• Journal of the Korean Graphic Arts Communication Society
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• v.13 no.2
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• pp.47-53
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• 1995

Photosensitive resin of azide type is good for resolution and inner solvent, but it is really problem to development of practical use because fanctional groups of polymer has many hydrophilic radicals. By careful attention to this point, this study was investigated synthesis term, photo property and development property of composed photosensitive resin of azida type, it is to this effect. 1) H-NMR spectrum of compared DABCI showed amion redical by $\delta$6.0~6.1ppm to substitude for azide radical by amino radical by $\delta$8.9~9.45ppm, and FT-IR absorption spectra showed the absorption bends at 2100cm. 2)FT-IR absorption spectra of PHS1-DAB, PHS2-DAB, CMM-DAB and CHM-DAB showed azida radical pick to be lost at after irradiation by UV light. 3) According to exposuer change of PHS1-DAB, PHS2-DAB, CMM-DAB and CHM-DAB, absorption maximum value of UV spectrum change was 280nm. 4) to compared relative sensitivity of compared photosensitive resin, PHS2-DAB was the best and to compared insolubility rate of compared photosensitive resin, CMM-DAB was the lower. 5)Solubility if NaOH was the best by 1.0mol/$\ell$ and solubility of developing solution of ethanol to water was it in the ratio of 4 to 1.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.6
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• pp.1385-1391
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• 2012

The authenticity of a document is recognized only when sealing on the document can be recognized to be the same as the original seal of a person who drew up the document. But forge in various ways is prevalent; forge through stamp-copy, forge through photocopying, forge through computer seal sculpture machine, forge through photosensitive resin, etc. Among the methods above, a method of making a forged seal with photosensitive resin panels, which is one of the easiest forging methods, enables making a forged seal the same as the original seal through the work of projecting ultraviolet rays on a resin panel on which negative film is stuck after making it using the original seal. But as research into this reality has not been sufficiently carried on, it is difficult to identify forged sealing through photosensitive resin seals, indeed. For this reason, unless regulations about making forged seals using resin machine for print are enforced, crimes related to forged seals using photosensitive resin are expected to increase in the future. Thus, after stamping 10 resin seals made based on an original seal carved of thick and thin strokes of characters, this paper intends to clarify that there are differences between original sealing and forged sealing through sealing identification method. Consequently, we verified the significant difference in the statistics between original sealing and forged sealing.

• Applied Chemistry for Engineering
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• v.1 no.2
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• pp.116-123
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• 1990

Synthesis and characterization of photosensitive orthonaphthoquinonediazide-sulfonyl derivatives were studied. These photoactive compounds underwent a UV induced transformation to the base-soluble photoproduct. The photoresists were prepared using these photoactive compounds with low molecular weight m-cresol novolacs as matrix resin. And photosensitive characteristics of the photoresists were studied. 3, 4, 5-Trihydroxy-benzophenone with bulky resonance structure increased the sensitivity and the solubility rate of the exposed region. The mixture of PAC and matrix resin having 3:8 weight ratio had the moderate rate of dissolution in the developer. The photoresist using these conditions showed the best snsitivity and contrast under the fixed conditions.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.639-642
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• 2002

A new PDP barrier rib formation technique was investigated utilizing transparent soft maid made of silicon resin. Transparent soft mold was fabricated by pouring a silicone resin into the base mold made with photosensitive glass. The photosensitive barrier rib paste was coated on the glass substrate and dried in a 90 $^{\circ}C$ convection oven for 20min. The transparent soft mold was pressed on top of the semi-dry barrier rib layer and then irradiated with a UV lamp to a total dose of $900{\sim}1000mJ/cm^2$ The soft maid was then removed from the pressed barrier rib by winding up and fine pattern of barrier rib was obtained. The photosensitive barrier rib paste makes the demolding easy due to reduced interfacial forces and shrinking of paste materials.

• Journal of the Korean Applied Science and Technology
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• v.14 no.2
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• pp.27-34
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• 1997

Naphthoquinone-1,2-diazide-5-sulfonyl [NDS]derivatives members of Quinone diazide compound that are utilizable as photoresist for printing plate were synthesized, and photoresist were prepared by mixing these derivatives with a matrix resin(PF, CF) at various weight ratios. Photosensitive characteristics of photoresist were studied by Gray scale method, and SEM to analyze if they can be used as photosensitive material in a printing plate. Experimental results showed using IR, UV, NDS derivatives were photoconverted and developer-soluble photoresist were produced. Photoresist in the mixing ratio of 1:4 of NDS[II] and CF resin gave rise to the highest dissolution rate. In addition, photoresist obtained at this condition resulted in the most superior sensitivity.

• Applied Chemistry for Engineering
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• v.20 no.6
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• pp.622-627
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• 2009

Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Journal of the Korean Applied Science and Technology
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• v.13 no.3
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• pp.145-153
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• 1996

Naphthoquinone-1,2-diazide-5-sulfonyl[NDAS] derivatives members of quinone diazide compound that are utilizable as photosensitive polymer material were synthesized, and photoresist were prepared by mixing these derivatives with m-cresol novolak(a matrix resin) at various weight ratios. Photosensitive characteristics of photoresist were studied by examining UV and IR, relative sensitivity using a Gray scale method, and SEM to analyze if they can be used as photosensitive material in printing process. Experimental results showed that, by UV, NDAS derivatives were photoconverted and developer-soluble photoresist were produced. The mixing ratio of 1:4(by mass) of NDAS+p-ydroxybenzophenone+sensitizer and m-cresol novolak gave rise to the highest dissolution rate. In addition, photoresist obtained at this condition resulted in the most superior sensitivity and contrast.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.180-186
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• 2020

In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.