석 결과, 다이 본더에 작용하는 응력 및 변위, 고유진동수에 대해 분석하였고 개발된 시스템의 구조적 안정성에 대해 확인하였다.

광기록 정보저장용 Diffractive Optical Head 제작 연구 (Fabrication technology of the Diffractive Optical Head for optical recoding information storage)

  • 한기평;김태엽;손영준;김약연;백문철
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.992-993
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    • 2002
  • We have fabricated the diffractive optical head(DOH) for optical pick up, which one adaptable to a optical recoding information storage. DOH consists of a focusing grating coupler(FGC) and a solid immersion Jens(SIL). FGC is device that the light converge into a focus by surface lattice. FGC have been studied as a potential application of pick up head for the information storage. In this study, FGC was designed and fabricated to make focus near to possible diffraction limit. We also fabricated recording head combined with SIL. The focus was measured in the range of $1.1{\mu}m$ as near to possible diffraction limit in the FGC having a focusing length of $600{\mu}m$ and a lattice area of 500 * $500{\mu}m$.

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광기록장치의 pick-up 헤드용 미러의 설계 및 제작 (Design and fabrication of mirror for optical pick-up head)

  • 천중현;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3292-3294
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    • 1999
  • In this paper, electrostatic scanner mirror for optical pick-up head is designed and fabricated. The mirror size is $20{\mu}m{\times}2400{\mu}m{\times}2400{\mu}m$ and torsional beam size is $10{\mu}m{\times}20{\mu}m{\times}500{\mu}m$. Static deflection angle is calculated ${\pm}0.4$ degrees when the maximum driving voltage is 20 V. Silicon mirror was fabricated using KOH etching and deep RIE. For passivation of the patterned mirror from KOH solution, parylene thin film was used and its usefulness has been verified. Driving electrode was fabricated using UV LIGA process. Mirror and electrode were bonded.

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대평판 이송을 위한 비접촉 헤드 설계 (Design of Non-Contact Pick-Up Head for Carrying Large Flat Sheets)

  • 김준현;김영글;안성욱;김용성
    • 한국생산제조학회지
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    • 제22권6호
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    • pp.937-944
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    • 2013
  • This paper describes an improved model that can be used for configuring a non-contact pneumatic head to handle a large sheet of glass. The cylindrical head model is of a large size (70 mm). It operates on vortex flow, which can simultaneously generate suction and repulsion over the flat object's surface. The head allows for the minimal non-contact lifting of objects weighing over 3N by using reference conditions (working pressure and head dimensions). Additionally, a functional flow-guide is applied for inducing a developing tangential vortex flow to increase suction and repulsion to the reference head. The cylindrical flow-guide is associated with relatively low tangential velocity. The improved model generates greater lifting force than the reference model, as verified experimentally.

콤바인 전처리부의 소음 분석과 감소 방안 (Analysis and Reduction Method of Noise from Head of a Combine Harvester)

  • 김호중;박영준;심성보;김경욱
    • Journal of Biosystems Engineering
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    • 제32권3호
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    • pp.153-159
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    • 2007
  • This study was conducted to measure and analyze the noise from a combine head. The combine head, comprised of a cutting knife assembly, pick-up chains, horizontally conveying chains and vertically conveying chains, had an overall sound level of 101 dBA. The sound levels of each component were, respectively, 98.3 dBA for the cutting knife assembly, 88.9 dBA for the pick-up chains, 79.8 dBA for the horizontally conveying chains and 86.3 dBA for the vertically conveying chains, being equivalent to 54.4%, 18.4%, 6.5% and 13.7% of the overall head noise. The main cause of the head noise was considered the impacts that the joint of the cutting knife assembly made with frame when it oscillated. The impact sound was also generated when the chain lug collided with the chain case. To reduce these impact sound, anti-vibration rubbers were installed on the knife assembly joint and the chain cases. It reduced the head noise by 4 dBA but the overall noise level of the combine head was still high. In order to protect the combine operators more effectively from the noise, a safety cab needs to be installed on the combine.

초음파 고도계를 이용한 지형지물 측정에 있어서의 잡음에 의한 오차 보정 방법 (A Correction Method of the Error in the Survey of Topography Using an Ultrasound Altitude Sonar)

  • 김시문;최종수;이종무;홍섭
    • 한국해양공학회:학술대회논문집
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    • 한국해양공학회 2001년도 추계학술대회 논문집
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    • pp.26-31
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    • 2001
  • In order to measure the distance from the bottom in the ocean we use ultrasound altitude sonars. The manganese nodule pick-up device developed by KRISO is also using an altitude sonar to control the gap between the pick-up head and sea bottom. This paper describes the performance of the altitude sonar by an experimental method. The experiment was performed with four ground models in a small basin, Manganese nodule models and water-bentonite mixture was used for setting up the ground models. Buttorworth filter was applied to remove the noise caused by a servo motor and its controller. The results show that the altitude sonar gives a good estimation of the types and slopes of the bottom as well as the distance.

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