• Title/Summary/Keyword: Physical Vapor Deposition

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A Study on the Electrical Characteristic of Organic Thin Film by Physical Vapor Deposition Method (진공증착법을 이용한 유기 박막의 전기적 특성에 관한 연구)

  • Park, Su-Hong
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.57 no.2
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    • pp.140-145
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    • 2008
  • The purpose of this paper is to discuss the fabrication of $\beta$-PVDF($\beta$-Polyvinylidene fluoride, ${\beta}-PVF_2$) organic thin films using the vapor deposition method. Vapor deposition was performed under the following conditions: the temperature of evaporator, the applied electric field, and the pressure of reaction chamber were $270^{\circ}C$, 142.4 kV/cm, and $2.0{\times}10^{-5}\;Torr$, respectively. The molecular structure of the evaporated organic thin films were evaluated by a FT-IR. The results showed that the characteristic absorption peaks of $\beta$-form crystal increase from 72% to 95.5% with an increase in the substrate temperature. In the analysis of the electric characteristics, the abnormal increases in the relative dielectric constant and the dielectric loss factor in the regions of low frequency and high temperature are known to be caused by inclusion of impurity carriers in the PVDF organic thin films. In order to analyze quantitatively the abnormalities in the conductivity mechanism caused by ionic impurities, the product of the ion density and the mobility that affect the electrical property in polymeric insulators is analyzed. In the case of a specimen produced by varying the substrate temperature from $30^{\circ}C$ to $105^{\circ}C$, the product of mobility and the ion density decreased from $4.626{\times}10^8$ to $8.47{\times}10^7/V{\cdot}cm{\cdot}s$. This result suggests that the higher the substrate temperature is maintained, the better excluded the impurities are, and the more electrically stable material can be obtained.

Growth of vertically aligned carbon nanotubes on a large area Si substrates by thermal chemical vapor deposition

  • Lee, Cheol-Jin;Park, Jung-Hoon;Son, Kwon-Hee;Kim, Dae-Woon;Lyu, Seung-Chul;Park, Sung-Hoon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.212-212
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    • 2000
  • Since the first obserbvation of carbon nanotubes, extensive researches have been done for the synthesis using arc discharge, laser vaporization, and plasma-enhanced chemical vapor deposition. Carbon nanotubes have unique physical and chemical properties and can allow nanoscale devices. Vertically aligned carbon nanotubes with high quality on a large area is particularly important to enable both fundamental studies and applications, such as flat panel displays and vacuum microelectronics. we have grown vertically aligned carbon nanotubes on a large area of Si substrates by thermal chemical vapor deposition using C2H2 gas at 750-950$^{\circ}C$. we deposited catalytic metal on Si susbstrate using thermal evaporation. The nanotubes reveal highly purified surface. The carbon nanotubes have multi-wall structure with a hollow inside and it reveals bamboo structure agreed with base growth model. Figure 1 shows SEM micrograph showing vertically aligned carbon nanotubes whih were grown at 950$^{\circ}C$ on a large area (20mm${\times}$30mm) of Si substrates. Figure 2 shows TEM analysis was performed on the carbon nanotubes grown at 950$^{\circ}C$ for 10 min. The carbon nanotubes are multi-wall structure with bamboo shape and the lack of fringes inside the nanotube indicates that the core of the structure is hollow. In our experiment, carbon nanotubes grown by the thermal CVD indicate base growth model.

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Effect of Vapor Deposition on the Interdiffusion Behavior between the Metallic Fuel and Clad Material (금속연료-피복재 상호확산 거동에 미치는 기상증착법의 영향)

  • Kim, Jun Hwan;Lee, Byoung Oon;Lee, Chan Bock;Jee, Seung Hyun;Yoon, Young Soo
    • Korean Journal of Metals and Materials
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    • v.49 no.7
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    • pp.549-556
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    • 2011
  • This study aimed to evaluate the performance of diffusion barriers in order to prevent fuel-cladding chemical interaction (FCCI) between the metallic fuels and the cladding materials, a potential hazard for nuclear fuel in sodium-cooled fast reactors. In order to prevent FCCI, Zr or V metal is deposited on the ferritic-martensitic stainless steel surface by physical vapor deposition with a thickness up to $5{\mu}m$. The diffusion couple tests using uranium alloy (U-10Zr) and a rare earth metal such as Ce-La alloy and Nd were performed at temperatures between 660~800$^{\circ}C$. Microstructural analysis using SEM was carried out over the coupled specimen. The results show that significant interdiffusion and an associated eutectic reaction ocurred in the specimen without a diffusion barrier. However, with the exception of the local dissolution of the Zr layer in the Ce-La alloy, the specimens deposited with Zr and V exhibited superior eutectic resistance to the uranium alloy and rare earth metal.

Fabrication of Thin Solid Oxide Film Fuel Cells

  • Jee, Young-Seok;Chang, Ik-Whang;Son, Ji-Won;Lee, Jong-Ho;Kang, Sang-Kyun;Cha, Suk-Won
    • Journal of the Korean Ceramic Society
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    • v.47 no.1
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    • pp.82-85
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    • 2010
  • Recently, thin film processes for oxides and metal deposition, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), have been widely adapted to fabricate solid oxide fuel cells (SOFCs). In this paper, we presented two research area of the use of such techniques. Gadolinium doped ceria (GDC) showed high ionic conductivity and could guarantee operation at low temperature. But the electron conductivity at low oxygen partial pressure and the weak mechanical property have been significant problems. To solve these issues, we coated GDC electrolyte with a nano scale yittria-doped stabilized zirconium (YSZ) layer via atomic layer deposition (ALD). We expected that the thin YSZ layer could have functions of electron blocking and preventing ceria from the reduction atmosphere. Yittria-doped barium zirconium (BYZ) has several orders higher proton conductivity than oxide ion conductor as YSZ and also has relatively high chemical stability. The fabrication processes of BYZ is very sophisticated, especially the synthesis of thin-film BYZ. We discussed the detailed fabrication processes of BYZ as well as the deposition of electrode. This paper discusses possible cell structure and process flow to accommodate such films.

