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http://dx.doi.org/10.33961/jecst.2019.00549

3D Printed Flexible Cathode Based on Cu-EDTA that Prepared by Molecular Precursor Method and Microwave Processing for Electrochemical Machining  

Yan, Binggong (Fujian Key Laboratory of Special Energy Manufacturing, Xiamen Key Laboratory of Digital Vision Measurement, Huaqiao University)
Song, Xuan (Fujian Key Laboratory of Special Energy Manufacturing, Xiamen Key Laboratory of Digital Vision Measurement, Huaqiao University)
Tian, Zhao (Fujian Key Laboratory of Special Energy Manufacturing, Xiamen Key Laboratory of Digital Vision Measurement, Huaqiao University)
Huang, Xiaodi (Fujian Key Laboratory of Special Energy Manufacturing, Xiamen Key Laboratory of Digital Vision Measurement, Huaqiao University)
Jiang, Kaiyong (Fujian Key Laboratory of Special Energy Manufacturing, Xiamen Key Laboratory of Digital Vision Measurement, Huaqiao University)
Publication Information
Journal of Electrochemical Science and Technology / v.11, no.2, 2020 , pp. 180-186 More about this Journal
Abstract
In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.
Keywords
LPKF-LDS; Cu-EDTA; Photosensitive Resin; Molecular Precursor Method; Flexible Cathode;
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