A Study of Deposition Properties and Characteristics of $SiO_2$T film Grown by Remote Plasma-Enhanced Chemical Vapor Deposition (Remote PECVD 산화막의 증착특성 및 박막 특성 연구)

  • 정윤권;정문식;김흥락;권영규;강봉구
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.8
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    • pp.63-70
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    • 1992
  • Deposition properties and film characteristics of Remote PECVD silicon dioxide were investigated. Using $N_{2}O/SiH_{4}$, the effects of changing the process conditions` the pressure, the substrate temperature, and the gas mixing ration, on the film quality were observed. A comparison of film qualites of the Remote PECVD SiO$_2$ with that of a Direct PECVD SiO$_2$ was made. The experimental results show that the Remote PECVD SiO$_2$ has better electrical, physical, and annealing properties than the Direct PECVD oxide.

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Simultaneous Co-deposition of Zn-Mg Alloy Layers on Steel Strip by PVD Process

  • Kim, Tae-Yeob;Goodenough, Mark
    • Corrosion Science and Technology
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    • v.10 no.6
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    • pp.194-198
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    • 2011
  • This is the first release of an interim report on the development of coating technology of Zn-Mg alloy layers on steel strip by EML-PVD (electromagnetic levitation - physical vapor deposition) process in an air-to-air type continuous PVD pilot plant. It intends to introduce a basic principle of the EML-PVD process together with the high speed PVD pilot plant built in Posco. Due to the agitation effect provided by the high frequency induction coil, simultaneous evaporation of Zn and Mg from a droplet could produce alloy coating layers with Mg content of 6% to 12% depending on the composition of the droplet inside the coil. For its superior corrosion resistance, Zn-Mg alloy coated steel would be a very promising material for automotive, electrical appliances, and construction applications.

Sputtering Technology and Prospect for Transparent Conductive Thin Film (투명전도성 박막의 활용을 위한 스퍼터링 증착 기술과 전망)

  • Sangmo Kim;Kyung Hwan Kim
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.2
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    • pp.109-124
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    • 2023
  • For decades, sputtering as a physical vapor deposition (PVD) method has been a widely used technique for film coating processes. The sputtering enables oxides, metals, alloys, nitrides, etc to be deposited on a wide variety of substrates from silicon wafers to polymer substrates. Meanwhile, transparent conductive oxides (TCOs) have played important roles as electrodes in electrical applications such as displays, sensors, solar cells, and thin-film transistors. TCO films fabricated through a sputtering process have a higher quality leading to an improved device performance than other films prepared with other methods. In this review, we discuss the mechanism of sputtering deposition and detail the TCO materials. Related technologies (processing conditions, materials, and applications) are introduced for electrical applications.

Study on P-type in-situ doped Polysilicon Films (P형 in-situ 도핑 폴리실리콘 막질에 관한 연구)

  • Oh, Jung-Sup;Lee, Sang-Eun;Noh, Jin-Tae;Lee, Sang-Woo;Bae, Kyoung-Sung;Roh, Yong-Han
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.208-212
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    • 2008
  • This paper reports physical properties of in situ boron doped silicon films made from boron source gas and silane ($SiH_4$) gas in a conventional low-pressure chemical vapor deposition vertical furnace. If the p-type polysilicon is formed by boron implantation into undoped polysilicon, the plasma nitridation (PN) process is added on the oxide in order to suppress boron penetration that can be caused during the thermal treatments used in fabrication. In-situ boron doped polysilicon deposition can complete p-type polysilicon film with only one deposition process and need not the PN process, because there is not interdiffusion of dopant at the intermediate temperatures of the subsequent steps. Since in-situ boron doped polysilicon films have higher work function than that of n-type polysilicon and they are compatible with the underlying oxide, they may be promising materials for improving memory cell characteristics if we make its profit of these physical properties.

Fabrication and Characterization of an Antistiction Layer by PECVD (plasma enhanced chemical vapor deposition) for Metal Stamps (PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가)

  • Cha, Nam-Goo;Park, Chang-Hwa;Cho, Min-Soo;Kim, Kyu-Chae;Park, Jin-Goo;Jeong, Jun-Ho;Lee, Eung-Sug
    • Korean Journal of Materials Research
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    • v.16 no.4
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    • pp.225-230
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    • 2006
  • Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

Carbon Nanotube Synthesis and Growth Using Zeolite by Catalytic CVD and Applications

  • Zhao, Wei;Nam, Seo Dong;Pokhrel, Ashish;Gong, Jianghong;Kim, Ik Jin
    • Journal of the Korean Ceramic Society
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    • v.50 no.1
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    • pp.1-17
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    • 2013
  • Since their first discovery, carbon nanotubes (CNTs) have become a material central to the field of nanotechnology. Owing to their splendid physical, structural and chemical properties, they have the potential to impact a wide range of applications, including advanced ceramics, nanoelectronic devices, nanoscale sensors, solar cells, battery electrodes, and field emitters. This review summarizes the synthetic methods of preparing CNTs and focuses on the chemical vapor deposition (CVD) method, especially catalytic CVD. In order to stabilize and disperse the catalyst nanoparticles (NPs) during synthesis, zeolite was implemented as the template to support metal-containing NPs, so that both CNTs in the bulk and on a 2D substrate were successfully synthesized. Despite more challenges ahead, there is always hope for widespread ever-new applications for CNTs with the development of technology.